JPWO2009110582A1 - 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 - Google Patents
半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 Download PDFInfo
- Publication number
- JPWO2009110582A1 JPWO2009110582A1 JP2010501971A JP2010501971A JPWO2009110582A1 JP WO2009110582 A1 JPWO2009110582 A1 JP WO2009110582A1 JP 2010501971 A JP2010501971 A JP 2010501971A JP 2010501971 A JP2010501971 A JP 2010501971A JP WO2009110582 A1 JPWO2009110582 A1 JP WO2009110582A1
- Authority
- JP
- Japan
- Prior art keywords
- acid
- layer
- composition according
- antireflection film
- semiconductor surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 183
- 239000004065 semiconductor Substances 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 38
- -1 fluorine ions Chemical class 0.000 claims abstract description 154
- 150000001723 carbon free-radicals Chemical class 0.000 claims abstract description 116
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 64
- 150000001875 compounds Chemical class 0.000 claims abstract description 58
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 56
- 239000003960 organic solvent Substances 0.000 claims abstract description 36
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 30
- 239000011737 fluorine Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims description 89
- 239000002253 acid Substances 0.000 claims description 71
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 38
- 239000010949 copper Substances 0.000 claims description 28
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 26
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 23
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 21
- 239000003638 chemical reducing agent Substances 0.000 claims description 20
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 19
- 239000012756 surface treatment agent Substances 0.000 claims description 18
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 16
- 150000003839 salts Chemical group 0.000 claims description 15
- 239000004094 surface-active agent Substances 0.000 claims description 13
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 12
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical group S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 10
- 235000010323 ascorbic acid Nutrition 0.000 claims description 9
- 239000011668 ascorbic acid Substances 0.000 claims description 9
- 229960005070 ascorbic acid Drugs 0.000 claims description 9
- 235000015165 citric acid Nutrition 0.000 claims description 8
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 7
- 239000001630 malic acid Substances 0.000 claims description 7
- 235000011090 malic acid Nutrition 0.000 claims description 7
- 235000006408 oxalic acid Nutrition 0.000 claims description 7
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 6
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 5
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 5
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- 239000011975 tartaric acid Substances 0.000 claims description 5
- 235000002906 tartaric acid Nutrition 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 4
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- 239000001361 adipic acid Substances 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- 239000001530 fumaric acid Substances 0.000 claims description 3
- 235000011087 fumaric acid Nutrition 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- 150000003462 sulfoxides Chemical class 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims 6
- 150000002148 esters Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 10
- 238000005530 etching Methods 0.000 abstract description 9
- 238000003672 processing method Methods 0.000 abstract description 6
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 290
- 238000007654 immersion Methods 0.000 description 37
- 238000011156 evaluation Methods 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 33
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 21
- 239000000243 solution Substances 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 18
- 150000003863 ammonium salts Chemical class 0.000 description 16
- 159000000000 sodium salts Chemical class 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 150000005215 alkyl ethers Chemical class 0.000 description 13
- 238000003756 stirring Methods 0.000 description 12
- 150000003254 radicals Chemical class 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 10
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 10
- 239000003945 anionic surfactant Substances 0.000 description 10
- 238000004380 ashing Methods 0.000 description 10
- 230000002411 adverse Effects 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- SFLRURCEBYIKSS-UHFFFAOYSA-N n-butyl-2-[[1-(butylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCCC SFLRURCEBYIKSS-UHFFFAOYSA-N 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 8
- 150000003973 alkyl amines Chemical group 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 6
- 108010077895 Sarcosine Proteins 0.000 description 6
- 229910052783 alkali metal Inorganic materials 0.000 description 6
- 150000001340 alkali metals Chemical class 0.000 description 6
- 235000010350 erythorbic acid Nutrition 0.000 description 6
