JPWO2019181525A1 - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
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- JPWO2019181525A1 JPWO2019181525A1 JP2020508179A JP2020508179A JPWO2019181525A1 JP WO2019181525 A1 JPWO2019181525 A1 JP WO2019181525A1 JP 2020508179 A JP2020508179 A JP 2020508179A JP 2020508179 A JP2020508179 A JP 2020508179A JP WO2019181525 A1 JPWO2019181525 A1 JP WO2019181525A1
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- semiconductor manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
ウエハ載置面を有し電極を内蔵したセラミック基板と、
前記セラミック基板のうち前記ウエハ載置面とは反対側の面に固着された金属製のベース部材と、
前記セラミック基板のうち前記ウエハ載置面とは反対側の面に設けられ、前記電極と接続された電極端子と、
前記ベース部材のうち前記電極端子と対向する位置に設けられた貫通孔と、
前記貫通孔の内周面に固着された絶縁スリーブと、
前記電極端子に可撓性のケーブルを介して接続されると共に前記絶縁スリーブ内に配置された状態で前記絶縁スリーブに固着され、別装置の端子と着脱可能に接続される半導体製造装置側端子と、
一端が前記電極端子に固着されると共に他端が前記半導体製造装置側端子に固着され、前記ケーブルを被覆する可撓性の絶縁チューブと、
前記電極端子のうち少なくとも前記絶縁チューブに被覆されていない部分を被覆する絶縁樹脂部材と、
を備えたものである。
Claims (7)
- ウエハ載置面を有し電極を内蔵したセラミック基板と、
前記セラミック基板のうち前記ウエハ載置面とは反対側の面に固着された金属製のベース部材と、
前記セラミック基板のうち前記ウエハ載置面とは反対側の面に設けられ、前記電極と接続された電極端子と、
前記ベース部材のうち前記電極端子と対向する位置に設けられた貫通孔と、
前記貫通孔の内周面に固着された絶縁スリーブと、
前記電極端子に可撓性のケーブルを介して接続されると共に前記絶縁スリーブ内に配置された状態で前記絶縁スリーブに固着され、別装置の端子と着脱可能に接続される半導体製造装置側端子と、
一端が前記電極端子に固着されると共に他端が前記半導体製造装置側端子に固着され、前記ケーブルを被覆する可撓性の絶縁チューブと、
前記電極端子のうち少なくとも前記絶縁チューブに被覆されていない部分を被覆する絶縁樹脂部材と、
を備えた半導体製造装置。 - 前記絶縁チューブの内径は、前記ケーブルの外径よりも大きい、
請求項1に記載の半導体製造装置。 - 前記絶縁チューブは、前記ケーブルを覆っている中央部が撓んで膨らんだ形状になっている、
請求項1又は2に記載の半導体製造装置。 - 前記絶縁スリーブの先端は、前記絶縁樹脂部材に達していない、
請求項1〜3のいずれか1項に記載の半導体製造装置。 - 前記絶縁チューブは、熱収縮チューブである、
請求項1〜4のいずれか1項に記載の半導体製造装置。 - 前記絶縁チューブは、前記貫通孔の軸方向に伸縮可能な材料で形成されているか、又は、前記貫通孔の軸方向に伸縮可能な構造に形成されている、
請求項1〜5のいずれか1項に記載の半導体製造装置。 - 前記ケーブルは、金属製の撚り線である、
請求項1〜6のいずれか1項に記載の半導体製造装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018055519 | 2018-03-23 | ||
JP2018055519 | 2018-03-23 | ||
PCT/JP2019/009028 WO2019181525A1 (ja) | 2018-03-23 | 2019-03-07 | 半導体製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019181525A1 true JPWO2019181525A1 (ja) | 2021-02-25 |
JP7026778B2 JP7026778B2 (ja) | 2022-02-28 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020508179A Active JP7026778B2 (ja) | 2018-03-23 | 2019-03-07 | 半導体製造装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11257703B2 (ja) |
JP (1) | JP7026778B2 (ja) |
KR (1) | KR102433151B1 (ja) |
CN (1) | CN111868912B (ja) |
TW (1) | TWI799533B (ja) |
WO (1) | WO2019181525A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7014821B2 (ja) * | 2018-01-29 | 2022-02-01 | 京セラ株式会社 | 試料保持具 |
US11610799B2 (en) | 2020-09-18 | 2023-03-21 | Applied Materials, Inc. | Electrostatic chuck having a heating and chucking capabilities |
CN114623635B (zh) * | 2021-05-17 | 2023-05-23 | 北京建筑大学 | 一种适用于正温环境的造雪机 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008098513A (ja) * | 2006-10-13 | 2008-04-24 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
