JPWO2018016489A1 - 樹脂組成物、積層板及び多層プリント配線板 - Google Patents
樹脂組成物、積層板及び多層プリント配線板 Download PDFInfo
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- JPWO2018016489A1 JPWO2018016489A1 JP2018528553A JP2018528553A JPWO2018016489A1 JP WO2018016489 A1 JPWO2018016489 A1 JP WO2018016489A1 JP 2018528553 A JP2018528553 A JP 2018528553A JP 2018528553 A JP2018528553 A JP 2018528553A JP WO2018016489 A1 JPWO2018016489 A1 JP WO2018016489A1
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Abstract
Description
[1](A)飽和又は不飽和の2価の炭化水素基を有するマレイミド化合物と、熱可塑性樹脂と、を含有する樹脂組成物。
[2]前記炭化水素基の炭素数が8〜100である、[1]に記載の樹脂組成物。
[3]前記炭化水素基が下記式(II)で表される基である、[1]又は[2]に記載の樹脂組成物。
[5]前記少なくとも2つのイミド結合を有する2価の基が、下記式(I)で表される基である、[4]に記載の樹脂組成物。
[7]前記(B)芳香族マレイミド化合物が下記の式(VI)で表される化合物である、[6]に記載の樹脂組成物。
[9][1]〜[8]のいずれかに記載の樹脂組成物の硬化物を含む樹脂層と、導体層とを有する積層板。
[10][1]〜[8]のいずれかに記載の樹脂組成物の硬化物を含む樹脂層と、回路層とを備える、多層プリント配線板。
本明細書において、高周波領域とは、0.3GHz〜300GHzの領域を指し、特に3GHz〜300GHzを指すものとする。本明細書において、「〜」を用いて示された数値範囲は、「〜」の前後に記載される数値をそれぞれ最小値及び最大値として含む範囲を示す。本明細書に段階的に記載されている数値範囲において、ある段階の数値範囲の上限値又は下限値は、他の段階の数値範囲の上限値又は下限値に置き換えてもよい。本明細書に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。「A又はB」とは、A及びBのどちらか一方を含んでいればよく、両方とも含んでいてもよい。
本実施形態の樹脂組成物は、(A)飽和又は不飽和の2価の炭化水素基を有するマレイミド化合物と、熱可塑性樹脂と、を含有する。
本実施形態に係る飽和又は不飽和の2価の炭化水素基を有するマレイミド化合物を(A)成分ということがある。(A)成分は、(a)マレイミド基及び(c)飽和又は不飽和の2価の炭化水素基を有する化合物である。(a)マレイミド基を構造(a)といい、(c)飽和又は不飽和の2価の炭化水素基を構造(c)ということがある。(A)成分を用いることで、高周波特性及び導体との高い接着性を有する樹脂組成物を得ることができる。
ポンプ:L−6200型[株式会社日立ハイテクノロジーズ製]
検出器:L−3300型RI[株式会社日立ハイテクノロジーズ製]
カラムオーブン:L−655A−52[株式会社日立ハイテクノロジーズ製]
ガードカラム及びカラム:TSK Guardcolumn HHR−L+TSKgel G4000HHR+TSKgel G2000HHR[すべて東ソー株式会社製、商品名]
カラムサイズ:6.0×40mm(ガードカラム)、7.8×300mm(カラム)
溶離液:テトラヒドロフラン
試料濃度:30mg/5mL
注入量:20μL
流量:1.00mL/分
測定温度:40℃
