JPWO2014196444A1 - マイクロ波加熱用導電性樹脂組成物 - Google Patents
マイクロ波加熱用導電性樹脂組成物 Download PDFInfo
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 43
- 239000011342 resin composition Substances 0.000 title claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 27
- 239000011231 conductive filler Substances 0.000 claims abstract description 25
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 7
- 239000002923 metal particle Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000000034 method Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000010453 quartz Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 4
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 229940116411 terpineol Drugs 0.000 description 4
- 229910021383 artificial graphite Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- -1 isostearoyl titanate Chemical compound 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- MQPPCKJJFDNPHJ-UHFFFAOYSA-K aluminum;3-oxohexanoate Chemical compound [Al+3].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O MQPPCKJJFDNPHJ-UHFFFAOYSA-K 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002646 carbon nanobud Substances 0.000 description 1
- 229910021394 carbon nanobud Inorganic materials 0.000 description 1
- 239000002134 carbon nanofiber Substances 0.000 description 1
- 229910021400 carbon nanofoam Inorganic materials 0.000 description 1
- 239000008209 carbon nanofoam Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002116 nanohorn Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
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- H—ELECTRICITY
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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Abstract
Description
XA−5554(藤倉化成株式会社製導電性接着剤)7gに、UF−G10(昭和電工株式会社製、人造黒鉛粉末、平均粒径:4.5μm(カタログ値)、アスペクト比=10)0.7g(100質量部のXA−5554に対して10質量部のUF−G10)、テルピネオール(日本テルペン化学株式会社製Terpineol C) 1.08gを添加し、スパチュラでよく混合し印刷用原料(導電性樹脂組成物)とした。なお、XA−5554の組成は、三菱化学株式会社製エポキシ樹脂jER828(11.8質量部)、日本化薬株式会社製反応性希釈剤GOT[低粘度エポキシ樹脂](7.9質量部)、四国化成工業株式会社製硬化剤2P4MHZ(1.5質量部)、福田金属箔粉工業株式会社製銀粉AgC−GS(78.8質量部)である。UF−G10は概ね扁平状の粒子であり、SEM観察により任意に選択した20個の粒子の平均幅/平均厚みをアスペクト比として求めた。
表1に示すように、UF−G10およびテルピネオールの添加量を変更した以外は実施例1と同様にして印刷用原料(導電性樹脂組成物)を作製し、実施例1同様ポリイミドフィルムに回路パターンをスクリーン印刷後、マイクロ波加熱し、抵抗値の測定を行った。結果をまとめて表1に示した。
表1に示すように、炭素質材料としてUF−G10の代わりにカーボンナノチューブ(昭和電工製、VGCF(登録商標)−H、アスペクト比=40)を使用した以外は実施例4と同様にして印刷用原料(導電性樹脂組成物)を作製し、実施例4同様ポリイミドフィルムに回路パターンをスクリーン印刷後、マイクロ波加熱し、抵抗値の測定を行った。回路パターン部分の厚みは25μmであり、抵抗値は13.7Ωであった。VGCF−Hは概ね繊維状であり、SEM観察により任意に選択した20個の粒子の平均長さ/平均径をアスペクト比として求めた。
比較例4
試験片の加熱をマイクロ波加熱装置の代わりにオーブン(ESPEC社製DASK−TOP TYPE HI−TEMP.CHAMBER ST−110)を使用し、150℃、30分加熱した以外は実施例1と同様にして抵抗値の測定を行った。回路パターン部分の厚みは28μmであり、抵抗値は3.3Ωであった。
Claims (4)
- 炭素質ではない導電フィラーと、硬化性を有する絶縁性のバインダー樹脂と、前記炭素質ではない導電フィラーより体積固有抵抗値が高い炭素質材料とを含み、前記炭素質ではない導電フィラーと硬化性を有する絶縁性のバインダー樹脂の合計100質量部に対してアスペクト比が20以下の炭素質材料を1〜20質量部含むことを特徴とするマイクロ波加熱用導電性樹脂組成物。
- 前記炭素質材料が黒鉛粒子である請求項1に記載のマイクロ波加熱用導電性樹脂組成物。
- 前記炭素質ではない導電フィラーが、金、銀、銅、ニッケル、アルミニウム、パラジウムからなる群から選択される少なくとも一種の金属、または前記複数の金属の合金よりなる粒子または繊維、前記金属表面に金、パラジウム、銀のいずれかがめっきされた金属粒子または繊維、樹脂ボールにニッケル、金、パラジウム、銀のいずれかがめっきされた樹脂コアボール、のいずれかである請求項1または請求項2に記載のマイクロ波加熱用導電性樹脂組成物。
- 請求項1から請求項3のいずれか一項に記載のマイクロ波加熱用導電性樹脂組成物を基板にパターン印刷し導電性パターンを形成する工程と、前記導電性パターンにマイクロ波を照射して加熱・硬化する工程と、を有する導電パターンの形成方法。
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PCT/JP2014/064277 WO2014196444A1 (ja) | 2013-06-03 | 2014-05-29 | マイクロ波加熱用導電性樹脂組成物 |
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CN105722332B (zh) * | 2016-03-08 | 2017-03-22 | 上海安费诺永亿通讯电子有限公司 | 一种线路的制作方法 |
JP2018004830A (ja) * | 2016-06-29 | 2018-01-11 | 日本電信電話株式会社 | 高耐熱性光ファイバモジュールおよびその作製方法 |
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KR20150140762A (ko) | 2015-12-16 |
WO2014196444A1 (ja) | 2014-12-11 |
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TWI621134B (zh) | 2018-04-11 |
CN105283513B (zh) | 2018-05-01 |
TW201511039A (zh) | 2015-03-16 |
KR20180040738A (ko) | 2018-04-20 |
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