JPWO2015198940A1 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JPWO2015198940A1 JPWO2015198940A1 JP2016529400A JP2016529400A JPWO2015198940A1 JP WO2015198940 A1 JPWO2015198940 A1 JP WO2015198940A1 JP 2016529400 A JP2016529400 A JP 2016529400A JP 2016529400 A JP2016529400 A JP 2016529400A JP WO2015198940 A1 JPWO2015198940 A1 JP WO2015198940A1
- Authority
- JP
- Japan
- Prior art keywords
- connection layer
- intermediate connection
- fuse
- electrode
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000004020 conductor Substances 0.000 abstract description 59
- 239000010410 layer Substances 0.000 description 101
- 229910000679 solder Inorganic materials 0.000 description 27
- 238000000576 coating method Methods 0.000 description 13
- 239000011241 protective layer Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
- H01G2/16—Protection against electric or thermal overload with fusing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/10—Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
- H01H2085/0275—Structural association with a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fuses (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
2 電子部品
3、31、51、64 中間接続層
7a 第1のランド電極(ランド電極)
7b 第2のランド電極(ランド電極)
9、39、58、73 ヒューズ部
11a、32a、52a、65a 第1の接続電極(接続電極)
11b、32b、52b、65b 第2の接続電極(接続電極)
12a、35a、70a 第1の導通ビア(導通ビア)
12b 35b、70b 第2の導通ビア(導通ビア)
21a、42a、62a 第3の接続電極(接続電極)
21b、42b、62b 第4の接続電極(接続電極)
54、57 引出部
Claims (10)
- 複数のランド電極を有する基板と、該基板上に実装される電子部品とを備えた電子装置であって、
中間接続層が、前記基板と前記電子部品との間に介在され、
前記中間接続層は、前記ランド電極及び前記電子部品を電気的に接続する複数の接続電極が両主面に形成されると共に、前記接続電極のうちの少なくとも一つの接続電極は、内側にヒューズ部が形成されていることを特徴とする電子装置。 - 前記ヒューズ部は、前記中間接続層の長手方向に狭窄状に形成されていることを特徴とする請求項1記載の電子装置。
- 前記ヒューズ部は、前記中間接続層の短手方向に狭窄状に形成されていることを特徴とする請求項1記載の電子装置。
- 前記ヒューズ部は、前記接続電極中で金属ワイヤによりボンディング接続されて形成されていることを特徴とする請求項1乃至請求項3のいずれかに記載の電子装置。
- 前記ヒューズ部は、前記電子部品の対向面に形成されていることを特徴とする請求項1乃至請求項4のいずれかに記載の電子装置。
- 前記ヒューズ部は、前記基板の対向面に形成されていることを特徴とする請求項1乃至請求項5のいずれかに記載の電子装置。
- 導通ビアが前記中間接続層に形成されると共に、前記両主面に形成された接続電極は前記導通ビアを介して電気的に接続されていることを特徴とする請求項1乃至請求項6のいずれかに記載の電子装置。
- 前記中間接続層の一方の主面は、前記接続電極が、前記中間接続層の側面に引出部を有するように形成されると共に、
前記中間接続層の他方の主面は、前記接続電極が、前記中間接続層の側面に沿うように形成され、
前記一方の主面に形成された前記接続電極と、前記他方の主面に形成された前記接続電極とは、前記中間接続層の前記側面を介して電気的に接続されていることを特徴とする請求項1乃至請求項7のいずれかに記載の電子装置。 - 金属被膜が、前記中間接続層の端面に形成されていることを特徴とする請求項1乃至請求項7のいずれかに記載の電子装置。
- 金属被膜が、前記中間接続層の側面に形成されていることを特徴とする請求項1乃至請求項6又は8のいずれかに記載の電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014131175 | 2014-06-26 | ||
JP2014131175 | 2014-06-26 | ||
PCT/JP2015/067457 WO2015198940A1 (ja) | 2014-06-26 | 2015-06-17 | 電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015198940A1 true JPWO2015198940A1 (ja) | 2017-04-20 |
JP6588902B2 JP6588902B2 (ja) | 2019-10-09 |
Family
ID=54938026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016529400A Active JP6588902B2 (ja) | 2014-06-26 | 2015-06-17 | 電子装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11013117B2 (ja) |
JP (1) | JP6588902B2 (ja) |
KR (1) | KR20170009948A (ja) |
CN (1) | CN106465543A (ja) |
WO (1) | WO2015198940A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016171225A1 (ja) * | 2015-04-22 | 2016-10-27 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
JP6452001B2 (ja) * | 2016-06-08 | 2019-01-16 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
KR102538906B1 (ko) * | 2017-09-27 | 2023-06-01 | 삼성전기주식회사 | 복합 전자부품 및 그 실장 기판 |
JP7514112B2 (ja) * | 2020-05-28 | 2024-07-10 | Tdk株式会社 | 電子部品 |
KR102514549B1 (ko) * | 2020-10-26 | 2023-03-27 | 주식회사 유라코퍼레이션 | 인쇄회로기판 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6185133U (ja) * | 1984-11-07 | 1986-06-04 | ||