- 229940026239 isoascorbic acid Drugs 0.000 description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229910052700 potassium Inorganic materials 0.000 description 6
- 239000011591 potassium Substances 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 6
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 5
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N N-methylaminoacetic acid Natural products C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 5
- 239000012965 benzophenone Substances 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229930195712 glutamate Natural products 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 150000007522 mineralic acids Chemical class 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000001603 reducing effect Effects 0.000 description 5
- 229940043230 sarcosine Drugs 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 150000000996 L-ascorbic acids Chemical class 0.000 description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000004996 alkyl benzenes Chemical class 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 229960003237 betaine Drugs 0.000 description 4
- LWMFAFLIWMPZSX-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LWMFAFLIWMPZSX-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 3
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 3
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 3
- NMZSJIQGMAGSSO-UHFFFAOYSA-N 3-[[1-amino-2-[[1-amino-1-(2-carboxyethylimino)-2-methylpropan-2-yl]diazenyl]-2-methylpropylidene]amino]propanoic acid Chemical group OC(=O)CCNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCCC(O)=O NMZSJIQGMAGSSO-UHFFFAOYSA-N 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-isoascorbic acid Chemical compound OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- QAQJMLQRFWZOBN-LAUBAEHRSA-N L-ascorbyl-6-palmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](O)[C@H]1OC(=O)C(O)=C1O QAQJMLQRFWZOBN-LAUBAEHRSA-N 0.000 description 3
- 239000011786 L-ascorbyl-6-palmitate Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 235000010385 ascorbyl palmitate Nutrition 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 3
- 235000019253 formic acid Nutrition 0.000 description 3
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 235000014655 lactic acid Nutrition 0.000 description 3
- 239000004310 lactic acid Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- BUGISVZCMXHOHO-UHFFFAOYSA-N n-[1,3-dihydroxy-2-(hydroxymethyl)propan-2-yl]-2-[[1-[[1,3-dihydroxy-2-(hydroxymethyl)propan-2-yl]amino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCC(CO)(CO)NC(=O)C(C)(C)N=NC(C)(C)C(=O)NC(CO)(CO)CO BUGISVZCMXHOHO-UHFFFAOYSA-N 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 3
- 229940080818 propionamide Drugs 0.000 description 3
- 229940107700 pyruvic acid Drugs 0.000 description 3
- 235000010378 sodium ascorbate Nutrition 0.000 description 3
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 description 3
- 229960005055 sodium ascorbate Drugs 0.000 description 3
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 3
- NPENBPVOAXERED-UHFFFAOYSA-N (4-benzoylphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 NPENBPVOAXERED-UHFFFAOYSA-N 0.000 description 2
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 2
- YNSNJGRCQCDRDM-UHFFFAOYSA-N 1-chlorothioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl YNSNJGRCQCDRDM-UHFFFAOYSA-N 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- MHDULSOPQSUKBQ-UHFFFAOYSA-N 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-diphenylimidazol-2-yl]-4,5-diphenylimidazole Chemical compound ClC1=CC=CC=C1C(N1C2(N=C(C(=N2)C=2C=CC=CC=2)C=2C=CC=CC=2)C=2C(=CC=CC=2)Cl)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 MHDULSOPQSUKBQ-UHFFFAOYSA-N 0.000 description 2
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 2
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- LYPGJGCIPQYQBW-UHFFFAOYSA-N 2-methyl-2-[[2-methyl-1-oxo-1-(prop-2-enylamino)propan-2-yl]diazenyl]-n-prop-2-enylpropanamide Chemical compound C=CCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCC=C LYPGJGCIPQYQBW-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- GDALETGZDYOOGB-UHFFFAOYSA-N Acridone Natural products C1=C(O)C=C2N(C)C3=CC=CC=C3C(=O)C2=C1O GDALETGZDYOOGB-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- ZGFPUTOTEJOSAY-UHFFFAOYSA-N FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 Chemical compound FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 ZGFPUTOTEJOSAY-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- XOAAWQZATWQOTB-UHFFFAOYSA-N Taurine Natural products NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- FZEYVTFCMJSGMP-UHFFFAOYSA-N acridone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3NC2=C1 FZEYVTFCMJSGMP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 229940064734 aminobenzoate Drugs 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 description 2
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 description 2
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- OZYJVQJGKRFVHQ-UHFFFAOYSA-L dipotassium trioxidophosphanium Chemical compound [K+].[K+].[O-]P([O-])=O OZYJVQJGKRFVHQ-UHFFFAOYSA-L 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- YDSWCNNOKPMOTP-UHFFFAOYSA-N mellitic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C(C(O)=O)=C1C(O)=O YDSWCNNOKPMOTP-UHFFFAOYSA-N 0.000 description 2
