JPWO2008062731A1 - 携帯型電子機器 - Google Patents
携帯型電子機器 Download PDFInfo
- Publication number
- JPWO2008062731A1 JPWO2008062731A1 JP2008545384A JP2008545384A JPWO2008062731A1 JP WO2008062731 A1 JPWO2008062731 A1 JP WO2008062731A1 JP 2008545384 A JP2008545384 A JP 2008545384A JP 2008545384 A JP2008545384 A JP 2008545384A JP WO2008062731 A1 JPWO2008062731 A1 JP WO2008062731A1
- Authority
- JP
- Japan
- Prior art keywords
- ffc
- portable electronic
- group
- electronic device
- ffcs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
また、シール材料を密閉に使用するには、あらかじめFFC間にシール材料を流した状態で硬化させておくこと、FFC幅全体に密閉されていることを保証することが条件となり、生産性において、不利となる。
シール部材を介して複数の筐体片が組み付けられてなる、内部に電子回路が内蔵された筐体、および
上記電子回路に接続されている複数の電気信号線が並んだフラットケーブルが厚み方向に複数積み重ねられた、隣接するフラットケーブルどうしが全長のうちの少なくとも一部の箇所で接着性材料を介して互いに接着されていると共にこの箇所で上記筐体のシール部材と一体成型されているフラットケーブル群を備えたことを特徴とする。
また、両面テープの幅がFFCの幅以上である場合を例に挙げて説明したが、両面テープの幅がFFCの幅未満であっても、本発明の基本的効果は減却されない。また、以上の説明では、携帯電話を例に挙げて説明したが、これに限るものではない。
Claims (3)
- シール部材を介して複数の筐体片が組み付けられてなる、内部に電子回路が内蔵された筐体、および
前記電子回路に接続されている複数の電気信号線が並んだフラットケーブルが厚み方向に複数積み重ねられた、隣接するフラットケーブルどうしが全長のうちの少なくとも一部の箇所で接着性材料を介して互いに接着されていると共に該箇所で前記筐体のシール部材と一体成型されているフラットケーブル群を備えたことを特徴とする携帯型電子機器。 - 前記フラットケーブル群は、前記フラットケーブルの幅以上の幅の接着性材料を介して、隣接するフラットケーブルどうしが接着されているものであることを特徴とする請求項1記載の携帯型電子機器。
- 前記接着性材料は、両面テープ類による接着性材料とすることを特徴とする請求項1記載の携帯型電子機器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006316760 | 2006-11-24 | ||
JP2006316760 | 2006-11-24 | ||
PCT/JP2007/072299 WO2008062731A1 (en) | 2006-11-24 | 2007-11-16 | Portable electronic device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009186597A Division JP4825904B2 (ja) | 2006-11-24 | 2009-08-11 | 携帯型電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008062731A1 true JPWO2008062731A1 (ja) | 2010-03-04 |
JP4580018B2 JP4580018B2 (ja) | 2010-11-10 |
Family
ID=39429664
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008545384A Active JP4580018B2 (ja) | 2006-11-24 | 2007-11-16 | 携帯型電子機器 |
JP2009186597A Active JP4825904B2 (ja) | 2006-11-24 | 2009-08-11 | 携帯型電子機器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009186597A Active JP4825904B2 (ja) | 2006-11-24 | 2009-08-11 | 携帯型電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8129632B2 (ja) |
EP (1) | EP2086208A4 (ja) |
JP (2) | JP4580018B2 (ja) |
CN (1) | CN101543025B (ja) |
WO (1) | WO2008062731A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4916388B2 (ja) * | 2007-06-19 | 2012-04-11 | 三洋電機株式会社 | 携帯用電子機器 |
JP2010056705A (ja) * | 2008-08-27 | 2010-03-11 | Fujitsu Ltd | 電子装置及びフラットケーブル |
JP2010087466A (ja) * | 2008-09-02 | 2010-04-15 | Nok Corp | モバイル防水機器及びその製造方法 |
JP5307631B2 (ja) * | 2009-05-27 | 2013-10-02 | 京セラ株式会社 | 携帯電子機器 |
US8625290B2 (en) * | 2009-10-15 | 2014-01-07 | Samsung Electronics Co., Ltd. | Waterproof structure for portable terminal |
KR101281895B1 (ko) * | 2011-08-24 | 2013-07-03 | 주식회사 팬택 | Fpc 방수 구조체 |
JP2013165560A (ja) * | 2012-02-10 | 2013-08-22 | Denso Corp | 電気接続箱 |
US11375629B2 (en) * | 2019-09-26 | 2022-06-28 | Apple Inc. | Rotating frame lock for front crystal retention and sealing |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252519A (ja) * | 1993-03-01 | 1994-09-09 | Sharp Corp | 多層フレキシブル配線板 |
JP2003142836A (ja) * | 2001-11-05 | 2003-05-16 | Seiko Instruments Inc | 電子機器 |