本実施形態の樹脂組成物には、(B)芳香族マレイミド化合物を含有してもよい。本実施形態に係る(B)芳香族マレイミド化合物を(B)成分ということがある。(B)成分は、(A)成分とは異なるマレイミド化合物である。なお、(A)成分及び(B)成分の双方に該当し得る化合物は、(A)成分に帰属するものとするが、(A)成分及び(B)成分の双方に該当し得る化合物を2種類以上含む場合、そのうち1つを(A)成分、その他の化合物を(B)成分と帰属するものとする。(B)成分を用いることで、樹脂組成物は、特に低熱膨張特性に優れるものとなる。すなわち、本実施形態の樹脂組成物は、(A)成分と(B)成分とを併用することにより、良好な誘電特性を維持しつつ、低熱膨張特性等を更に向上させることができる。この理由として、(A)成分と(B)成分とを含有する樹脂組成物から得られる硬化物は、低誘電特性を備える(A)成分からなる構造単位と、低熱膨張である(B)成分からなる構造単位とを備えるポリマーを含有するためだと推測される。
本実施形態に係る樹脂組成物には、ジアミン化合物を更に含有してもよい。ジアミン化合物は特に限定されないが、例えば、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノ−3,3’−ジメチル−ジフェニルメタン、2,2’−ジメチル−4,4’−ジアミノビフェニル、2,2−ビス(4−(4−アミノフェノキシ)フェニル)プロパン、4,4’−[1,3−フェニレンビス(1−メチルエチリデン)]ビスアニリン、4,4’−[1,4−フェニレンビス(1−メチルエチリデン)]ビスアニリン、1,3−ビス[2−(4−アミノフェニル)−2−プロピル]ベンゼン等が挙げられる。これらは1種類を単独で用いても、2種類以上を併用してもよい。
本実施形態に係る樹脂組成物は、(A)成分の硬化を促進するための触媒を更に含有してもよい。触媒の含有量は特に限定されないが、樹脂組成物の全質量に対して0.1〜5質量%であってもよい。触媒としては、例えば、過酸化物、アゾ化合物等を用いることができる。
本実施形態の樹脂組成物は、樹脂フィルムの取扱い性を高める観点から、熱可塑性樹脂を含有する。熱可塑性樹脂の種類は特に限定されず、分子量も限定されないが、(A)成分との相溶性をより高める点から、数平均分子量(Mn)が200〜60000であることが好ましい。
熱可塑性エラストマーは、これらの反応性官能基の中でも、金属箔との密着性の観点から、エポキシ基、水酸基、カルボキシ基、アミノ基又はアミド基を有することが好ましく、耐熱性及び絶縁信頼性の観点から、エポキシ基、水酸基又はアミノ基を有することがより好ましい。
本実施形態の樹脂組成物は、無機充填剤を更に含有してもよい。任意に適切な無機充填剤を含有させることで、樹脂組成物の低熱膨張特性、高弾性率性、耐熱性、難燃性等を向上させることができる。無機充填剤としては特に制限されないが、例えば、シリカ、アルミナ、酸化チタン、マイカ、ベリリア、チタン酸バリウム、チタン酸カリウム、チタン酸ストロンチウム、チタン酸カルシウム、炭酸アルミニウム、水酸化マグネシウム、水酸化アルミニウム、ケイ酸アルミニウム、炭酸カルシウム、ケイ酸カルシウム、ケイ酸マグネシウム、窒化ケイ素、窒化ホウ素、焼成クレー、タルク、ホウ酸アルミニウム、炭化ケイ素等が挙げられる。これらは1種類を単独で用いても、2種類以上を併用してもよい。
本実施形態の樹脂組成物には、難燃剤を更に配合してもよい。難燃剤としては特に限定されないが、臭素系難燃剤、リン系難燃剤、金属水酸化物等が好適に用いられる。
本実施形態では、上記の樹脂組成物を用いて、樹脂フィルムを製造することができる。なお、樹脂フィルムとは未硬化又は半硬化のフィルム状の樹脂組成物を指す。
本実施形態に係るプリプレグは、例えば、本実施形態の樹脂組成物を補強基材である繊維基材に塗工し、塗工された樹脂組成物を乾燥させて得ることができる。また、本実施形態のプリプレグは、繊維基材を本実施形態の樹脂組成物に含浸した後、含浸された樹脂組成物を乾燥させて得てもよい。具体的には、樹脂組成物が付着した繊維基材を、乾燥炉中で通常、80〜200℃の温度で、1〜30分間加熱乾燥することで、樹脂組成物が半硬化したプリプレグを得られる。良好な成形性の観点からは、繊維基材に対する樹脂組成物の付着量は、乾燥後のプリプレグ中の樹脂含有率として30〜90質量%となるように塗工又は含浸することが好ましい。
本実施形態によれば、上述の樹脂組成物の硬化物を含む樹脂層と、導体層とを有する積層板を提供することができる。例えば、上記樹脂フィルム又は上記プリプレグを用い、金属張積層板を製造することができる。
