JPWO2007094167A1 - 回路基板および回路基板の製造方法 - Google Patents
回路基板および回路基板の製造方法 Download PDFInfo
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- JPWO2007094167A1 JPWO2007094167A1 JP2008500433A JP2008500433A JPWO2007094167A1 JP WO2007094167 A1 JPWO2007094167 A1 JP WO2007094167A1 JP 2008500433 A JP2008500433 A JP 2008500433A JP 2008500433 A JP2008500433 A JP 2008500433A JP WO2007094167 A1 JPWO2007094167 A1 JP WO2007094167A1
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- wiring board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
2 配線基板
3 ICチップ(電子部品)
4 第1樹脂層
4a,40 異方導電性樹脂
5 第2樹脂層
5a 接着剤
21 上面
22 アンテナ
23,32 電極
31 チップ本体
33 バンプ
42 部材
91 チップ保持部
92 押圧ツール
311 下面
331 突起部
図1は本発明の実施の形態に係る回路基板1の構成を示す平面図であり、図2は回路基板1を図1の2−2線の位置で切断した一部を示す断面図である。
図1は本発明の実施の形態に係る回路基板1の構成を示す平面図であり、図2は回路基板1を図1の2−2線の位置で切断した一部を示す断面図である。
2 配線基板
3 ICチップ(電子部品)
4 第1樹脂層
4a,40 異方導電性樹脂
5 第2樹脂層
5a 接着剤
21 上面
22 アンテナ
23,32 電極
31 チップ本体
33 バンプ
42 部材
91 チップ保持部
92 押圧ツール
311 下面
331 突起部
Claims (10)
- a)電子部品の複数のバンプのみに導電性粒子を含む異方導電性樹脂を付与するステップと、
b)前記異方導電性樹脂を介して可撓性の配線基板の主面上に前記電子部品を配置するステップと、
c)前記電子部品を前記配線基板に押圧して前記複数のバンプに付与された前記異方導電性樹脂を硬化させ、前記複数のバンプを前記配線基板の配線に接合するステップと、
を含むことを特徴とする回路基板の製造方法。 - 前記c)ステップにおいて、前記異方導電性樹脂を硬化させることにより、前記電子部品のエッジよりも内側において前記複数のバンプを個別に覆う第1樹脂層が形成されることを特徴とする請求項1に記載の回路基板の製造方法。
- 前記a)ステップにおける前記異方導電性樹脂の付与が、層状の異方導電性樹脂に前記電子部品の前記複数のバンプのみを接触させることにより行われることを特徴とする請求項1に記載の回路基板の製造方法。
- 前記b)ステップよりも前に、前記配線基板上の前記電子部品が実装される予定の領域のうち、前記複数のバンプが接合される予定の領域以外の一部の領域に非導電性の接着剤を付与するステップと、
前記c)ステップと並行して、前記接着剤を硬化させて第2樹脂層を形成し前記電子部品を前記配線基板に固定するステップと、
をさらに含むことを特徴とする請求項1に記載の回路基板の製造方法。 - 前記複数のバンプが、先端部に突起部を有するボールバンプであることを特徴とする請求項1に記載の回路基板の製造方法。
- 前記電子部品が、所定の情報を記憶する記憶素子であり、
前記配線基板が、前記電子部品と電気的に接続されて前記電子部品に記憶されている前記所定の情報の読み取りに利用される無線通信用のアンテナを備えることを特徴とする請求項1に記載の回路基板の製造方法。 - 前記配線基板の厚さが、5μm以上50μm以下であることを特徴とする請求項1に記載の回路基板の製造方法。
- 可撓性の配線基板と、
前記配線基板の主面上に複数のバンプを介して実装される電子部品と、
導電性粒子を含む異方導電性樹脂により形成され、前記複数のバンプを個別に覆う第1樹脂層と、
前記電子部品と前記配線基板を固定する第2樹脂層と、
を備えることを特徴とする回路基板。 - 前記第1樹脂層が、前記電子部品のエッジよりも内側に位置することを特徴とする請求項8に記載の回路基板。
- 前記電子部品が、所定の情報を記憶する記憶素子であり、
前記配線基板が、前記電子部品と電気的に接続されて前記電子部品に記憶されている前記所定の情報の読み取りに利用される無線通信用のアンテナを備えることを特徴とする請求項8に記載の回路基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008500433A JP5029597B2 (ja) | 2006-02-13 | 2007-01-31 | カード型記録媒体およびカード型記録媒体の製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2006034813 | 2006-02-13 | ||
JP2006034813 | 2006-02-13 | ||
PCT/JP2007/051542 WO2007094167A1 (ja) | 2006-02-13 | 2007-01-31 | 回路基板および回路基板の製造方法 |
