JPWO2011004756A1 - 配線板の保護膜用熱硬化性組成物 - Google Patents

配線板の保護膜用熱硬化性組成物 Download PDF

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Publication number
JPWO2011004756A1
JPWO2011004756A1 JP2011521896A JP2011521896A JPWO2011004756A1 JP WO2011004756 A1 JPWO2011004756 A1 JP WO2011004756A1 JP 2011521896 A JP2011521896 A JP 2011521896A JP 2011521896 A JP2011521896 A JP 2011521896A JP WO2011004756 A1 JPWO2011004756 A1 JP WO2011004756A1
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JP
Japan
Prior art keywords
group
component
polyurethane
wiring board
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011521896A
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English (en)
Japanese (ja)
Inventor
一彦 大賀
一彦 大賀
律子 東
律子 東
大西　美奈
美奈 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko KK
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of JPWO2011004756A1 publication Critical patent/JPWO2011004756A1/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/06—Polyurethanes from polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
JP2011521896A 2009-07-06 2010-06-24 配線板の保護膜用熱硬化性組成物 Pending JPWO2011004756A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009160120 2009-07-06
JP2009160120 2009-07-06
PCT/JP2010/061226 WO2011004756A1 (ja) 2009-07-06 2010-06-24 配線板の保護膜用熱硬化性組成物

Publications (1)

Publication Number Publication Date
JPWO2011004756A1 true JPWO2011004756A1 (ja) 2012-12-20

Family

ID=43429178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011521896A Pending JPWO2011004756A1 (ja) 2009-07-06 2010-06-24 配線板の保護膜用熱硬化性組成物

Country Status (5)

Country Link
JP (1) JPWO2011004756A1 (zh)
KR (1) KR101317259B1 (zh)
CN (1) CN102471460B (zh)
TW (1) TWI495662B (zh)
WO (1) WO2011004756A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5895534B2 (ja) * 2009-10-07 2016-03-30 日立化成株式会社 熱硬化性樹脂組成物、フレキシブル配線板の保護膜を形成する方法及びフレキシブル配線板
JP5782764B2 (ja) * 2010-03-26 2015-09-24 宇部興産株式会社 変性ポリイミド樹脂の製造方法
KR101848962B1 (ko) * 2011-06-21 2018-04-13 닛산 가가쿠 고교 가부시키 가이샤 광배향 처리법용의 액정 배향제, 및 그것을 사용한 액정 배향막
US9397337B2 (en) * 2011-10-28 2016-07-19 Lubrizol Advanced Materials, Inc. Polyurethane-based electrode binder compositions and electrodes thereof for electrochemical cells
WO2016129541A1 (ja) * 2015-02-09 2016-08-18 味の素株式会社 熱硬化性樹脂組成物
US10889729B2 (en) * 2015-12-25 2021-01-12 Nippon Polytech Corp. Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same
JP6882264B2 (ja) * 2016-04-22 2021-06-02 日本ポリテック株式会社 硬化性組成物、該組成物を用いる硬化膜およびオーバーコート膜
JP6897026B2 (ja) * 2016-08-10 2021-06-30 味の素株式会社 樹脂組成物
WO2018101333A1 (ja) * 2016-12-01 2018-06-07 昭和電工株式会社 導電パターンの保護膜用組成物、導電パターンの保護膜、保護膜製造方法及び透明導電フィルムの製造方法
CN108461405B (zh) * 2017-02-21 2020-04-10 碁鼎科技秦皇岛有限公司 线路载板及其制造方法
JP2019068062A (ja) * 2017-09-29 2019-04-25 昭和電工株式会社 レジストインキ並びに配線の保護膜及びその製造方法、半導体基板及びその保護膜の製造方法
US11746083B2 (en) * 2020-12-30 2023-09-05 Industrial Technology Research Institute Compound, resin composition and laminated substrate thereof

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08295718A (ja) * 1995-04-24 1996-11-12 Toagosei Co Ltd ポリウレタンフォーム
JPH10158383A (ja) * 1996-12-05 1998-06-16 Toagosei Co Ltd ポリエーテルポリオール
JPH11328656A (ja) * 1998-05-08 1999-11-30 Fuji Photo Film Co Ltd 磁気記録媒体
JP2000086906A (ja) * 1998-09-16 2000-03-28 Toray Ind Inc 熱硬化性樹脂溶液組成物、カラーフィルターおよび液晶表示装置
JP2001040059A (ja) * 1999-05-24 2001-02-13 Toyo Ink Mfg Co Ltd ポリウレタンの製造方法、及び該製造方法によって得られるポリウレタンの利用
JP2002220431A (ja) * 2001-01-25 2002-08-09 Arakawa Chem Ind Co Ltd アルコキシ基含有シラン変性ポリウレタン樹脂、当該樹脂組成物およびポリウレタン樹脂−シリカハイブリッド体
JP2003198105A (ja) * 2001-12-28 2003-07-11 Hitachi Chem Co Ltd 樹脂ペースト及びこれを用いたフレキシブル配線板
JP2005048046A (ja) * 2003-07-28 2005-02-24 Toyo Ink Mfg Co Ltd ドライラミネート用接着剤
WO2005021258A1 (ja) * 2003-09-01 2005-03-10 Daicel Chemical Industries, Ltd. 表面保護フィルム及びその製造方法
JP2006133561A (ja) * 2004-11-08 2006-05-25 Toppan Printing Co Ltd 電気泳動表示装置
JP2006307183A (ja) * 2005-03-28 2006-11-09 Ube Ind Ltd ポリカーボネートを含んだ変性ポリイミド樹脂、その組成物及び硬化絶縁膜
JP2006348287A (ja) * 2005-05-20 2006-12-28 Sumitomo Chemical Co Ltd 高沸点組成物及びそれを用いた高分子発光素子
JP2007138136A (ja) * 2005-10-19 2007-06-07 Yokohama Rubber Co Ltd:The エポキシ樹脂／ポリウレタン混合物および硬化性樹脂組成物
JP2007171812A (ja) * 2005-12-26 2007-07-05 Showa Denko Kk ソルダーレジストインキ組成物、その組成物を硬化してなるソルダーレジスト及びソルダーレジストの製造方法
JP2007199491A (ja) * 2006-01-27 2007-08-09 Showa Denko Kk ソルダーレジストインキ組成物、その組成物を硬化してなるソルダーレジスト及びそのソルダーレジストの製造方法
WO2007097405A1 (ja) * 2006-02-27 2007-08-30 Showa Denko K.K. 低塩素多官能脂肪族グリシジルエーテル化合物を含む熱硬化性樹脂組成物、該組成物の硬化物およびその用途
JP2007332328A (ja) * 2006-06-19 2007-12-27 Yokohama Rubber Co Ltd:The 酸化銀組成物
WO2009051209A1 (ja) * 2007-10-18 2009-04-23 Ajinomoto Co., Inc. 樹脂組成物
JP2009191252A (ja) * 2008-01-17 2009-08-27 Toyo Ink Mfg Co Ltd 難燃性樹脂組成物
JP2009271290A (ja) * 2008-05-07 2009-11-19 Toyo Ink Mfg Co Ltd リジッドプリント配線板用感光性樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1095640A (ja) * 1996-09-19 1998-04-14 Takeda Chem Ind Ltd 光ファイバ被覆用光硬化型樹脂組成物
CN101657482B (zh) * 2007-04-19 2014-04-16 Kaneka株式会社 新型聚酰亚胺前体组合物及其利用

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08295718A (ja) * 1995-04-24 1996-11-12 Toagosei Co Ltd ポリウレタンフォーム
JPH10158383A (ja) * 1996-12-05 1998-06-16 Toagosei Co Ltd ポリエーテルポリオール
JPH11328656A (ja) * 1998-05-08 1999-11-30 Fuji Photo Film Co Ltd 磁気記録媒体
JP2000086906A (ja) * 1998-09-16 2000-03-28 Toray Ind Inc 熱硬化性樹脂溶液組成物、カラーフィルターおよび液晶表示装置
JP2001040059A (ja) * 1999-05-24 2001-02-13 Toyo Ink Mfg Co Ltd ポリウレタンの製造方法、及び該製造方法によって得られるポリウレタンの利用
JP2002220431A (ja) * 2001-01-25 2002-08-09 Arakawa Chem Ind Co Ltd アルコキシ基含有シラン変性ポリウレタン樹脂、当該樹脂組成物およびポリウレタン樹脂−シリカハイブリッド体
JP2003198105A (ja) * 2001-12-28 2003-07-11 Hitachi Chem Co Ltd 樹脂ペースト及びこれを用いたフレキシブル配線板
JP2005048046A (ja) * 2003-07-28 2005-02-24 Toyo Ink Mfg Co Ltd ドライラミネート用接着剤
WO2005021258A1 (ja) * 2003-09-01 2005-03-10 Daicel Chemical Industries, Ltd. 表面保護フィルム及びその製造方法
JP2006133561A (ja) * 2004-11-08 2006-05-25 Toppan Printing Co Ltd 電気泳動表示装置
JP2006307183A (ja) * 2005-03-28 2006-11-09 Ube Ind Ltd ポリカーボネートを含んだ変性ポリイミド樹脂、その組成物及び硬化絶縁膜
JP2006348287A (ja) * 2005-05-20 2006-12-28 Sumitomo Chemical Co Ltd 高沸点組成物及びそれを用いた高分子発光素子
JP2007138136A (ja) * 2005-10-19 2007-06-07 Yokohama Rubber Co Ltd:The エポキシ樹脂／ポリウレタン混合物および硬化性樹脂組成物
JP2007171812A (ja) * 2005-12-26 2007-07-05 Showa Denko Kk ソルダーレジストインキ組成物、その組成物を硬化してなるソルダーレジスト及びソルダーレジストの製造方法
JP2007199491A (ja) * 2006-01-27 2007-08-09 Showa Denko Kk ソルダーレジストインキ組成物、その組成物を硬化してなるソルダーレジスト及びそのソルダーレジストの製造方法
WO2007097405A1 (ja) * 2006-02-27 2007-08-30 Showa Denko K.K. 低塩素多官能脂肪族グリシジルエーテル化合物を含む熱硬化性樹脂組成物、該組成物の硬化物およびその用途
JP2007332328A (ja) * 2006-06-19 2007-12-27 Yokohama Rubber Co Ltd:The 酸化銀組成物
WO2009051209A1 (ja) * 2007-10-18 2009-04-23 Ajinomoto Co., Inc. 樹脂組成物
JP2009191252A (ja) * 2008-01-17 2009-08-27 Toyo Ink Mfg Co Ltd 難燃性樹脂組成物
JP2009271290A (ja) * 2008-05-07 2009-11-19 Toyo Ink Mfg Co Ltd リジッドプリント配線板用感光性樹脂組成物

Also Published As

Publication number Publication date
TW201113312A (en) 2011-04-16
CN102471460A (zh) 2012-05-23
TWI495662B (zh) 2015-08-11
WO2011004756A1 (ja) 2011-01-13
KR20120022784A (ko) 2012-03-12
CN102471460B (zh) 2015-10-21
KR101317259B1 (ko) 2013-10-14

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