本実施形態によれば、上述の樹脂組成物の硬化物を含む樹脂層と、回路層とを備える多層プリント配線板を提供することができる。回路層の数の上限値は特に限定されず、3層〜20層であってもよい。多層プリント配線板は、例えば、上記樹脂フィルム、プリプレグ又は金属張積層板を用いて製造することもできる。
下記手順に従って、各種の樹脂組成物を調製した。実施例1〜10及び比較例1〜2の樹脂組成物の調製に用いた各原材料の使用量(質量部)は、表1及び表2にまとめて示す。
(1)BMI−3000[Mw:約3000、Designer Molecules Inc.製、商品名]
(2)BMI−5000[Mw:約5000、Designer Molecules Inc.製、商品名]
(3)BMI−1000[ビス(4−マレイミドフェニル)メタン、大和化成工業株式会社製、商品名]
(4)BMI−4000[2,2−ビス(4−(4−マレイミドフェノキシ)フェニル)プロパン、大和化成工業株式会社製、商品名]
(5)ビスアニリンM[4,4’−[1,3−フェニレンビス(1−メチルエチリデン)]ビスアニリン、三井化学株式会社製、商品名]
(6)H1041[Mn6万未満のスチレン−ブタジエン共重合体の水素添加物、スチレン含有比率:30%、Mn:58000、旭化成株式会社製、商品名「タフテックH1041」]
(7)M1913[カルボン酸変性水添スチレン−ブタジエン共重合樹脂、旭化成株式会社製、商品名「タフテックM1913」]
(8)MP−10[アミン変性されたスチレン系熱可塑性エラストマー、旭化成株式会社製、商品名「タフテックMP−10」]
(9)EF−80[マレイン酸で変性されたスチレン系エラストマー、クレイバレーテクノロジーUSA社製、スチレン含有率=89質量%、商品名「SMA EF−80」]
(10)S202A[2,6−ジメチルフェノールから構成される重合体ポリフェニレンエーテル、旭化成株式会社製、商品名「ザイロンS202A」]
(11)Ricon130MA8[重量平均分子量5400、1分子中の無水マレイン酸基の数2、クレイバレー社製、商品名]
(12)PTFEフィラー[旭硝子株式会社製、商品名「フルオンL170J」]
(13)スチレン微粒子[(積水化成品工業社製、架橋ポリスチレンSBX、平均粒子径1.0μm]
(14)パーブチルP[α,α’−ビス(t−ブチルパーオキシ)ジイソプロピルベンゼン、日油株式会社製、商品名]
(15)シリカスラリー[球状溶融シリカ、表面処理:フェニルアミノシランカップリング剤(1質量%/スラリー中の全固形分)、分散媒:メチルイソブチルケトン(MIBK)、固形分濃度:70質量%、平均粒子径:0.5μm、密度:2.2g/cm3、株式会社アドマテックス製]
実施例及び比較例で得られた樹脂組成物を、コンマコーターを用いて、支持基材として厚さ38μmのPETフィルム(G2−38、帝人株式会社製)上に塗工し(乾燥温度:130℃)、半硬化状態の樹脂層を備えるPETフィルム付き半硬化樹脂フィルムを作製した。半硬化樹脂フィルム(樹脂層)の厚さは50μmであった。
実施例1〜10及び比較例1〜2の半硬化樹脂フィルムの外観及び取扱性を評価した。結果を表3及び表4に示す。
○:半硬化樹脂フィルムの表面にムラ、スジ等がない。
×:半硬化樹脂フィルムの表面にムラ、スジ等があり、表面平滑性に欠ける。
(1)25℃における表面のべたつき(タック)の有無。
(2)カッターナイフで切断した際の状態の樹脂割れ又は粉落ちの有無。
○:上記(1)及び(2)のいずれも無い。
×:上記(1)及び(2)のいずれか一方でも有る。
上述したPETフィルム付き半硬化樹脂フィルムを用い、以下の手順で多層プリント配線板を作製した。
回路パターンが形成されたガラス布基材エポキシ樹脂銅張積層板を内層回路基板とし、その両面に、PETフィルムを剥離した半硬化樹脂フィルムを1枚乗せ、その上に厚さ12μmの電解銅箔(日本電解株式会社製、商品名「YGP−12」)を配置した後、その上に鏡板を乗せ、200℃/3.0MPa/70分のプレス条件で加熱及び加圧成形して、4層プリント配線板を作製した。
○:回路にボイド、カスレが存在しない。
×:ボイド、カスレが存在する。