- SYWIXHZXHQDFOO-UHFFFAOYSA-N methyl n-phenyliminocarbamate Chemical compound COC(=O)N=NC1=CC=CC=C1 SYWIXHZXHQDFOO-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- WVFLGSMUPMVNTQ-UHFFFAOYSA-N n-(2-hydroxyethyl)-2-[[1-(2-hydroxyethylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCO WVFLGSMUPMVNTQ-UHFFFAOYSA-N 0.000 description 2
- WMRNGPYHLQSTDL-UHFFFAOYSA-N n-cyclohexyl-2-[[1-(cyclohexylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound C1CCCCC1NC(=O)C(C)(C)N=NC(C)(C)C(=O)NC1CCCCC1 WMRNGPYHLQSTDL-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical group C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 2
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 description 2
- 230000007928 solubilization Effects 0.000 description 2
- 238000005063 solubilization Methods 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229960003080 taurine Drugs 0.000 description 2
- FPGGTKZVZWFYPV-UHFFFAOYSA-M tetrabutylammonium fluoride Chemical compound [F-].CCCC[N+](CCCC)(CCCC)CCCC FPGGTKZVZWFYPV-UHFFFAOYSA-M 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OJLABXSUFRIXFL-UHFFFAOYSA-N (2-benzoylphenyl)-phenylmethanone Chemical compound C=1C=CC=C(C(=O)C=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 OJLABXSUFRIXFL-UHFFFAOYSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- JKVSAZTYCZKNDX-UHFFFAOYSA-N 1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C1=CC(C(=O)CCC)=CC=C1N1CCOCC1 JKVSAZTYCZKNDX-UHFFFAOYSA-N 0.000 description 1
- WQQZMYRVHZZOEW-UHFFFAOYSA-N 1-benzyl-4-(2-methylphenyl)sulfanylbenzene Chemical compound CC1=CC=CC=C1SC(C=C1)=CC=C1CC1=CC=CC=C1 WQQZMYRVHZZOEW-UHFFFAOYSA-N 0.000 description 1
- HSKPJQYAHCKJQC-UHFFFAOYSA-N 1-ethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CC HSKPJQYAHCKJQC-UHFFFAOYSA-N 0.000 description 1
- WJDJWDHXZBNQNE-UHFFFAOYSA-M 1-octadecylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 WJDJWDHXZBNQNE-UHFFFAOYSA-M 0.000 description 1
- YUBXLROQJAIVDR-UHFFFAOYSA-N 10-butyl-1-chloroacridin-9-one Chemical compound C1=CC=C2N(CCCC)C3=CC=CC=C3C(=O)C2=C1Cl YUBXLROQJAIVDR-UHFFFAOYSA-N 0.000 description 1
- BVYZDBLMCKSKAT-UHFFFAOYSA-N 2,2,3,3-tetrahexyldecanoic acid Chemical compound CCCCCCCC(CCCCCC)(CCCCCC)C(CCCCCC)(CCCCCC)C(O)=O BVYZDBLMCKSKAT-UHFFFAOYSA-N 0.000 description 1
- VGNVQGDEZCFGFJ-UHFFFAOYSA-N 2,3-dihydro-1h-pyrrol-1-ium;fluoride Chemical compound [F-].C1CC=C[NH2+]1 VGNVQGDEZCFGFJ-UHFFFAOYSA-N 0.000 description 1
- TYFSYONDMQEGJK-UHFFFAOYSA-N 2-(2,2-dihydroxyethylamino)acetic acid Chemical compound OC(O)CNCC(O)=O TYFSYONDMQEGJK-UHFFFAOYSA-N 0.000 description 1
- QQXNMKDSMIXHGI-UHFFFAOYSA-N 2-(2-chlorophenyl)-1h-imidazole Chemical compound ClC1=CC=CC=C1C1=NC=CN1 QQXNMKDSMIXHGI-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- MJGLWGBXQWRFCX-UHFFFAOYSA-N 2-[(1-imino-2-methyl-1-pyrrolidin-1-ylpropan-2-yl)diazenyl]-2-methyl-1-pyrrolidin-1-ylpropan-1-imine;dihydrochloride Chemical compound Cl.Cl.C1CCCN1C(=N)C(C)(C)N=NC(C)(C)C(=N)N1CCCC1 MJGLWGBXQWRFCX-UHFFFAOYSA-N 0.000 description 1
- FLKBKUFGKQPPRY-UHFFFAOYSA-N 2-[2-[2-[2-[1-(2-hydroxyethyl)-4,5-dihydroimidazol-2-yl]propan-2-yldiazenyl]propan-2-yl]-4,5-dihydroimidazol-1-yl]ethanol;dihydrochloride Chemical compound Cl.Cl.N=1CCN(CCO)C=1C(C)(C)N=NC(C)(C)C1=NCCN1CCO FLKBKUFGKQPPRY-UHFFFAOYSA-N 0.000 description 1
- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 description 1
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BHYVPLASKPLRRX-UHFFFAOYSA-N 2-methyl-1-pyrrolidin-1-ylpropan-1-imine Chemical compound CC(C)C(=N)N1CCCC1 BHYVPLASKPLRRX-UHFFFAOYSA-N 0.000 description 1
- RCEJCSULJQNRQQ-UHFFFAOYSA-N 2-methylbutanenitrile Chemical compound CCC(C)C#N RCEJCSULJQNRQQ-UHFFFAOYSA-N 0.000 description 1
- RYDOQJPDRXMRRP-UHFFFAOYSA-N 2-methylpropan-1-one Chemical compound CC(C)[C]=O RYDOQJPDRXMRRP-UHFFFAOYSA-N 0.000 description 1
- BTYIFQSAIPDZQW-UHFFFAOYSA-N 2-propan-2-yl-4,5-dihydro-1h-imidazole Chemical compound CC(C)C1=NCCN1 BTYIFQSAIPDZQW-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- ZDWPBMJZDNXTPG-UHFFFAOYSA-N 2h-benzotriazol-4-amine Chemical compound NC1=CC=CC2=C1NN=N2 ZDWPBMJZDNXTPG-UHFFFAOYSA-N 0.000 description 1
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 1
- 125000005809 3,4,5-trimethoxyphenyl group Chemical group [H]C1=C(OC([H])([H])[H])C(OC([H])([H])[H])=C(OC([H])([H])[H])C([H])=C1* 0.000 description 1
- OCVLSHAVSIYKLI-UHFFFAOYSA-N 3h-1,3-thiazole-2-thione Chemical compound SC1=NC=CS1 OCVLSHAVSIYKLI-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 description 1
- RTANHMOFHGSZQO-UHFFFAOYSA-N 4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)C#N RTANHMOFHGSZQO-UHFFFAOYSA-N 0.000 description 1
- 239000004261 Ascorbyl stearate Substances 0.000 description 1
- LITUBCVUXPBCGA-WMZHIEFXSA-N Ascorbyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@H](O)[C@H]1OC(=O)C(O)=C1O LITUBCVUXPBCGA-WMZHIEFXSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- XWXJMCCMBTXAPS-UHFFFAOYSA-N C1=CC=CC=2C(C3=CC=CC=C3C(C12)=O)=O.C(C)C1=CC=CC=2C(C3=CC=CC=C3C(C12)=O)=O Chemical compound C1=CC=CC=2C(C3=CC=CC=C3C(C12)=O)=O.C(C)C1=CC=CC=2C(C3=CC=CC=C3C(C12)=O)=O XWXJMCCMBTXAPS-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 description 1
