JPWO2005067362A1 - 電磁波シールドフィルタ用銅箔及び電磁波シールドフィルタ - Google Patents
電磁波シールドフィルタ用銅箔及び電磁波シールドフィルタ Download PDFInfo
- Publication number
- JPWO2005067362A1 JPWO2005067362A1 JP2005516850A JP2005516850A JPWO2005067362A1 JP WO2005067362 A1 JPWO2005067362 A1 JP WO2005067362A1 JP 2005516850 A JP2005516850 A JP 2005516850A JP 2005516850 A JP2005516850 A JP 2005516850A JP WO2005067362 A1 JPWO2005067362 A1 JP WO2005067362A1
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- electromagnetic wave
- wave shielding
- shielding filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 146
- 239000011889 copper foil Substances 0.000 title claims abstract description 95
- 229910052802 copper Inorganic materials 0.000 claims abstract description 51
- 239000010949 copper Substances 0.000 claims abstract description 51
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010941 cobalt Substances 0.000 claims abstract description 31
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 31
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 31
- 239000011701 zinc Substances 0.000 claims abstract description 31
- 229910052750 molybdenum Inorganic materials 0.000 claims description 13
- 239000011733 molybdenum Substances 0.000 claims description 13
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 10
- 239000010419 fine particle Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 69
- 238000007747 plating Methods 0.000 description 17
- 238000005530 etching Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000007788 roughening Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 238000011282 treatment Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 molybdenum ions Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910021503 Cobalt(II) hydroxide Inorganic materials 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910021446 cobalt carbonate Inorganic materials 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- ZOTKGJBKKKVBJZ-UHFFFAOYSA-L cobalt(2+);carbonate Chemical compound [Co+2].[O-]C([O-])=O ZOTKGJBKKKVBJZ-UHFFFAOYSA-L 0.000 description 1
- ASKVAEGIVYSGNY-UHFFFAOYSA-L cobalt(ii) hydroxide Chemical compound [OH-].[OH-].[Co+2] ASKVAEGIVYSGNY-UHFFFAOYSA-L 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 229940043825 zinc carbonate Drugs 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 229960001939 zinc chloride Drugs 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
(8)本発明は、また、プラズマディスプレイパネル用に用いられる(7)に記載の電磁波シールドフィルタに関する。
Claims (8)
- 少なくとも一方の表面の明度がL*で1〜20、色度がa*、b*で各々+5から−5であることを特徴とする、電磁波シールドフィルタ用銅箔。
- 銅箔層と、銅箔層の少なくとも片面上の銅、コバルト及び亜鉛を含有する着色層とを有し、着色層が、明度がL*で1〜20、色度がa*、b*で各々+5から−5である表面と銅箔層との間に位置することを特徴とする請求項1に記載の電磁波シールドフィルタ用銅箔。
- 着色層の銅、コバルト及び亜鉛の含有量が、銅、コバルト及び亜鉛の合計量に対して、銅が40〜70重量%、コバルトが10〜30重量%、亜鉛が10〜30重量%であることを特徴とする請求項1又は2に記載の電磁波シールドフィルタ用銅箔。
- 着色層の銅、コバルト及び亜鉛の含有量の合計量が3〜10mg/dm2であることを特徴とする請求項1〜3いずれかに記載の電磁波シールドフィルタ用銅箔。
- 少なくとも一方の表面の表面粗さが、中心線平均粗さRaで0.1〜0.5μmであることを特徴とする請求項1〜4いずれかに記載の電磁波シールドフィルタ用銅箔。
