JPWO2014125584A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JPWO2014125584A1 JPWO2014125584A1 JP2015500032A JP2015500032A JPWO2014125584A1 JP WO2014125584 A1 JPWO2014125584 A1 JP WO2014125584A1 JP 2015500032 A JP2015500032 A JP 2015500032A JP 2015500032 A JP2015500032 A JP 2015500032A JP WO2014125584 A1 JPWO2014125584 A1 JP WO2014125584A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000012535 impurity Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 description 124
- 230000015556 catabolic process Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
- H01L27/0664—Vertical bipolar transistor in combination with diodes
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
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- H01—ELECTRIC ELEMENTS
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
Abstract
Description
Claims (5)
- IGBT領域とダイオード領域が同一半導体基板に形成されている半導体装置であって、
IGBT領域は、
半導体基板の表面に形成された第1導電型のボディ層と、
ボディ層の表面に部分的に形成されており、ボディ層より第1導電型の不純物濃度が高い、第1導電型のボディコンタクト層と、
ボディ層の表面に部分的に形成された、第2導電型のエミッタ層と、
ボディ層の裏面側に形成された第2導電型のドリフト層と、
ドリフト層の裏面側に形成された、第1導電型のコレクタ層と、
絶縁膜で覆われてトレンチの内部に配置されたゲート電極を備えており、
ダイオード領域からの距離が遠い箇所におけるボディコンタクト層が、ダイオード領域からの距離が近い箇所におけるボディコンタクト層よりも、大きく形成されている、半導体装置。 - トレンチピッチが広い箇所におけるボディコンタクト層が、トレンチピッチが狭い箇所におけるボディコンタクト層よりも、大きく形成されている、請求項1の半導体装置。
- トレンチ深さが深い箇所の近傍におけるボディコンタクト層が、トレンチ深さが浅い箇所の近傍におけるボディコンタクト層よりも、大きく形成されている、請求項1または2の半導体装置。
- IGBT領域と、ダイオード領域が同一半導体基板に形成されている半導体装置であって、
IGBT領域は、
半導体基板の表面に形成された第1導電型のボディ層と、
ボディ層の表面に部分的に形成されており、ボディ層より第1導電型の不純物濃度が高い、第1導電型のボディコンタクト層と、
ボディ層の表面に部分的に形成された、第2導電型のエミッタ層と、
ボディ層の裏面側に形成された第2導電型のドリフト層と、
ドリフト層の裏面側に形成された、第1導電型のコレクタ層と、
絶縁膜で覆われてトレンチの内部に配置されたゲート電極を備えており、
トレンチピッチが広い箇所におけるボディコンタクト層が、トレンチピッチが狭い箇所におけるボディコンタクト層よりも、大きく形成されている、半導体装置。 - IGBT領域と、ダイオード領域が同一半導体基板に形成されている半導体装置であって、
IGBT領域は、
半導体基板の表面に形成された第1導電型のボディ層と、
ボディ層の表面に部分的に形成されており、ボディ層より第1導電型の不純物濃度が高い、第1導電型のボディコンタクト層と、
ボディ層の表面に部分的に形成された、第2導電型のエミッタ層と、
ボディ層の裏面側に形成された第2導電型のドリフト層と、
ドリフト層の裏面側に形成された、第1導電型のコレクタ層と、
絶縁膜で覆われてトレンチの内部に配置されたゲート電極を備えており、
トレンチ深さが深い箇所の近傍におけるボディコンタクト層が、トレンチ深さが浅い箇所の近傍におけるボディコンタクト層よりも、大きく形成されている、半導体装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/053419 WO2014125584A1 (ja) | 2013-02-13 | 2013-02-13 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP5941214B2 JP5941214B2 (ja) | 2016-06-29 |
JPWO2014125584A1 true JPWO2014125584A1 (ja) | 2017-02-02 |
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JP2015500032A Expired - Fee Related JP5941214B2 (ja) | 2013-02-13 | 2013-02-13 | 半導体装置 |
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US (1) | US9379225B2 (ja) |
JP (1) | JP5941214B2 (ja) |
CN (1) | CN105027289B (ja) |
DE (1) | DE112013006664B4 (ja) |
WO (1) | WO2014125584A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112016000071T5 (de) | 2015-02-03 | 2017-03-23 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und Verfahren zu ihrer Herstellung |