- HMFHBZSHGGEWLO-SOOFDHNKSA-N D-ribofuranose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@@H]1O HMFHBZSHGGEWLO-SOOFDHNKSA-N 0.000 description 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical compound C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- YXHXDEBLSQQHQE-UHFFFAOYSA-N N.N.OP(O)=O Chemical compound N.N.OP(O)=O YXHXDEBLSQQHQE-UHFFFAOYSA-N 0.000 description 1
- CDXRGXUDSDPCOI-UHFFFAOYSA-N N.OP(O)=O Chemical compound N.OP(O)=O CDXRGXUDSDPCOI-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000005643 Pelargonic acid Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- PYMYPHUHKUWMLA-LMVFSUKVSA-N Ribose Natural products OC[C@@H](O)[C@@H](O)[C@@H](O)C=O PYMYPHUHKUWMLA-LMVFSUKVSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000007874 V-70 Substances 0.000 description 1
- YBDGSBYATHYFAB-UHFFFAOYSA-N [C].C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 Chemical compound [C].C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 YBDGSBYATHYFAB-UHFFFAOYSA-N 0.000 description 1
- XBGUSFHUSGNDBT-UHFFFAOYSA-N [F-].C(C)O.C(C)O.C(C)O.[NH4+] Chemical compound [F-].C(C)O.C(C)O.C(C)O.[NH4+] XBGUSFHUSGNDBT-UHFFFAOYSA-N 0.000 description 1
- QYIDPSOVWLCLSG-UHFFFAOYSA-N [F-].[NH4+].C(C)O.C(C)O Chemical compound [F-].[NH4+].C(C)O.C(C)O QYIDPSOVWLCLSG-UHFFFAOYSA-N 0.000 description 1
- VUGIQPRQXKWKGX-UHFFFAOYSA-K [K+].[K+].[K+].[O-]C(=O)CC(C([O-])=O)S([O-])(=O)=O Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(C([O-])=O)S([O-])(=O)=O VUGIQPRQXKWKGX-UHFFFAOYSA-K 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- HMFHBZSHGGEWLO-UHFFFAOYSA-N alpha-D-Furanose-Ribose Natural products OCC1OC(O)C(O)C1O HMFHBZSHGGEWLO-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- PYMYPHUHKUWMLA-WDCZJNDASA-N arabinose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)C=O PYMYPHUHKUWMLA-WDCZJNDASA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- KQZNFGJQTPAURD-NBWQQBAWSA-N ascorbyl dipalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](OC(=O)CCCCCCCCCCCCCCC)[C@H]1OC(=O)C(O)=C1O KQZNFGJQTPAURD-NBWQQBAWSA-N 0.000 description 1
- 235000019276 ascorbyl stearate Nutrition 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- OYJQAICEYJBQGK-UHFFFAOYSA-N azanium ethanol fluoride Chemical compound [NH4+].[F-].CCO OYJQAICEYJBQGK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- WPKWPKDNOPEODE-UHFFFAOYSA-N bis(2,4,4-trimethylpentan-2-yl)diazene Chemical compound CC(C)(C)CC(C)(C)N=NC(C)(C)CC(C)(C)C WPKWPKDNOPEODE-UHFFFAOYSA-N 0.000 description 1
- SFBXYJXNDOJHLL-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene;sulfo hydrogen sulfate Chemical compound OS(=O)(=O)OS(O)(=O)=O.N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 SFBXYJXNDOJHLL-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- GCSVCUMDOQKEMT-UHFFFAOYSA-N butan-1-amine;hydrofluoride Chemical compound [H+].[F-].CCCCN GCSVCUMDOQKEMT-UHFFFAOYSA-N 0.000 description 1
- YMKDRGPMQRFJGP-UHFFFAOYSA-M cetylpyridinium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 YMKDRGPMQRFJGP-UHFFFAOYSA-M 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- VBWIZSYFQSOUFQ-UHFFFAOYSA-N cyclohexanecarbonitrile Chemical compound N#CC1CCCCC1 VBWIZSYFQSOUFQ-UHFFFAOYSA-N 0.000 description 1
- FVPCNTIZTYPTAZ-UHFFFAOYSA-N cyclohexylazanium;fluoride Chemical compound F.NC1CCCCC1 FVPCNTIZTYPTAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- YSAVZVORKRDODB-WDSKDSINSA-N diethyl tartrate Chemical compound CCOC(=O)[C@@H](O)[C@H](O)C(=O)OCC YSAVZVORKRDODB-WDSKDSINSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- KGOGNDXXUVELIQ-UHFFFAOYSA-N dioctadecylazanium;chloride Chemical compound Cl.CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC KGOGNDXXUVELIQ-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- LNGNZSMIUVQZOX-UHFFFAOYSA-L disodium;dioxido(sulfanylidene)-$l^{4}-sulfane Chemical compound [Na+].[Na+].[O-]S([O-])=S LNGNZSMIUVQZOX-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- VFNGKCDDZUSWLR-UHFFFAOYSA-L disulfate(2-) Chemical compound [O-]S(=O)(=O)OS([O-])(=O)=O VFNGKCDDZUSWLR-UHFFFAOYSA-L 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- LZCVHHFGMKXLBU-UHFFFAOYSA-N ethanamine;hydrofluoride Chemical compound [F-].CC[NH3+] LZCVHHFGMKXLBU-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229930182830 galactose Natural products 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229930182478 glucoside Natural products 0.000 description 1
- IPCSVZSSVZVIGE-UHFFFAOYSA-M hexadecanoate Chemical compound CCCCCCCCCCCCCCCC([O-])=O IPCSVZSSVZVIGE-UHFFFAOYSA-M 0.000 description 1
- 150000002402 hexoses Chemical class 0.000 description 1
- 239000012493 hydrazine sulfate Substances 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- RNYJXPUAFDFIQJ-UHFFFAOYSA-N hydron;octadecan-1-amine;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[NH3+] RNYJXPUAFDFIQJ-UHFFFAOYSA-N 0.000 description 1
- IKGLACJFEHSFNN-UHFFFAOYSA-N hydron;triethylazanium;trifluoride Chemical compound F.F.F.CCN(CC)CC IKGLACJFEHSFNN-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- UNFDKMXBKPSFIJ-UHFFFAOYSA-N hydroxylamine;hydrofluoride Chemical compound F.ON UNFDKMXBKPSFIJ-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229940074358 magnesium ascorbate Drugs 0.000 description 1
