JPWO2012014723A1 - 光吸収基板の製造方法、及びそれを製造するための成形型の製造方法 - Google Patents
光吸収基板の製造方法、及びそれを製造するための成形型の製造方法 Download PDFInfo
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
Description
[光吸収基板の製造方法]
[成形型の製造方法]
Claims (6)
- 凹凸の表面を有する光吸収基板の製造方法であって、
基板にレーザ光を照射することにより、前記基板の表面に沿って二次元状に配列されるように、前記基板の内部に複数の改質領域を形成し、前記改質領域、及び前記改質領域から発生する亀裂の少なくとも一方を前記基板の前記表面に到達させる第1の工程と、
前記第1の工程の後、前記基板の前記表面にエッチング処理を施すことにより、前記基板の前記表面に凹凸を形成する第2の工程と、を備える、光吸収基板の製造方法。 - 前記第2の工程では、前記エッチング処理として異方性エッチング処理を施す、請求項1に記載の光吸収基板の製造方法。
- 前記第2の工程では、前記異方性エッチング処理を施した後、前記エッチング処理として等方性エッチング処理を施す、請求項2に記載の光吸収基板の製造方法。
- 前記第1の工程では、前記レーザ光の偏光方向に沿うように、前記基板の前記表面に沿って前記レーザ光を相対的に移動させる、請求項1〜3のいずれか一項に記載の光吸収基板の製造方法。
- 前記第1の工程では、前記基板の前記表面と前記レーザ光の集光点との距離を変化させて前記レーザ光を複数回照射することにより、前記改質領域のそれぞれを形成する、請求項1〜4のいずれか一項に記載の光吸収基板の製造方法。
- 凹凸の表面を有する光吸収基板を製造するための成形型の製造方法であって、
基板にレーザ光を照射することにより、前記基板の表面に沿って二次元状に配列されるように、前記基板の内部に複数の改質領域を形成し、前記改質領域、及び前記改質領域から発生する亀裂の少なくとも一方を前記基板の前記表面に到達させる第1の工程と、
前記第1の工程の後、前記基板の前記表面にエッチング処理を施すことにより、前記基板の前記表面に凹凸を形成する第2の工程と、
前記第2の工程の後、前記基板の前記表面の形状を転写することにより、前記成形型を得る第3の工程と、を備える、成形型の製造方法。
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JP2012526436A JP5508533B2 (ja) | 2010-07-26 | 2011-07-19 | 光吸収基板の製造方法、及びそれを製造するための成形型の製造方法 |
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JP2010167443 | 2010-07-26 | ||
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PCT/JP2011/066358 WO2012014723A1 (ja) | 2010-07-26 | 2011-07-19 | 光吸収基板の製造方法、及びそれを製造するための成形型の製造方法 |
JP2012526436A JP5508533B2 (ja) | 2010-07-26 | 2011-07-19 | 光吸収基板の製造方法、及びそれを製造するための成形型の製造方法 |
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JPWO2012014723A1 true JPWO2012014723A1 (ja) | 2013-09-12 |
JP5508533B2 JP5508533B2 (ja) | 2014-06-04 |
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US (1) | US9108269B2 (ja) |
EP (1) | EP2600411B1 (ja) |
JP (1) | JP5508533B2 (ja) |
KR (1) | KR101825238B1 (ja) |
CN (1) | CN103026497B (ja) |
TW (1) | TWI549307B (ja) |
WO (1) | WO2012014723A1 (ja) |
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CN103025473B (zh) * | 2010-07-26 | 2015-12-09 | 浜松光子学株式会社 | 基板加工方法 |
JP2015130367A (ja) * | 2012-04-24 | 2015-07-16 | 三菱電機株式会社 | 太陽電池およびその製造方法 |
JP2013251456A (ja) * | 2012-06-01 | 2013-12-12 | Denso Corp | 半導体装置の製造方法および半導体装置 |
US9814099B2 (en) * | 2013-08-02 | 2017-11-07 | Applied Materials, Inc. | Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same |
KR20170044143A (ko) * | 2014-09-16 | 2017-04-24 | 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 | 판 모양의 작업물 안으로 적어도 하나의 컷아웃부 또는 구멍을 도입하기 위한 방법 |
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DE102020114195A1 (de) | 2020-05-27 | 2021-12-02 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren zum Einbringen einer Ausnehmung in ein Substrat |
CN114566556A (zh) * | 2022-02-28 | 2022-05-31 | 安徽华晟新能源科技有限公司 | 一种半导体衬底层的处理方法、太阳能电池及其制备方法 |
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TW201230348A (en) | 2012-07-16 |
CN103026497B (zh) | 2016-08-03 |
US20120125887A1 (en) | 2012-05-24 |
EP2600411A1 (en) | 2013-06-05 |
KR101825238B1 (ko) | 2018-02-02 |
CN103026497A (zh) | 2013-04-03 |
KR20130098167A (ko) | 2013-09-04 |
WO2012014723A1 (ja) | 2012-02-02 |
EP2600411A4 (en) | 2017-01-04 |
TWI549307B (zh) | 2016-09-11 |
EP2600411B1 (en) | 2019-08-21 |
US9108269B2 (en) | 2015-08-18 |
JP5508533B2 (ja) | 2014-06-04 |
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