JP2008500433A JP5029597B2 (ja) | 2006-02-13 | 2007-01-31 | カード型記録媒体およびカード型記録媒体の製造方法 |
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JPWO2007094167A1 true JPWO2007094167A1 (ja) | 2009-07-02 |
JP5029597B2 JP5029597B2 (ja) | 2012-09-19 |
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US (2) | US8291582B2 (ja) |
JP (1) | JP5029597B2 (ja) |
CN (1) | CN101385402B (ja) |
WO (1) | WO2007094167A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009094353A (ja) * | 2007-10-10 | 2009-04-30 | Furukawa Electric Co Ltd:The | 半導体装置およびその製造方法 |
JP5266723B2 (ja) * | 2007-11-07 | 2013-08-21 | 富士通株式会社 | Rfidタグ製造方法 |
JP5239722B2 (ja) * | 2008-10-10 | 2013-07-17 | 富士通株式会社 | マイクロ可動素子および光スイッチング装置 |
CN102342189B (zh) * | 2009-03-26 | 2014-03-19 | 夏普株式会社 | 芯片部件安装结构、芯片部件安装方法以及液晶显示装置 |
US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
US8384121B2 (en) * | 2010-06-29 | 2013-02-26 | Cooledge Lighting Inc. | Electronic devices with yielding substrates |
US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
JP2011146421A (ja) * | 2010-01-12 | 2011-07-28 | Fujikura Ltd | 端子接続構造 |
EP2378846A1 (de) * | 2011-01-25 | 2011-10-19 | Bayer Material Science AG | Dekorative Produktoberfläche mit Leiterplattenfunktion |
US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
JP6398554B2 (ja) * | 2014-09-30 | 2018-10-03 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP6458493B2 (ja) * | 2014-12-25 | 2019-01-30 | 大日本印刷株式会社 | Led素子用基板、及びそれを用いたled実装モジュールの製造方法 |
JP6573215B2 (ja) * | 2016-01-27 | 2019-09-11 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
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- 2007-01-31 WO PCT/JP2007/051542 patent/WO2007094167A1/ja active Application Filing
- 2007-01-31 CN CN2007800052184A patent/CN101385402B/zh not_active Expired - Fee Related
- 2007-01-31 US US12/161,907 patent/US8291582B2/en not_active Expired - Fee Related
- 2007-01-31 JP JP2008500433A patent/JP5029597B2/ja not_active Expired - Fee Related
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JP2001068815A (ja) * | 1999-08-25 | 2001-03-16 | Hitachi Chem Co Ltd | 配線板とその製造方法 |
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US20090166064A1 (en) | 2009-07-02 |
CN101385402B (zh) | 2012-03-21 |
CN101385402A (zh) | 2009-03-11 |
JP5029597B2 (ja) | 2012-09-19 |
US20130010436A1 (en) | 2013-01-10 |
WO2007094167A1 (ja) | 2007-08-23 |
US8866021B2 (en) | 2014-10-21 |
US8291582B2 (en) | 2012-10-23 |
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