- AIOKQVJVNPDJKA-ZZMNMWMASA-L magnesium;(2r)-2-[(1s)-1,2-dihydroxyethyl]-4-hydroxy-5-oxo-2h-furan-3-olate Chemical compound [Mg+2].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] AIOKQVJVNPDJKA-ZZMNMWMASA-L 0.000 description 1
- RRSMHQNLDRCPQG-UHFFFAOYSA-N methanamine;hydrofluoride Chemical compound [F-].[NH3+]C RRSMHQNLDRCPQG-UHFFFAOYSA-N 0.000 description 1
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 description 1
- NQMRYBIKMRVZLB-UHFFFAOYSA-N methylamine hydrochloride Chemical compound [Cl-].[NH3+]C NQMRYBIKMRVZLB-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 description 1
- GHTYHZNTZWCGKI-UHFFFAOYSA-N morpholin-4-ium;fluoride Chemical compound [F-].C1COCC[NH2+]1 GHTYHZNTZWCGKI-UHFFFAOYSA-N 0.000 description 1
- ZQRBSCXRHDJZBS-UHFFFAOYSA-N n,n-dibutylbutan-1-amine;hydrofluoride Chemical compound F.CCCCN(CCCC)CCCC ZQRBSCXRHDJZBS-UHFFFAOYSA-N 0.000 description 1
- FRQONEWDWWHIPM-UHFFFAOYSA-N n,n-dicyclohexylcyclohexanamine Chemical compound C1CCCCC1N(C1CCCCC1)C1CCCCC1 FRQONEWDWWHIPM-UHFFFAOYSA-N 0.000 description 1
- IXYXXQNFKSEXJM-UHFFFAOYSA-N n,n-dimethylmethanamine;hydron;fluoride Chemical compound F.CN(C)C IXYXXQNFKSEXJM-UHFFFAOYSA-N 0.000 description 1
- WTNTZFRNCHEDOS-UHFFFAOYSA-N n-(2-hydroxyethyl)-2-methylpropanamide Chemical compound CC(C)C(=O)NCCO WTNTZFRNCHEDOS-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- GZAROOOHRGKEPC-UHFFFAOYSA-N n-butyl-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)C GZAROOOHRGKEPC-UHFFFAOYSA-N 0.000 description 1
- ZMBUORMORUHTIQ-UHFFFAOYSA-N n-butylbutan-1-amine;hydrofluoride Chemical compound [F-].CCCC[NH2+]CCCC ZMBUORMORUHTIQ-UHFFFAOYSA-N 0.000 description 1
- SOQDHKXOLGMZRB-UHFFFAOYSA-N n-cyclohexylcyclohexanamine;hydrofluoride Chemical compound [F-].C1CCCCC1[NH2+]C1CCCCC1 SOQDHKXOLGMZRB-UHFFFAOYSA-N 0.000 description 1
- IUVRYNCZPOFHIT-UHFFFAOYSA-N n-ethylethanamine;hydrofluoride Chemical compound [F-].CC[NH2+]CC IUVRYNCZPOFHIT-UHFFFAOYSA-N 0.000 description 1
- LVKUAMRYYGCOLC-UHFFFAOYSA-N n-methylmethanamine;hydrofluoride Chemical compound [F-].C[NH2+]C LVKUAMRYYGCOLC-UHFFFAOYSA-N 0.000 description 1
- GCLZYIAWFUPTLN-UHFFFAOYSA-N n-propylpropan-1-amine;hydrofluoride Chemical compound F.CCCNCCC GCLZYIAWFUPTLN-UHFFFAOYSA-N 0.000 description 1
- SJNXJRVDSTZUFB-UHFFFAOYSA-N naphthalen-2-yl(phenyl)methanone Chemical compound C=1C=C2C=CC=CC2=CC=1C(=O)C1=CC=CC=C1 SJNXJRVDSTZUFB-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 150000002972 pentoses Chemical class 0.000 description 1
- JBQNHQIURDYDFL-UHFFFAOYSA-N piperidin-1-ium;fluoride Chemical compound F.C1CCNCC1 JBQNHQIURDYDFL-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- DSISTIFLMZXDDI-UHFFFAOYSA-N propan-1-amine;hydrofluoride Chemical compound F.CCCN DSISTIFLMZXDDI-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- GRJJQCWNZGRKAU-UHFFFAOYSA-N pyridin-1-ium;fluoride Chemical compound F.C1=CC=NC=C1 GRJJQCWNZGRKAU-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- WGZXOMPLJAOTAY-UHFFFAOYSA-N pyrrolidin-1-ium;fluoride Chemical compound F.C1CCNC1 WGZXOMPLJAOTAY-UHFFFAOYSA-N 0.000 description 1
- LOAUVZALPPNFOQ-UHFFFAOYSA-N quinaldic acid Chemical compound C1=CC=CC2=NC(C(=O)O)=CC=C21 LOAUVZALPPNFOQ-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- WQQPDTLGLVLNOH-UHFFFAOYSA-M sodium;4-hydroxy-4-oxo-3-sulfobutanoate Chemical compound [Na+].OC(=O)CC(C([O-])=O)S(O)(=O)=O WQQPDTLGLVLNOH-UHFFFAOYSA-M 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- SFVFIFLLYFPGHH-UHFFFAOYSA-M stearalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SFVFIFLLYFPGHH-UHFFFAOYSA-M 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- QSUJAUYJBJRLKV-UHFFFAOYSA-M tetraethylazanium;fluoride Chemical compound [F-].CC[N+](CC)(CC)CC QSUJAUYJBJRLKV-UHFFFAOYSA-M 0.000 description 1
- 150000004685 tetrahydrates Chemical class 0.000 description 1
- POSYVRHKTFDJTR-UHFFFAOYSA-M tetrapropylazanium;fluoride Chemical compound [F-].CCC[N+](CCC)(CCC)CCC POSYVRHKTFDJTR-UHFFFAOYSA-M 0.000 description 1
- 229940035024 thioglycerol Drugs 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- PIFYSWIJWKZPAT-UHFFFAOYSA-N tricyclohexylazanium;fluoride Chemical compound [F-].C1CCCCC1[NH+](C1CCCCC1)C1CCCCC1 PIFYSWIJWKZPAT-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- GRSOSRPRKCYTMG-UHFFFAOYSA-N tripropylazanium;fluoride Chemical compound [F-].CCC[NH+](CCC)CCC GRSOSRPRKCYTMG-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
200mLのポリビーカーに、水1.94g及びアルキルスルホコハク酸ナトリウム(ネオコールP(第一工業製薬株式会社製))1.29gを仕込んだ溶液に、イエローランプ(三菱電機オスラム株式会社製 直管イエロー蛍光ランプ FLR40SY-IC/M)の照射下で、フッ化アンモニウム0.06g及び2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-ブタノン-1(イルガキュア369(チバ・スペシャルティ・ケミカルズ社製))0.5gを加え、室温で攪拌した。フッ化アンモニウム及びイルガキュア369の溶解を確認した後、攪拌を続けながら、その溶液にγ-ブチロラクトン96gを加え、更に、パルミチン酸アスコルビル0.01gを加えた後、クエン酸0.2gを加えてpHを2に調節して、本発明の組成物(1)とした。
実施例2〜11では、表1に示す各成分を用いて、表1に示す量を仕込んだ以外は、実施例1と同様にして、本発明の組成物(2)〜(11)を得た。本発明の組成物(1)〜(11)の組成を表1に示す。なお、表1に示す数値は、組成物の総量を100%とした場合における各成分の%濃度である。
比較例1〜2では、本発明の組成物における有機溶剤であるγ-ブチロラクトンの代わりに、アセトン又はジメチルホルムアミド(DMF)を用いて、表2に示す量を仕込んだ以外は、実施例1と同様にして、比較用組成物(1)〜(2)を得た。比較例3では、本発明の組成物における炭素ラジカル発生剤の代わりに、過酸化水素を用いて表2に示す量を仕込んだ以外は、実施例1と同様にして、比較用組成物(3)を得た。比較用組成物(1)〜(3)の組成を表2に示す。なお、表2に示す数値は、組成物の総量を100%とした場合における各成分の%濃度である。