JPH0670938B2 (ja) * | 1988-12-05 | 1994-09-07 | 株式会社村田製作所 | ヒューズ付積層電子部品の製造方法 |
JPH08222831A (ja) * | 1995-02-09 | 1996-08-30 | Matsushita Electric Ind Co Ltd | 面実装部品の実装体 |
WO2013008549A1 (ja) * | 2011-07-11 | 2013-01-17 | 株式会社村田製作所 | 電子部品 |
WO2013008550A1 (ja) * | 2011-07-11 | 2013-01-17 | 株式会社村田製作所 | 電子部品 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894746A (en) * | 1987-06-06 | 1990-01-16 | Murata Manufacturing Co., Ltd. | Laminated capacitor with fuse function |
JPH0290507A (ja) | 1988-09-27 | 1990-03-30 | Nec Corp | 電子部品実装用保護回路部品 |
JPH0738359B2 (ja) * | 1989-01-10 | 1995-04-26 | 株式会社村田製作所 | ヒューズ付積層コンデンサ |
JPH0818285A (ja) | 1994-06-28 | 1996-01-19 | Matsushita Electric Ind Co Ltd | 表面実装部品の実装装置とその実装方法 |
JP3352360B2 (ja) * | 1996-07-19 | 2002-12-03 | シャープ株式会社 | 電力制御素子 |
JP4203666B2 (ja) * | 2004-12-27 | 2009-01-07 | パナソニック株式会社 | 電子部品実装方法および電子部品実装構造 |
US20070018774A1 (en) * | 2005-07-20 | 2007-01-25 | Dietsch Gordon T | Reactive fuse element with exothermic reactive material |
JP5113064B2 (ja) * | 2005-10-03 | 2013-01-09 | リッテルフューズ,インコーポレイティド | 筐体を形成するキャビティをもったヒューズ |
JP2010034272A (ja) * | 2008-07-29 | 2010-02-12 | Kyocera Corp | 積層コンデンサおよび積層コンデンサの等価直列抵抗値の調整方法 |
JP2010073805A (ja) * | 2008-09-17 | 2010-04-02 | Hitachi Automotive Systems Ltd | 回路基板及びその製造方法 |
US8957755B2 (en) * | 2008-11-25 | 2015-02-17 | Nanjing Sart Science & Technology Development Co., Ltd. | Multi-layer blade fuse and the manufacturing method thereof |
JP4666070B2 (ja) | 2008-12-24 | 2011-04-06 | ブラザー工業株式会社 | 現像装置 |
US8264816B2 (en) | 2009-08-24 | 2012-09-11 | Kemet Electronics Corporation | Externally fused and resistively loaded safety capacitor |
CN103094250B (zh) * | 2012-12-25 | 2015-12-23 | 杭州士兰集成电路有限公司 | 一种修调电阻及其制造方法 |
JP6079302B2 (ja) * | 2013-02-28 | 2017-02-15 | 株式会社デンソー | 電子部品及び電子制御装置 |
JP5880878B2 (ja) * | 2013-02-28 | 2016-03-09 | 株式会社デンソー | プリント基板、電子制御装置、及びプリント基板の検査方法 |
WO2016039260A1 (ja) * | 2014-09-09 | 2016-03-17 | 株式会社村田製作所 | 電子装置 |
WO2016171225A1 (ja) * | 2015-04-22 | 2016-10-27 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
JP6452001B2 (ja) * | 2016-06-08 | 2019-01-16 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
US10446488B1 (en) * | 2019-02-24 | 2019-10-15 | Manufacturing Networks Incorporated (MNI) | Vertically-connected packageless fuse device |
-
2015
- 2015-06-17 KR KR1020167035635A patent/KR20170009948A/ko not_active Application Discontinuation
- 2015-06-17 JP JP2016529400A patent/JP6588902B2/ja active Active
- 2015-06-17 WO PCT/JP2015/067457 patent/WO2015198940A1/ja active Application Filing
- 2015-06-17 CN CN201580033270.5A patent/CN106465543A/zh active Pending
-
2016
- 2016-12-02 US US15/367,501 patent/US11013117B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6185133U (ja) * | 1984-11-07 | 1986-06-04 | ||
JPH0670938B2 (ja) * | 1988-12-05 | 1994-09-07 | 株式会社村田製作所 | ヒューズ付積層電子部品の製造方法 |
JPH08222831A (ja) * | 1995-02-09 | 1996-08-30 | Matsushita Electric Ind Co Ltd | 面実装部品の実装体 |
WO2013008549A1 (ja) * | 2011-07-11 | 2013-01-17 | 株式会社村田製作所 | 電子部品 |
WO2013008550A1 (ja) * | 2011-07-11 | 2013-01-17 | 株式会社村田製作所 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JP6588902B2 (ja) | 2019-10-09 |
US11013117B2 (en) | 2021-05-18 |
WO2015198940A1 (ja) | 2015-12-30 |
US20170086297A1 (en) | 2017-03-23 |
CN106465543A (zh) | 2017-02-22 |
KR20170009948A (ko) | 2017-01-25 |
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