JP6411929B2 (ja) * | 2015-03-24 | 2018-10-24 | トヨタ自動車株式会社 | Mosfet |
JP2018046249A (ja) * | 2016-09-16 | 2018-03-22 | トヨタ自動車株式会社 | 半導体装置 |
JP6598756B2 (ja) * | 2016-11-11 | 2019-10-30 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
JP6854654B2 (ja) * | 2017-01-26 | 2021-04-07 | ローム株式会社 | 半導体装置 |
JP7475251B2 (ja) | 2020-10-01 | 2024-04-26 | 三菱電機株式会社 | 半導体装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009122486A1 (ja) * | 2008-03-31 | 2009-10-08 | 三菱電機株式会社 | 半導体装置 |
JP2012043890A (ja) * | 2010-08-17 | 2012-03-01 | Denso Corp | 半導体装置 |
JP2013026534A (ja) * | 2011-07-25 | 2013-02-04 | Toyota Central R&D Labs Inc | 半導体装置 |
Family Cites Families (10)
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JPH02251177A (ja) * | 1989-03-24 | 1990-10-08 | Toyota Autom Loom Works Ltd | 静電誘導形半導体装置 |
US7135751B2 (en) * | 2003-07-25 | 2006-11-14 | Fuji Electric Device Technology Co., Ltd. | High breakdown voltage junction terminating structure |
JP4182986B2 (ja) * | 2006-04-19 | 2008-11-19 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP4893609B2 (ja) * | 2007-12-07 | 2012-03-07 | トヨタ自動車株式会社 | 半導体装置とその半導体装置を備えている給電装置の駆動方法 |
JP5045733B2 (ja) * | 2008-12-24 | 2012-10-10 | 株式会社デンソー | 半導体装置 |
US8716746B2 (en) | 2010-08-17 | 2014-05-06 | Denso Corporation | Semiconductor device |
DE102012200056A1 (de) | 2011-01-12 | 2012-07-12 | Denso Corporation | Halbleitervorrichtung und Verfahren zur Herstellung hiervon |
JP5287893B2 (ja) | 2011-02-08 | 2013-09-11 | 株式会社デンソー | 半導体装置およびその製造方法 |
US8384151B2 (en) | 2011-01-17 | 2013-02-26 | Infineon Technologies Austria Ag | Semiconductor device and a reverse conducting IGBT |
JP5745650B2 (ja) * | 2011-12-15 | 2015-07-08 | 株式会社日立製作所 | 半導体装置および電力変換装置 |
-
2013
- 2013-02-13 WO PCT/JP2013/053419 patent/WO2014125584A1/ja active Application Filing
- 2013-02-13 US US14/767,370 patent/US9379225B2/en active Active
- 2013-02-13 CN CN201380072378.6A patent/CN105027289B/zh active Active
- 2013-02-13 DE DE112013006664.5T patent/DE112013006664B4/de active Active
- 2013-02-13 JP JP2015500032A patent/JP5941214B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009122486A1 (ja) * | 2008-03-31 | 2009-10-08 | 三菱電機株式会社 | 半導体装置 |
JP2012043890A (ja) * | 2010-08-17 | 2012-03-01 | Denso Corp | 半導体装置 |
JP2013026534A (ja) * | 2011-07-25 | 2013-02-04 | Toyota Central R&D Labs Inc | 半導体装置 |
Also Published As
Publication number | Publication date |
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DE112013006664B4 (de) | 2019-07-04 |
US9379225B2 (en) | 2016-06-28 |
CN105027289A (zh) | 2015-11-04 |
US20160005844A1 (en) | 2016-01-07 |
DE112013006664T5 (de) | 2016-03-31 |
CN105027289B (zh) | 2017-05-31 |
WO2014125584A1 (ja) | 2014-08-21 |
JP5941214B2 (ja) | 2016-06-29 |
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