上述のPETフィルム付き半硬化樹脂フィルムからPETフィルムを剥離した樹脂フィルムを2枚重ねた後、その両面に、厚さ18μmのロープロファイル銅箔(M面Rz:3μm、古河電気工業株式会社製、商品名「F3−WS」)をその粗化面(M面)が接するように配置し、その上に鏡板を乗せ、200℃/3.0MPa/70分のプレス条件で加熱及び加圧成形して、両面金属張硬化樹脂フィルム(厚さ:0.1mm)を作製した。
耐折曲げ性は、両面金属張硬化樹脂フィルムの外層銅箔をエッチングしたものを180度折り曲げることにより、下記基準により評価した。
○:折り曲げた際、割れ又はクラックが発生しない。
×:折り曲げた際、割れ又はクラックが発生する。
誘電特性である比誘電率及び誘電正接は、両面金属張硬化樹脂フィルムの外層銅箔をエッチングし、長さ60mm、幅2mm、厚み約1mmに切断したものを試験片として空洞共振器摂動法により測定した。測定器にはアジレントテクノロジー社製ベクトル型ネットワークアナライザE8364B、空洞共振器には株式会社関東電子応用開発製CP129(10GHz帯共振器)及びCP137(20GHz帯共振器)、測定プログラムにはCPMA−V2をそれぞれ使用した。条件は、周波数10GHz、測定温度25℃とした。
熱膨張係数(板厚方向)は、両面金属張硬化樹脂フィルムの両面の銅箔をエッチングし、5mm角に切断したものを試験片として、熱機械分析装置TMA(TAインスツルメント社製、Q400)(温度範囲:30〜150℃、荷重:5g)により、IPC規格(IPC−TM−650 2.4.24)に準拠して測定した。
銅箔引きはがし強さは、銅張積層板試験規格JIS−C−6481に準拠して測定した。測定温度は25℃とした。
はんだ耐熱性は、両面金属張硬化樹脂フィルムの片側の銅箔をエッチングし、50mm角に切断したものを試験片として、その常態及びプレッシャークッカーテスト(PCT)装置(条件:121℃、2.2気圧)において、所定時間(1、3、5時間)処理した後のものを288℃の溶融はんだ上に20秒間フロートし、処理時間が異なる硬化樹脂フィルムのそれぞれの外観を下記基準により目視で評価した。同一の処理時間について3枚の試験片の評価を行い、下記基準で「○」であったものの枚数を表3及び表4に示す。なお、表3及び表4においては、1時間の処理を行ったものをPCT−1hと表記し、3時間の処理を行ったものをPCT−3hと表記し、5時間の処理を行ったものをPCT−5hと表記する。
○:フィルム内部及びフィルムと銅箔間に膨れ又はミーズリングの発生が認められない。
×:フィルム内部及びフィルムと銅箔間に膨れ又はミーズリングの発生が見られる。
Claims (10)
- (A)飽和又は不飽和の2価の炭化水素基を有するマレイミド化合物と、熱可塑性樹脂と、を含有する樹脂組成物。
- 前記炭化水素基の炭素数が8〜100である、請求項1に記載の樹脂組成物。
- 前記(A)飽和又は不飽和の2価の炭化水素基を有するマレイミド化合物が、少なくとも2つのイミド結合を有する2価の基を更に有する、請求項1〜3のいずれか一項に記載の樹脂組成物。
- マレイミド基が芳香環に結合した構造を有する(B)芳香族マレイミド化合物を更に含有する、請求項1〜5のいずれか一項に記載の樹脂組成物。
- 前記(B)芳香族マレイミド化合物が下記式(VI)で表される化合物である、請求項6に記載の樹脂組成物。
- 前記(A)飽和又は不飽和の2価の炭化水素基を有するマレイミド化合物の重量平均分子量が、500〜10000である、請求項1〜7のいずれか一項に記載の樹脂組成物。
- 請求項1〜8のいずれか一項に記載の樹脂組成物の硬化物を含む樹脂層と、導体層とを有する、積層板。
- 請求項1〜8のいずれか一項に記載の樹脂組成物の硬化物を含む樹脂層と、回路層とを備える、多層プリント配線板。
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TWI769169B (zh) * | 2016-07-05 | 2022-07-01 | 日商昭和電工材料股份有限公司 | 樹脂組成物、樹脂膜、積層板、多層印刷配線板及多層印刷配線板的製造方法 |
US10707152B2 (en) * | 2017-01-16 | 2020-07-07 | Innolux Corporation | High-frequency device and manufacturing method thereof |
