JPWO2021205675A1 - - Google Patents
Info
- Publication number
- JPWO2021205675A1 JPWO2021205675A1 JP2022514304A JP2022514304A JPWO2021205675A1 JP WO2021205675 A1 JPWO2021205675 A1 JP WO2021205675A1 JP 2022514304 A JP2022514304 A JP 2022514304A JP 2022514304 A JP2022514304 A JP 2022514304A JP WO2021205675 A1 JPWO2021205675 A1 JP WO2021205675A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020068399 | 2020-04-06 | ||
PCT/JP2020/027886 WO2021205675A1 (ja) | 2020-04-06 | 2020-07-17 | ビスマレイミド系接着剤組成物、硬化物、接着シート及びフレキシブルプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021205675A1 true JPWO2021205675A1 (ja) | 2021-10-14 |
Family
ID=78023091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022514304A Pending JPWO2021205675A1 (ja) | 2020-04-06 | 2020-07-17 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021205675A1 (ja) |
KR (1) | KR20220160027A (ja) |
WO (1) | WO2021205675A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024075744A1 (ja) * | 2022-10-05 | 2024-04-11 | 株式会社レゾナック | 樹脂組成物及びその製造方法、並びに樹脂組成物の硬化物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5338469B2 (ja) | 2008-05-14 | 2013-11-13 | 三菱瓦斯化学株式会社 | ポリイミドおよびポリアミック酸 |
JP2014045076A (ja) | 2012-08-27 | 2014-03-13 | Nippon Kayaku Co Ltd | 高周波回路用基板 |
JP2015032639A (ja) * | 2013-07-31 | 2015-02-16 | 日立化成株式会社 | 先塗布型熱硬化性アンダーフィル組成物、電子部品装置及び電子部品装置の製造方法 |
US20160237311A1 (en) * | 2013-09-26 | 2016-08-18 | Farhad G. Mizori | Low dielectric constant, low dielectric dissipation factor coatings, films and adhesives |
KR102592641B1 (ko) * | 2015-10-07 | 2023-10-24 | 헨켈 아게 운트 코. 카게아아 | 3d tsv 패키지용 제제 및 그의 용도 |
CN109476923B (zh) * | 2016-07-19 | 2022-04-05 | 昭和电工材料株式会社 | 树脂组合物、层叠板及多层印刷线路板 |
JP2019082598A (ja) * | 2017-10-31 | 2019-05-30 | 日本化薬株式会社 | ディスプレイ用封止剤 |
CN111886267B (zh) * | 2018-03-28 | 2023-08-25 | 松下知识产权经营株式会社 | 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 |
-
2020
- 2020-07-17 JP JP2022514304A patent/JPWO2021205675A1/ja active Pending
- 2020-07-17 WO PCT/JP2020/027886 patent/WO2021205675A1/ja active Application Filing
- 2020-07-17 KR KR1020227036317A patent/KR20220160027A/ko unknown
Also Published As
Publication number | Publication date |
---|---|
KR20220160027A (ko) | 2022-12-05 |
WO2021205675A1 (ja) | 2021-10-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230608 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240326 |