JP2004214927A (ja) * | 2002-12-27 | 2004-07-29 | Casio Comput Co Ltd | 携帯用電子機器 |
JP2006093510A (ja) * | 2004-09-27 | 2006-04-06 | Fujitsu Ltd | 携帯型電子装置 |
JP2006196590A (ja) * | 2005-01-12 | 2006-07-27 | Nippon Mektron Ltd | 多層フレキシブルプリント基板およびその製造方法 |
JP2007237592A (ja) * | 2006-03-09 | 2007-09-20 | Nok Corp | シールの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4195201A (en) * | 1978-05-10 | 1980-03-25 | Western Electric Company, Incorporated | Inductive coil module |
US4839716A (en) * | 1987-06-01 | 1989-06-13 | Olin Corporation | Semiconductor packaging |
US5138114A (en) * | 1990-09-27 | 1992-08-11 | Texas Instruments Incorporated | Hybrid/microwave enclosures and method of making same |
US5093989A (en) * | 1990-11-13 | 1992-03-10 | Frenchtown Ceramics Co. | Method of making heat-resistant hermetic packages for electronic components |
US5247424A (en) * | 1992-06-16 | 1993-09-21 | International Business Machines Corporation | Low temperature conduction module with gasket to provide a vacuum seal and electrical connections |
US5491300A (en) * | 1994-04-28 | 1996-02-13 | Cray Computer Corporation | Penetrator and flexible circuit assembly for sealed environment |
US5681176A (en) * | 1994-12-05 | 1997-10-28 | Nec Corporation | Hinge connector suitable for use in a hinge portion included in an electronic device |
US6521989B2 (en) * | 1998-10-08 | 2003-02-18 | Honeywell Inc. | Methods and apparatus for hermetically sealing electronic packages |
JP2002198664A (ja) | 2000-12-26 | 2002-07-12 | Seiko Instruments Inc | 携帯電子機器 |
KR100704388B1 (ko) | 2002-04-11 | 2007-04-10 | 엔오케이 가부시키가이샤 | 밀봉구조 |
JP4319385B2 (ja) | 2002-10-10 | 2009-08-26 | 株式会社東芝 | 移動通信端末装置及びフレキシブル基板 |
JP4258295B2 (ja) | 2003-07-07 | 2009-04-30 | 富士通株式会社 | 折り畳み型携帯端末 |
EP2184151A4 (en) * | 2007-09-05 | 2011-05-25 | Nok Corp | PROCESS FOR PRODUCING HERMETIC SEALING |
-
2007
- 2007-11-16 CN CN2007800429763A patent/CN101543025B/zh not_active Expired - Fee Related
- 2007-11-16 EP EP07832029A patent/EP2086208A4/en not_active Withdrawn
- 2007-11-16 WO PCT/JP2007/072299 patent/WO2008062731A1/ja active Application Filing
- 2007-11-16 JP JP2008545384A patent/JP4580018B2/ja active Active
-
2009
- 2009-05-20 US US12/453,742 patent/US8129632B2/en not_active Expired - Fee Related
- 2009-08-11 JP JP2009186597A patent/JP4825904B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252519A (ja) * | 1993-03-01 | 1994-09-09 | Sharp Corp | 多層フレキシブル配線板 |
JP2003142836A (ja) * | 2001-11-05 | 2003-05-16 | Seiko Instruments Inc | 電子機器 |
JP2004214927A (ja) * | 2002-12-27 | 2004-07-29 | Casio Comput Co Ltd | 携帯用電子機器 |
JP2006093510A (ja) * | 2004-09-27 | 2006-04-06 | Fujitsu Ltd | 携帯型電子装置 |
JP2006196590A (ja) * | 2005-01-12 | 2006-07-27 | Nippon Mektron Ltd | 多層フレキシブルプリント基板およびその製造方法 |
JP2007237592A (ja) * | 2006-03-09 | 2007-09-20 | Nok Corp | シールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2086208A4 (en) | 2010-06-23 |
EP2086208A1 (en) | 2009-08-05 |
WO2008062731A1 (en) | 2008-05-29 |
US8129632B2 (en) | 2012-03-06 |
JP2009261032A (ja) | 2009-11-05 |
CN101543025A (zh) | 2009-09-23 |
JP4825904B2 (ja) | 2011-11-30 |
JP4580018B2 (ja) | 2010-11-10 |
US20090229878A1 (en) | 2009-09-17 |
CN101543025B (zh) | 2012-08-22 |
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