- 銅箔層と、銅箔層の少なくとも片面上のモリブデンを含有する銅微粒子からなる微細粗化層と、微細粗化層上の銅、コバルト及び亜鉛を含有する着色層とを有し、着色層が、明度がL*で1〜20、色度がa*、b*で各+5から−5である表面と微細粗化層との間に位置することを特徴とする請求項1〜5いずれかに記載の電磁波シールドフィルタ用銅箔。
- 請求項1〜6いずれかに記載の電磁波シールドフィルタ用銅箔を用いた電磁波シールドフィルタ。
- プラズマディスプレイパネル用に用いられる請求項7に記載の電磁波シールドフィルタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004000718 | 2004-01-06 | ||
JP2004000718 | 2004-01-06 | ||
PCT/JP2004/019529 WO2005067362A1 (ja) | 2004-01-06 | 2004-12-27 | 電磁波シールドフィルタ用銅箔及び電磁波シールドフィルタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2005067362A1 true JPWO2005067362A1 (ja) | 2007-12-27 |
JP4365372B2 JP4365372B2 (ja) | 2009-11-18 |
Family
ID=34746958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005516850A Active JP4365372B2 (ja) | 2004-01-06 | 2004-12-27 | 電磁波シールドフィルタ用銅箔及び電磁波シールドフィルタ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4365372B2 (ja) |
CN (1) | CN100486411C (ja) |
TW (1) | TWI265088B (ja) |
WO (1) | WO2005067362A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
JP5167181B2 (ja) * | 2009-03-25 | 2013-03-21 | 大日本印刷株式会社 | 電磁波遮蔽フィルタ |
JP5419514B2 (ja) * | 2009-03-30 | 2014-02-19 | 太陽ホールディングス株式会社 | 穴埋め用樹脂組成物及びこの樹脂組成物を充填したプリント配線板 |
CN102181889B (zh) * | 2011-04-08 | 2012-07-04 | 联合铜箔(惠州)有限公司 | 一种电解铜箔用添加剂、电解铜箔生产工艺和电解铜箔 |
JP6186805B2 (ja) * | 2013-03-28 | 2017-08-30 | 大日本印刷株式会社 | タッチパネル |
CN111083936B (zh) * | 2018-08-20 | 2023-11-07 | 株式会社Lg化学 | 用于透明发光器件显示器的嵌入式电极基板及其制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685486A (ja) * | 1992-09-01 | 1994-03-25 | Nippon Sheet Glass Co Ltd | 電磁波遮蔽体 |
JPH1197877A (ja) * | 1997-09-19 | 1999-04-09 | Oji Paper Co Ltd | 電磁波シールド用透明導電性フィルム |
JP3363083B2 (ja) * | 1997-12-17 | 2003-01-07 | 住友大阪セメント株式会社 | 透明基体およびその製造方法 |
WO2000007955A1 (fr) * | 1998-08-05 | 2000-02-17 | Nippon Sheet Glass Co., Ltd. | Article en verre revetu d'un film anti-reflet colore et filtre optique pour panneau d'affichage a plasma |
JP4004161B2 (ja) * | 1998-11-26 | 2007-11-07 | 三井化学株式会社 | 透明積層体及びそれを用いたディスプレイ用フィルター |
JP2000238170A (ja) * | 1998-12-22 | 2000-09-05 | Mitsui Chemicals Inc | 透明導電性フィルム |
JP2002372617A (ja) * | 2001-06-14 | 2002-12-26 | Fuji Photo Film Co Ltd | 光学フィルターおよび画像表示装置 |
JP2003201597A (ja) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
JP2004288972A (ja) * | 2003-03-24 | 2004-10-14 | Shin Etsu Polymer Co Ltd | 電磁波シールド体及びその製造方法 |
-
2004
- 2004-12-27 WO PCT/JP2004/019529 patent/WO2005067362A1/ja active Application Filing
- 2004-12-27 CN CNB2004800399105A patent/CN100486411C/zh not_active Expired - Fee Related
- 2004-12-27 JP JP2005516850A patent/JP4365372B2/ja active Active
-
2005
- 2005-01-03 TW TW94100074A patent/TWI265088B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4365372B2 (ja) | 2009-11-18 |
TWI265088B (en) | 2006-11-01 |
WO2005067362A1 (ja) | 2005-07-21 |
TW200526404A (en) | 2005-08-16 |
CN1902994A (zh) | 2007-01-24 |
CN100486411C (zh) | 2009-05-06 |
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