200mLのポリビーカーに、実施例1で調製した本発明の組成物(1)の50mLを入れ、上で述べた評価用基板サンプルを、室温で、紫外線照射装置(株式会社モリテックス製 UV照射装置 MUV-35U MUV-PF001 フィルター付き)で中心波長320nmの光を照射しながら、ゆるやかに攪拌しつつ30分間浸漬し続けた。その後、純水で30秒間リンスし、基板表面を圧縮空気で乾燥した。乾燥後の基板サンプルを目視で観察したところ、レジスト層及びレジスト硬化層については残渣もなく良好に剥離できており、反射防止膜層については、その90%以上が剥離できていることを確認した。その結果、評価用基板サンプルを、光照射しながら本発明の組成物中に30分間浸漬すれば、反射防止膜層(BARC層)のみならず、レジスト層やレジスト硬化層をも同時に剥離できることが判った。
実施例13〜20では、本発明の組成物(2)〜(9)について実施例12と同様の方法により、所定の時間浸漬を行って、レジスト層、レジスト硬化層及び反射防止膜層の剥離性能を目視で観察した。その結果を実施例12の結果も併せて表3に示す。なお、実施例17では、浸漬中の溶液にフッ化アンモニウムの結晶が析出していることが確認された。
200mLのポリビーカーに、実施例10で調製した本発明の組成物(10)の50mLを入れ、予め40℃に加温し、10分間加熱した。この加熱した溶液に、上で述べた評価用基板サンプルを、ゆるやかに攪拌しつつ5分間浸漬し続けた。その後、純水で30秒間リンスし、基板表面を圧縮空気で乾燥した。乾燥後の基板サンプルを目視で観察したところ、レジスト層、レジスト硬化層及び反射防止膜層のすべてが良好に剥離できていることが確認できた。その結果、評価用基板サンプルを、予め加熱した本発明の組成物中に5分間浸漬すれば、反射防止膜層(BARC層)のみならず、レジスト層やレジスト硬化層をも同時に剥離できることが判った。
実施例22では、本発明の組成物(11)を用いた以外は、実施例21と同様の方法により、3分間浸漬を行った後、リンス洗浄、乾燥を行い、乾燥後の基板サンプルを目視で観察した。その結果、レジスト層、レジスト硬化層及び反射防止膜層のすべてが良好に剥離できていることが確認でき、評価用基板サンプルを、予め加熱した本発明の組成物中に3分間浸漬すれば、反射防止膜層(BARC層)のみならず、レジスト層やレジスト硬化層をも同時に剥離できることが判った。
200mLのポリビーカーに、実施例2で調製した本発明の組成物(2)の50mLを入れ、予め室温で、紫外線照射装置(株式会社モリテックス製 UV照射装置 MUV-35U MUV-PF001 フィルター付き)で中心波長320nmの光を3分間照射し続けた。次いで、このように予め光照射を行った当該溶液に、上で述べた評価用基板サンプルを、ゆるやかに攪拌しつつ3分間浸漬し続けた。なお、浸漬の間は光照射を行わなかった。その後、純水で30秒間リンスし、基板表面を圧縮空気で乾燥した。乾燥後の基板サンプルを目視で観察したところ、レジスト層、レジスト硬化層及び反射防止膜層(BARC層)のすべてが良好に剥離できていることが確認できた。
200mLのポリビーカーに、比較例1で調製した比較用組成物(1)及び比較例2で調製した比較用組成物(2)の50mLを別々のポリビーカーに入れ、上で述べた評価用基板サンプルを、室温で、紫外線照射装置(株式会社モリテックス製 UV照射装置 MUV-35U MUV-PF001 フィルター付き)で中心波長320nmの光を照射しながら、ゆるやかに攪拌しつつ30分間浸漬し続けた。しかしながら、30分間も浸漬し続けたのにもかかわらず、レジスト層及びレジスト硬化層が剥離できず、その下層にある反射防止膜層(BARC層)もほとんど剥離できなかった。
実施例2で調製した本発明の組成物(2)の溶液50mLに、Cu/Low-k基板(Low-k膜はBlack diamond-1)を10分間浸漬した。その後、当該基板を浸漬液から取り出し、基板表面を圧縮空気で乾燥した。この乾燥後の基板サンプルを光学顕微鏡(1000倍)で確認して、本発明の組成物の銅層表面への影響について評価したところ、10分浸漬後の基板の銅層表面には金属光沢があり酸化皮膜が形成されていないことが確認された。また、原子間力顕微鏡(SII製 ナノピクス2100)で表面粗さを確認したところ、平均面粗さが、浸漬処理前の1nm以下から変化がないことも確認された。これらの結果から、本発明の半導体表面用処理剤組成物は、銅層表面には影響を及ぼさないことが判った。
比較例3で調製した比較用組成物(3)の溶液50mLに、Cu/Low-k基板(Low-k膜はBlack diamond-1)を5分間浸漬した。その後、当該基板を浸漬液から取り出し、基板表面を圧縮空気で乾燥した。この乾燥後の基板サンプルを光学顕微鏡(1000倍)で確認して、比較用組成物の銅層表面への影響について評価したところ、5分浸漬後の基板の銅層表面には金属光沢がなく銅層表面には酸化銅の酸化皮膜が形成されていることが確認された。また、原子間力顕微鏡(SII製 ナノピクス2100)で表面粗さを確認したところ、平均面粗さが、浸漬処理前の1nm以下から4nmまで大きくなり、平坦度が悪化していることも確認された。これらの結果から、比較用組成物(3)は、銅層表面に影響を及ぼし、酸化皮膜を形成させることが判った。
実施例2で調製した本発明の組成物(2)の50mL溶液に、Low-k膜が塗布された基板を30分間浸漬した。その後、当該基板を浸漬液から取り出し、基板表面を圧縮空気で乾燥した。この乾燥後の基板サンプルを、X線光電子分光装置(XPS)(クレイトス社製 AXIS-his)でLow-k膜表面を分析したところ、浸漬前後でスペクトルに変化がないことが確認された。この結果から、本発明の組成物は、絶縁膜としてLow-k膜が塗布された基板であっても、Low-k膜に影響を及ぼすことなく、反射防止膜層或いは反射防止膜層のみならず、レジスト層及びレジスト硬化層も良好に剥離できるものであることが判った。
200mLのポリビーカーに、水99.44gを仕込んだ溶液に、イエローランプ(三菱電機オスラム株式会社製 直管イエロー蛍光ランプ FLR40SY-IC/M)の照射下で、フッ化アンモニウム0.06g及び2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-ブタノン-1(イルガキュア369(チバ・スペシャルティ・ケミカルズ社製))0.5gを加え、室温で攪拌して、pH6の本発明の組成物(12)を得た。
実施例27〜28では、表4に示す各成分を用いて、表4に示す量を仕込んだ以外は、実施例26と同様にして、本発明の組成物(13)〜(14)を得た。本発明の組成物(12)〜(14)の組成を表4に示す。なお、表4に示す数値は、組成物の総量を100%とした場合における各成分の%濃度である。
200mLのポリビーカーに、水99.94gを仕込んだ溶液に、フッ化アンモニウム0.06gを加え、室温で攪拌して、pH6の比較用組成物(4)を得た。
200mLのポリビーカーに、実施例26で調製した本発明の組成物(12)の50mLを入れ、上で述べた評価用基板サンプルのレジスト層及びレジスト硬化層を除去して、反射防止膜層を露出させた基板を、室温で、紫外線照射装置(株式会社モリテックス製 UV照射装置 MUV-35U MUV-PF001 フィルター付き)で中心波長320nmの光を照射しながら、ゆるやかに攪拌しつつ浸漬し、浸漬中での反射防止膜層の剥離を目視で観察した。その結果、浸漬3分間後には、反射防止膜層の剥離が確認でき、浸漬15分後では、反射防止膜層が完全に剥離されていることが確認できた。
実施例30では、本発明の組成物(13)を用いた以外は、実施例29と同様の方法により、浸漬を行って、反射防止膜層の剥離を目視観察した。その結果、本発明の組成物(13)を用いた場合には、浸漬3分後には、反射防止膜層が完全に剥離されていることが確認できた。
200mLのポリビーカーに、実施例28で調製した本発明の組成物(14)の50mLを入れ、上で述べた評価用基板サンプルのレジスト層及びレジスト硬化層を除去して、反射防止膜層を露出させた基板を、40℃に加温した上記組成物(14)の溶液に浸漬し、ゆるやかに攪拌しながら、浸漬中での反射防止膜層の剥離を目視で観察した。その結果、浸漬3分後には、反射防止膜層が完全に剥離されていることが確認できた。
200mLのポリビーカーに、比較例7で調製した比較用組成物(4)の50mLを入れ、上で述べた評価用基板サンプルのレジスト層及びレジスト硬化層を除去して、反射防止膜層を露出させた基板を、室温で、紫外線照射装置(株式会社モリテックス製 UV照射装置 MUV-35U MUV-PF001 フィルター付き)で中心波長320nmの光を照射しながら、ゆるやかに攪拌しつつ浸漬し、浸漬中での反射防止膜層の剥離を目視で観察した。しかしながら、30分間も浸漬し続けたのにもかかわらず、反射防止膜層がまったく剥離できなかった。
実施例26で調製した本発明の組成物(12)及び実施例27で調製した本発明の組成物(13)の50mLを、別々の200mLのポリビーカーに入れ、上で述べた評価用基板サンプルのレジスト層及びレジスト硬化層を除去して、反射防止膜層を露出させた基板を、室温で、紫外線を照射せずに、ゆるやかに攪拌しつつ浸漬し、浸漬中での反射防止膜層の剥離を目視で観察した。しかしながら、30分間も浸漬し続けたのにもかかわらず、反射防止膜層がまったく剥離できなかった。
200mLのポリビーカーに、実施例28で調製した組成物(14)の50mLを入れ、上で述べた評価用基板サンプルのレジスト層及びレジスト硬化層を除去して、反射防止膜層を露出させた基板を、加熱をせずに室温で、ゆるやかに攪拌しつつ浸漬し、浸漬中での反射防止膜層の剥離を目視で観察した。しかしながら、30分間も浸漬し続けたのにもかかわらず、反射防止膜層がまったく剥離できなかった。
実施例32〜36では、表5に示す各成分を用いて、表5に示す量を仕込んだ以外は、実施例1と同様にして、本発明の組成物(15)〜(19)を得た。本発明の組成物(15)〜(19)の組成を表5に示す。なお、表5に示す数値は、組成物の総量を100%とした場合における各成分の%濃度である。
200mLのポリビーカーに、実施例1で調製した本発明の組成物(1)の50mLを入れ、上で述べた評価用基板サンプルを、室温で、紫外線照射装置(株式会社モリテックス製 UV照射装置 MUV-35U MUV-PF001 フィルター付き)で中心波長320nmの光を照射しながら、ゆるやかに攪拌しつつ5分間浸漬し続けた。その後、純水で30秒間リンスし、基板表面を圧縮空気で乾燥した。乾燥後の基板サンプルを目視で観察したところ、レジスト層及びレジスト硬化層については残渣もなく良好に剥離できており、反射防止膜層については、その90%以上が剥離できていることを確認した。実施例12は、本発明の組成物(1)に評価用基板サンプルを30分間浸漬し続けた場合の評価結果であるが、実施例37は、同一の組成物(1)を用い、実施例12と同一条件で評価用基板サンプルを5分間浸漬し続けた場合の評価結果である。この結果から、本発明の組成物(1)は、基板サンプルを長時間(30分間)浸漬せずとも、すなわち、短時間(5分間)浸漬しただけであっても、反射防止膜層(BARC層)のみならず、レジスト層やレジスト硬化層をも同時に剥離できることを確認した。
実施例38〜42では、本発明の組成物(15)〜(19)について実施例12と同様の方法により、5分間浸漬を行って、レジスト層、レジスト硬化層及び反射防止膜層の剥離性能を目視で観察した。その結果を実施例37の結果も併せて表6に示す。
Claims (22)
- 水中でフッ素イオンを発生する化合物、炭素ラジカル発生剤及び水とを含有することを特徴とする半導体表面用処理剤組成物。
- 更に酸を含有することを特徴とする請求項1に記載の組成物。
- 更に有機溶剤を含有することを特徴とする請求項1に記載の組成物。
- 更に還元剤を含有することを特徴とする請求項3に記載の組成物。
- 更に界面活性剤を含有することを特徴とする請求項4に記載の組成物。
