JPWO2018051430A1 - 半導体レーザモジュールおよび3次元積層造形装置 - Google Patents
半導体レーザモジュールおよび3次元積層造形装置 Download PDFInfo
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Abstract
Description
複数の半導体レーザ素子と、
光ファイバーと、
前記半導体レーザ素子から出射されたレーザ光を前記光ファイバーへと集光する集光手段と、
前記レーザ素子と、前記集光手段と、前記光ファイバーとが実装された筐体と、
を含む半導体レーザモジュールであって、
前記レーザ素子と、前記筐体の天板との間に配置され、前記天板との間に空隙が形成されるように前記天板に設置された少なくとも1つの薄板を有する。
上記半導体レーザモジュールを用いた3次元積層造形装置である。
本発明の第1実施形態としての半導体レーザモジュール100について、図1を用いて説明する。半導体レーザモジュール100は、半導体レーザ素子から出射したレーザ光を集光レンズで集光して光ファイバーに入射させてモジュールの外部の標的に照射する装置である。
図3Aおよび図3Bを参照して、本実施形態に係る半導体レーザモジュールの前提技術の半導体レーザモジュール300について説明する。図3Aは、本実施形態に係る半導体レーザモジュールの前提技術の半導体レーザモジュール300の構成を示す斜視模式図である。図3Bは、本実施形態に係る半導体レーザモジュールの前提技術の半導体レーザモジュール300の構成を示す側面模式図である。
次に本実施形態に係る半導体レーザモジュールについて、図1乃至図2Gを用いて説明する。図1は、本実施形態に係る半導体レーザモジュール100の構成を説明する側面模式図である。
次に本発明の第2実施形態に係る3次元積層造形装置について、図4を用いて説明する。図4は、本実施形態に係る3次元積層造形装置400の構成を説明するための図である。なお、図4では、ここに示した構成以外の構成については、図が煩雑になるのを避けるため適宜省略している。なお、3次元積層造形装置400は、LMD(Laser Metal Deposition)型の3次元積層造形装置を例に説明をするが、パウダーベッド型の3次元積層造形装置であってもよい。
以上、実施形態を参照して本願発明を説明したが、本願発明は上記実施形態に限定されるものではない。本願発明の構成や詳細には、本願発明のスコープ内で当業者が理解し得る様々な変更をすることができる。また、それぞれの実施形態に含まれる別々の特徴を如何様に組み合わせたシステムまたは装置も、本発明の範疇に含まれる。
複数の半導体レーザ素子と、
光ファイバーと、
前記半導体レーザ素子から出射されたレーザ光を前記光ファイバーへと集光する集光手段と、
前記半導体レーザ素子と、前記集光手段と、前記光ファイバーとが実装された筐体と、
を含む半導体レーザモジュールであって、
前記半導体レーザ素子と、前記筐体の天板との間に配置され、前記天板との間に前記レーザ光による熱を遮蔽するための空隙が形成されるように前記天板に設置された少なくとも1つの薄板を有する。
Claims (9)
- 複数の半導体レーザ素子と、
光ファイバーと、
前記半導体レーザ素子から出射されたレーザ光を前記光ファイバーへと集光する集光手段と、
前記レーザ素子と、前記集光手段と、前記光ファイバーとが実装された筐体と、
を含む半導体レーザモジュールであって、
前記レーザ素子と、前記筐体の天板との間に配置され、前記天板との間に空隙が形成されるように前記天板に設置された少なくとも1つの薄板を有する半導体レーザモジュール。 - 前記薄板は、少なくとも一端部に折曲部を有し、前記折曲部を介して前記天板に設置される請求項1に記載の半導体レーザモジュール。
- 前記薄板は、前記半導体レーザ素子と対向する位置に設けられている請求項1または2に記載の半導体レーザモジュール。
- 前記薄板は、前記天板の少なくとも一部を覆う大きさである請求項1乃至3のいずれか1項に記載の半導体レーザモジュール。
- 前記薄板は、前記複数の半導体レーザ素子を覆う大きさである請求項1乃至3のいずれか1項に記載の半導体レーザモジュール。
- 前記薄板は、矩形形状、円形形状または多角形形状である請求項1乃至5のいずれか1項に記載の半導体レーザモジュール。
- 前記薄板の厚みは、0.1mm〜0.2mmである請求項1乃至6のいずれか1項に記載の半導体レーザモジュール。
- 前記薄板は、アルミニウム、である請求項1乃至7のいずれか1項に記載の半導体レーザモジュール。
- 請求項1乃至8のいずれか1項に記載の半導体レーザモジュールを用いた3次元積層造形装置。
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