JP2013191626A (ja) * | 2012-03-12 | 2013-09-26 | Ngk Insulators Ltd | 半導体製造装置及びその製法 |
JP2015207765A (ja) * | 2014-04-09 | 2015-11-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP2015228398A (ja) * | 2014-05-30 | 2015-12-17 | 日本特殊陶業株式会社 | 半導体製造装置用部品 |
JP2016143795A (ja) * | 2015-02-03 | 2016-08-08 | 日本特殊陶業株式会社 | 静電チャック |
Family Cites Families (9)
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JP2592308B2 (ja) * | 1988-09-30 | 1997-03-19 | 株式会社日立製作所 | 半導体パッケージ及びそれを用いたコンピュータ |
JP3658029B2 (ja) * | 1994-02-21 | 2005-06-08 | 株式会社ルネサステクノロジ | 接続装置およびその製造方法 |
AU724542B2 (en) | 1996-04-29 | 2000-09-28 | Procter & Gamble Company, The | Forced air convection oven process for finishing french fries |
US6151203A (en) * | 1998-12-14 | 2000-11-21 | Applied Materials, Inc. | Connectors for an electrostatic chuck and combination thereof |
JP2007258615A (ja) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | 静電チャック |
JP2010103321A (ja) * | 2008-10-24 | 2010-05-06 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
JP3181603U (ja) | 2012-12-03 | 2013-02-14 | 日本碍子株式会社 | 半導体製造装置 |
US9504195B2 (en) * | 2014-05-16 | 2016-11-22 | Tyco Electronics Corporation | Cover assemblies, kits and methods for covering electrical cables and connections |
JP6517754B2 (ja) * | 2016-07-12 | 2019-05-22 | 日本碍子株式会社 | 配線基板接合体 |
-
2019
- 2019-03-07 KR KR1020207026712A patent/KR102433151B1/ko active IP Right Grant
- 2019-03-07 WO PCT/JP2019/009028 patent/WO2019181525A1/ja active Application Filing
- 2019-03-07 CN CN201980019242.6A patent/CN111868912B/zh active Active
- 2019-03-07 JP JP2020508179A patent/JP7026778B2/ja active Active
- 2019-03-13 TW TW108108400A patent/TWI799533B/zh active
-
2020
- 2020-09-16 US US17/022,396 patent/US11257703B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008098513A (ja) * | 2006-10-13 | 2008-04-24 | Ngk Spark Plug Co Ltd | 静電チャック装置 |
JP2013191626A (ja) * | 2012-03-12 | 2013-09-26 | Ngk Insulators Ltd | 半導体製造装置及びその製法 |
JP2015207765A (ja) * | 2014-04-09 | 2015-11-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP2015228398A (ja) * | 2014-05-30 | 2015-12-17 | 日本特殊陶業株式会社 | 半導体製造装置用部品 |
JP2016143795A (ja) * | 2015-02-03 | 2016-08-08 | 日本特殊陶業株式会社 | 静電チャック |
Also Published As
Publication number | Publication date |
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US11257703B2 (en) | 2022-02-22 |
US20200411357A1 (en) | 2020-12-31 |
WO2019181525A1 (ja) | 2019-09-26 |
TWI799533B (zh) | 2023-04-21 |
JP7026778B2 (ja) | 2022-02-28 |
CN111868912A (zh) | 2020-10-30 |
KR20200121350A (ko) | 2020-10-23 |
CN111868912B (zh) | 2023-11-03 |
KR102433151B1 (ko) | 2022-08-16 |
TW201941358A (zh) | 2019-10-16 |
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