- 前記半導体表面用処理剤が、反射防止膜層用剥離剤である請求項1に記載の組成物。
- 前記半導体表面用処理剤が、BARC層用剥離剤である請求項3に記載の組成物。
- 前記水中でフッ素イオンを発生する化合物が、フッ化水素酸と無機非金属の塩基との塩である請求項1に記載の組成物。
- 前記フッ化水素酸と無機非金属の塩基との塩が、フッ化アンモニウムである請求項8に記載の組成物。
- 前記炭素ラジカル発生剤が、波長200〜750nmの光照射によって炭素ラジカルを発生する化合物である請求項1に記載の組成物。
- 前記酸が、脂肪族又は芳香族ジカルボン酸及び脂肪族又は芳香族ヒドロキシカルボン酸から選ばれる少なくとも1種のものである請求項2に記載の組成物。
- 前記脂肪族又は芳香族ジカルボン酸及び脂肪族又は芳香族ヒドロキシカルボン酸が、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、マレイン酸、フマル酸、リンゴ酸、酒石酸、クエン酸及びフタル酸から選ばれる少なくとも1種のものである請求項11に記載の組成物。
- 前記脂肪族又は芳香族ジカルボン酸及び脂肪族又は芳香族ヒドロキシカルボン酸が、シュウ酸、リンゴ酸、酒石酸及びクエン酸から選ばれる少なくとも1種のものである請求項11に記載の組成物。
- 前記有機溶剤が、アルコール系、エステル系、アミド系又はスルホキシド系の有機溶剤から選ばれる少なくとも1種のものであって、選ばれた各々の有機溶剤自体の双極子モーメントが1.5〜7.5debyeであり、かつ選ばれた各々の有機溶剤自体の比重が0.7〜1.2の範囲のものである請求項3に記載の組成物。
- 前記有機溶剤が、イソプロピルアルコール、γ-ブチロラクトン、N-メチルピロリドンから選ばれる少なくとも1種のものである請求項3に記載の組成物。
- 前記還元剤が、アスコルビン酸及びアスコルビン酸エステルから選ばれる少なくとも1種のものである請求項4に記載の組成物。
- 前記半導体表面用処理剤が反射防止膜層用剥離剤であって、当該反射防止膜層の下層がLow-k膜である、pH7以下の請求項2に記載の組成物。
- 前記半導体表面用処理剤が反射防止膜層用剥離剤であって、当該反射防止膜層の下層がLow-k膜である、pHが1〜4の範囲の請求項2に記載の組成物。
- 前記水中でフッ素イオンを発生する化合物の重量%が0.01〜5重量%、前記炭素ラジカル発生剤の重量%が0.05〜10重量%、前記水の重量%が0.02〜10重量%、前記酸の重量%が0.1〜5重量%、前記有機溶剤の重量%が80〜99重量%、前記還元剤の重量%が0.001〜5重量%、及び前記界面活性剤の重量%が0.05〜5重量%である、請求項5に記載の組成物。
- 多層銅配線構造の半導体基板に使用するものである請求項1に記載の組成物。
- 多層銅配線構造の半導体基板に使用するものである請求項3に記載の組成物。
- 請求項1に記載の組成物を用いることを特徴とする半導体表面の処理方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010501971A JP5375820B2 (ja) | 2008-03-07 | 2009-03-06 | 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008058816 | 2008-03-07 | ||
JP2008058816 | 2008-03-07 | ||
PCT/JP2009/054248 WO2009110582A1 (ja) | 2008-03-07 | 2009-03-06 | 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 |
JP2010501971A JP5375820B2 (ja) | 2008-03-07 | 2009-03-06 | 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009110582A1 true JPWO2009110582A1 (ja) | 2011-07-14 |
JP5375820B2 JP5375820B2 (ja) | 2013-12-25 |
Family
ID=41056132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010501971A Expired - Fee Related JP5375820B2 (ja) | 2008-03-07 | 2009-03-06 | 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8828918B2 (ja) |
EP (1) | EP2249206B1 (ja) |
JP (1) | JP5375820B2 (ja) |
KR (1) | KR20100120236A (ja) |
CN (1) | CN101960388B (ja) |
IL (1) | IL207988A0 (ja) |
SG (1) | SG188872A1 (ja) |
TW (1) | TWI460557B (ja) |
WO (1) | WO2009110582A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI460557B (zh) * | 2008-03-07 | 2014-11-11 | Wako Pure Chem Ind Ltd | 半導體表面用處理劑組成物及使用半導體表面用處理劑組成物之半導體表面處理方法 |
CN102484057B (zh) * | 2009-09-02 | 2015-10-14 | 和光纯药工业株式会社 | 半导体表面用处理剂组合物和使用该组合物的半导体表面的处理方法 |
EP2474862B1 (en) * | 2009-09-02 | 2015-02-25 | Wako Pure Chemical Industries, Ltd. | Composition for removing a resist on a semiconductor substrate and method for removing resist using the composition |
JP5948758B2 (ja) * | 2010-08-31 | 2016-07-06 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び洗浄方法 |
CN103076725A (zh) * | 2013-01-31 | 2013-05-01 | 北京七星华创电子股份有限公司 | 一种去除光刻胶的溶液及其应用 |
CN103242985B (zh) * | 2013-04-03 | 2014-07-30 | 云南北方奥雷德光电科技股份有限公司 | 一种有机发光微型显示器抗反射层清洗工艺 |
ES2709023T3 (es) | 2014-01-24 | 2019-04-12 | Fujifilm Wako Pure Chemical Corp | Generador de bases basado en borato, y composición reactiva frente a bases que comprende dicho generador de bases |
JP6402007B2 (ja) * | 2014-11-14 | 2018-10-10 | 野村マイクロ・サイエンス株式会社 | レジスト剥離液及びレジスト剥離方法 |
KR102427699B1 (ko) * | 2015-04-27 | 2022-08-01 | 삼성전자주식회사 | 포토레지스트 제거용 조성물 및 이를 이용한 반도체 장치의 제조 방법 |
MY192579A (en) * | 2017-03-31 | 2022-08-29 | Kanto Kagaku | Cleaning solution composition |
KR20210003740A (ko) * | 2018-04-27 | 2021-01-12 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 수성 조성물 및 이것을 이용한 세정방법 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814563A (en) | 1996-04-29 | 1998-09-29 | Applied Materials, Inc. | Method for etching dielectric using fluorohydrocarbon gas, NH3 -generating gas, and carbon-oxygen gas |
US5843847A (en) | 1996-04-29 | 1998-12-01 | Applied Materials, Inc. | Method for etching dielectric layers with high selectivity and low microloading |
CN1872976A (zh) * | 2000-03-21 | 2006-12-06 | 和光纯药工业株式会社 | 半导体基板洗涤剂和洗涤方法 |
JP4959095B2 (ja) * | 2000-07-10 | 2012-06-20 | イーケイシー テクノロジー インコーポレーテッド | 半導体デバイスの有機及びプラズマエッチング残さの洗浄用組成物 |
US7456140B2 (en) * | 2000-07-10 | 2008-11-25 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
DE60217247T2 (de) * | 2001-09-28 | 2007-10-04 | Jsr Corp. | Gestapelte Schicht, isolierender Film und Substrate für Halbleiter |
US20030171239A1 (en) * | 2002-01-28 | 2003-09-11 | Patel Bakul P. | Methods and compositions for chemically treating a substrate using foam technology |
US20040038840A1 (en) * | 2002-04-24 | 2004-02-26 | Shihying Lee | Oxalic acid as a semiaqueous cleaning product for copper and dielectrics |
WO2004019134A1 (ja) | 2002-08-22 | 2004-03-04 | Daikin Industries, Ltd. | 剥離液 |
ATE405622T1 (de) * | 2002-10-22 | 2008-09-15 | Ekc Technology Inc | Wässrige phosphorsäurezusammensetzung zur reinigung von halbleiter-vorrichtungen |
JP2004241414A (ja) | 2003-02-03 | 2004-08-26 | Sharp Corp | 剥離洗浄装置 |
TWI362415B (en) * | 2003-10-27 | 2012-04-21 | Wako Pure Chem Ind Ltd | Novel detergent and method for cleaning |
JP2007519942A (ja) * | 2003-12-02 | 2007-07-19 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | レジスト、barc、およびギャップフィル材料を剥離する化学物質ならびに方法 |
