CN112072458A - 底座、光发射模组、3d识别装置及智能终端 - Google Patents
底座、光发射模组、3d识别装置及智能终端 Download PDFInfo
- Publication number
- CN112072458A CN112072458A CN201910502190.XA CN201910502190A CN112072458A CN 112072458 A CN112072458 A CN 112072458A CN 201910502190 A CN201910502190 A CN 201910502190A CN 112072458 A CN112072458 A CN 112072458A
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- China
- Prior art keywords
- light
- base
- heat
- light source
- plastic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 34
- 239000003292 glue Substances 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 239000000463 material Substances 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Human Computer Interaction (AREA)
- Vascular Medicine (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910502190.XA CN112072458A (zh) | 2019-06-11 | 2019-06-11 | 底座、光发射模组、3d识别装置及智能终端 |
PCT/CN2019/112889 WO2020248465A1 (zh) | 2019-06-11 | 2019-10-24 | 底座、光发射模组、3d识别装置及智能终端 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910502190.XA CN112072458A (zh) | 2019-06-11 | 2019-06-11 | 底座、光发射模组、3d识别装置及智能终端 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112072458A true CN112072458A (zh) | 2020-12-11 |
Family
ID=73657831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910502190.XA Pending CN112072458A (zh) | 2019-06-11 | 2019-06-11 | 底座、光发射模组、3d识别装置及智能终端 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112072458A (zh) |
WO (1) | WO2020248465A1 (zh) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI287300B (en) * | 2005-06-30 | 2007-09-21 | Lite On Technology Corp | Semiconductor package structure |
TW200841541A (en) * | 2007-04-04 | 2008-10-16 | Amtran Technology Co Ltd | Package structure of optical-element |
CN104303380A (zh) * | 2012-05-01 | 2015-01-21 | 三菱电机株式会社 | 半导体封装件 |
JP6217706B2 (ja) * | 2015-07-29 | 2017-10-25 | 日亜化学工業株式会社 | 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置 |
CN105042377A (zh) * | 2015-08-07 | 2015-11-11 | 苏州晶雷光电照明科技有限公司 | 一种具有散热片的led灯 |
EP3324229B1 (en) * | 2016-09-14 | 2019-12-18 | Technology Research Association for Future Additive Manufacturing | Semiconductor laser module and additive manufacturing device |
CN209046740U (zh) * | 2018-11-13 | 2019-06-28 | 南昌欧菲生物识别技术有限公司 | 光电模组、深度获取组件及电子装置 |
-
2019
- 2019-06-11 CN CN201910502190.XA patent/CN112072458A/zh active Pending
- 2019-10-24 WO PCT/CN2019/112889 patent/WO2020248465A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2020248465A1 (zh) | 2020-12-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201211 |
|
WD01 | Invention patent application deemed withdrawn after publication |