JP7316572B2 (ja) * | 2018-03-28 | 2023-07-28 | パナソニックIpマネジメント株式会社 | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
US20220174814A1 (en) * | 2019-03-18 | 2022-06-02 | Corning Incorporated | Composites for high-frequency printed circuit boards and methods of making |
CN110283348B (zh) * | 2019-06-28 | 2021-10-26 | 东易日盛智能家居科技有限公司 | 一种防老化的高分子材料贴面纸及其制备方法 |
JP7188309B2 (ja) * | 2019-07-26 | 2022-12-13 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物及び半導体装置 |
JP2021070160A (ja) * | 2019-10-29 | 2021-05-06 | 昭和電工マテリアルズ株式会社 | フッ素樹脂基板積層体 |
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US20230299461A1 (en) * | 2020-07-03 | 2023-09-21 | Namics Corporation | Antenna-equipped semiconductor package and resin composition for antenna-equipped semiconductor package |
CN116056893A (zh) * | 2020-09-11 | 2023-05-02 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板 |
WO2022054862A1 (ja) * | 2020-09-11 | 2022-03-17 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
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JP2022058409A (ja) | 2022-04-12 |
TW201829584A (zh) | 2018-08-16 |
KR20210148373A (ko) | 2021-12-07 |
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CN109476923A (zh) | 2019-03-15 |
SG11201900449YA (en) | 2019-02-27 |
EP3489308A4 (en) | 2019-12-18 |
KR102332305B1 (ko) | 2021-11-26 |
US11377546B2 (en) | 2022-07-05 |
JP7003918B2 (ja) | 2022-01-21 |
KR20190031262A (ko) | 2019-03-25 |
US20190241729A1 (en) | 2019-08-08 |
WO2018016489A1 (ja) | 2018-01-25 |
CN109476923B (zh) | 2022-04-05 |
TWI806833B (zh) | 2023-07-01 |
EP3489308A1 (en) | 2019-05-29 |
TWI819323B (zh) | 2023-10-21 |
JP7468502B2 (ja) | 2024-04-16 |
TW202138450A (zh) | 2021-10-16 |
CN114479459A (zh) | 2022-05-13 |
KR102489990B1 (ko) | 2023-01-17 |
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