JP2005209953A (ja) * | 2004-01-23 | 2005-08-04 | Tokyo Ohka Kogyo Co Ltd | 剥離洗浄液、該剥離洗浄液を用いた半導体基板洗浄方法および金属配線形成方法 |
CN1654617A (zh) * | 2004-02-10 | 2005-08-17 | 捷时雅株式会社 | 清洗用组合物和半导体基板的清洗方法及半导体装置的制造方法 |
JP4440689B2 (ja) * | 2004-03-31 | 2010-03-24 | 東友ファインケム株式会社 | レジスト剥離剤組成物 |
JP4722550B2 (ja) * | 2004-06-16 | 2011-07-13 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
US7723238B2 (en) | 2004-06-16 | 2010-05-25 | Tokyo Electron Limited | Method for preventing striation at a sidewall of an opening of a resist during an etching process |
JP4776191B2 (ja) * | 2004-08-25 | 2011-09-21 | 関東化学株式会社 | フォトレジスト残渣及びポリマー残渣除去組成物、並びにそれを用いた残渣除去方法 |
JP2006106616A (ja) | 2004-10-08 | 2006-04-20 | Tokyo Ohka Kogyo Co Ltd | ホトレジスト除去用処理液および基板の処理方法 |
JP2006137831A (ja) * | 2004-11-11 | 2006-06-01 | Mitsubishi Chemicals Corp | 変性ポリエステル系熱可塑性エラストマー組成物及びこれを用いてなる塗装成形品 |
CN102981377B (zh) * | 2005-06-07 | 2014-11-12 | 高级技术材料公司 | 金属和电介质相容的牺牲性抗反射涂层清洗及去除组合物 |
JP2008547050A (ja) * | 2005-06-16 | 2008-12-25 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 硬化フォトレジスト、エッチング後残渣および/または下層反射防止コーティング層の除去のための濃厚流体組成物 |
TW200714636A (en) | 2005-09-05 | 2007-04-16 | Fuji Photo Film Co Ltd | Composition, film and producing method therefor |
JP2007084642A (ja) * | 2005-09-21 | 2007-04-05 | Mitsubishi Gas Chem Co Inc | ポリエステル樹脂組成物 |
JP5047571B2 (ja) * | 2005-09-21 | 2012-10-10 | 三菱瓦斯化学株式会社 | ポリアミド延伸フィルム |
TW200722505A (en) * | 2005-09-30 | 2007-06-16 | Rohm & Haas Elect Mat | Stripper |
JP2007284652A (ja) * | 2006-03-20 | 2007-11-01 | Fujifilm Corp | 組成物、膜、およびその製造方法 |
US7947637B2 (en) * | 2006-06-30 | 2011-05-24 | Fujifilm Electronic Materials, U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
PL2039507T3 (pl) * | 2006-07-12 | 2018-08-31 | Gunze Limited | Wielowarstwowa folia termokurczliwa i etykieta termokurczliwa |
TW200946448A (en) * | 2007-10-29 | 2009-11-16 | Ekc Technology Inc | Stabilization of hydroxylamine containing solutions and method for their preparation |
WO2009058278A1 (en) * | 2007-10-29 | 2009-05-07 | Ekc Technology, Inc | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions |
TW200940705A (en) * | 2007-10-29 | 2009-10-01 | Ekc Technology Inc | Copper CMP polishing pad cleaning composition comprising of amidoxime compounds |
TW200946621A (en) * | 2007-10-29 | 2009-11-16 | Ekc Technology Inc | Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use |
TW200941582A (en) * | 2007-10-29 | 2009-10-01 | Ekc Technology Inc | Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions |
US20090137439A1 (en) * | 2007-11-28 | 2009-05-28 | Dinh Xuan-Dung Thi | Printer Head and Printer Disk Cleaning Compositions and Methods of Use |
TWI460557B (zh) * | 2008-03-07 | 2014-11-11 | Wako Pure Chem Ind Ltd | 半導體表面用處理劑組成物及使用半導體表面用處理劑組成物之半導體表面處理方法 |
US20090270299A1 (en) * | 2008-04-23 | 2009-10-29 | Nissan Chemical Industries, Ltd. | Composition for removing protective layer in fabrication of MEMS and method for removing same |
US7947130B2 (en) * | 2009-10-24 | 2011-05-24 | Wai Mun Lee | Troika acid semiconductor cleaning compositions and methods of use |
-
2009
- 2009-03-04 TW TW098106940A patent/TWI460557B/zh not_active IP Right Cessation
- 2009-03-06 JP JP2010501971A patent/JP5375820B2/ja not_active Expired - Fee Related
- 2009-03-06 WO PCT/JP2009/054248 patent/WO2009110582A1/ja active Application Filing
- 2009-03-06 EP EP09716388.5A patent/EP2249206B1/en not_active Not-in-force
- 2009-03-06 SG SG2013017249A patent/SG188872A1/en unknown
- 2009-03-06 US US12/921,302 patent/US8828918B2/en not_active Expired - Fee Related
- 2009-03-06 KR KR1020107022326A patent/KR20100120236A/ko not_active Application Discontinuation
- 2009-03-06 CN CN200980108005.3A patent/CN101960388B/zh not_active Expired - Fee Related
-
2010
- 2010-09-05 IL IL207988A patent/IL207988A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20110021400A1 (en) | 2011-01-27 |
CN101960388B (zh) | 2012-11-28 |
KR20100120236A (ko) | 2010-11-12 |
EP2249206A4 (en) | 2011-11-23 |
IL207988A0 (en) | 2010-12-30 |
SG188872A1 (en) | 2013-04-30 |
JP5375820B2 (ja) | 2013-12-25 |
TW200949464A (en) | 2009-12-01 |
EP2249206B1 (en) | 2014-07-02 |
EP2249206A1 (en) | 2010-11-10 |
WO2009110582A1 (ja) | 2009-09-11 |
US8828918B2 (en) | 2014-09-09 |
TWI460557B (zh) | 2014-11-11 |
CN101960388A (zh) | 2011-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5375820B2 (ja) | 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 | |
JP5652399B2 (ja) | 半導体表面用処理剤組成物及びそれを用いた半導体表面の処理方法 | |
JP5598477B2 (ja) | レジスト剥離剤組成物及び当該組成物を用いたレジストの剥離方法 | |
JP6309999B2 (ja) | 窒化チタンハードマスク及びエッチ残留物除去 | |
JP6339555B2 (ja) | 高いwn/w選択率を有するストリッピング組成物 | |
JP4628209B2 (ja) | 剥離剤組成物 | |
JP2002184743A (ja) | ストリッピング組成物 | |
CN1650235A (zh) | 光致抗蚀剂剥离方法 | |
CN111356759A (zh) | 剥离剂溶液和使用剥离剂溶液的方法 | |
KR20200077839A (ko) | 식각액 조성물 | |
JP5007089B2 (ja) | レジストの剥離方法 | |
KR20170114476A (ko) | 레지스트 박리제 조성물 제조방법 | |
WO2023049688A1 (en) | Post-dry etching photoresist and metal containing residue removal formulation | |
KR20130021213A (ko) | 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111227 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130122 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130827 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130909 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |