CN100486411C - 电磁波屏蔽过滤器用铜箔及电磁波屏蔽过滤器 - Google Patents

电磁波屏蔽过滤器用铜箔及电磁波屏蔽过滤器 Download PDF

Info

Publication number
CN100486411C
CN100486411C CNB2004800399105A CN200480039910A CN100486411C CN 100486411 C CN100486411 C CN 100486411C CN B2004800399105 A CNB2004800399105 A CN B2004800399105A CN 200480039910 A CN200480039910 A CN 200480039910A CN 100486411 C CN100486411 C CN 100486411C
Authority
CN
China
Prior art keywords
copper foil
copper
electromagnetic wave
wave shield
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004800399105A
Other languages
English (en)
Chinese (zh)
Other versions
CN1902994A (zh
Inventor
八木桥敦睦
中矢清隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON ELECTROLYTIC CO Ltd
Nippon Denkai Co Ltd
Original Assignee
NIPPON ELECTROLYTIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON ELECTROLYTIC CO Ltd filed Critical NIPPON ELECTROLYTIC CO Ltd
Publication of CN1902994A publication Critical patent/CN1902994A/zh
Application granted granted Critical
Publication of CN100486411C publication Critical patent/CN100486411C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroplating Methods And Accessories (AREA)
CNB2004800399105A 2004-01-06 2004-12-27 电磁波屏蔽过滤器用铜箔及电磁波屏蔽过滤器 Expired - Fee Related CN100486411C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP000718/2004 2004-01-06
JP2004000718 2004-01-06

Publications (2)

Publication Number Publication Date
CN1902994A CN1902994A (zh) 2007-01-24
CN100486411C true CN100486411C (zh) 2009-05-06

Family

ID=34746958

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800399105A Expired - Fee Related CN100486411C (zh) 2004-01-06 2004-12-27 电磁波屏蔽过滤器用铜箔及电磁波屏蔽过滤器

Country Status (4)

Country Link
JP (1) JP4365372B2 (ja)
CN (1) CN100486411C (ja)
TW (1) TWI265088B (ja)
WO (1) WO2005067362A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP5167181B2 (ja) * 2009-03-25 2013-03-21 大日本印刷株式会社 電磁波遮蔽フィルタ
JP5419514B2 (ja) * 2009-03-30 2014-02-19 太陽ホールディングス株式会社 穴埋め用樹脂組成物及びこの樹脂組成物を充填したプリント配線板
CN102181889B (zh) * 2011-04-08 2012-07-04 联合铜箔(惠州)有限公司 一种电解铜箔用添加剂、电解铜箔生产工艺和电解铜箔
JP6186805B2 (ja) * 2013-03-28 2017-08-30 大日本印刷株式会社 タッチパネル
CN111083936B (zh) * 2018-08-20 2023-11-07 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685486A (ja) * 1992-09-01 1994-03-25 Nippon Sheet Glass Co Ltd 電磁波遮蔽体
JPH1197877A (ja) * 1997-09-19 1999-04-09 Oji Paper Co Ltd 電磁波シールド用透明導電性フィルム
JP3363083B2 (ja) * 1997-12-17 2003-01-07 住友大阪セメント株式会社 透明基体およびその製造方法
WO2000007955A1 (fr) * 1998-08-05 2000-02-17 Nippon Sheet Glass Co., Ltd. Article en verre revetu d'un film anti-reflet colore et filtre optique pour panneau d'affichage a plasma
JP4004161B2 (ja) * 1998-11-26 2007-11-07 三井化学株式会社 透明積層体及びそれを用いたディスプレイ用フィルター
JP2000238170A (ja) * 1998-12-22 2000-09-05 Mitsui Chemicals Inc 透明導電性フィルム
JP2002372617A (ja) * 2001-06-14 2002-12-26 Fuji Photo Film Co Ltd 光学フィルターおよび画像表示装置
JP2003201597A (ja) * 2002-01-09 2003-07-18 Nippon Denkai Kk 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体
JP2004288972A (ja) * 2003-03-24 2004-10-14 Shin Etsu Polymer Co Ltd 電磁波シールド体及びその製造方法

Also Published As

Publication number Publication date
JP4365372B2 (ja) 2009-11-18
JPWO2005067362A1 (ja) 2007-12-27
TWI265088B (en) 2006-11-01
WO2005067362A1 (ja) 2005-07-21
TW200526404A (en) 2005-08-16
CN1902994A (zh) 2007-01-24

Similar Documents

Publication Publication Date Title
CN100515167C (zh) 具有黑化处理表面或层的铜箔
EP0998182B1 (en) Electromagnetic shield plate
CN104602909B (zh) 金属结构体及其制造方法
US7569282B2 (en) Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
JP2002271086A (ja) 電磁波シールド板及びその製造方法
EP1024683A2 (en) Transparent electromagnetic radiation shield material and method of producing the same
KR101302284B1 (ko) 전도성 기판 및 이를 포함하는 전자소자
CN100353819C (zh) 薄膜上的集成电路芯片用、等离子显示器用或高频印刷电路板用铜箔
US7560135B2 (en) Electromagnetic-wave shielding and light transmitting plate and manufacturing method thereof
CN100486411C (zh) 电磁波屏蔽过滤器用铜箔及电磁波屏蔽过滤器
JP2008227352A (ja) 電磁波遮蔽シート、その製造方法、及びプラズマディスプレイパネル用フィルター
JP2007042887A (ja) 光透過性電磁波シールド性窓材及びその製造方法
KR100827042B1 (ko) 전자파 실드필터용 동박 및 전자파 실드필터
KR20050022442A (ko) 표면 처리 동박 및 그 제조 방법
CN105653083A (zh) 透明导电性基材
KR100590196B1 (ko) 전도성 물질로 동박 매쉬의 전면 및 측면을 처리하는 방법
JP2007227532A (ja) 電磁波遮蔽シート
JP2012064846A (ja) 電磁波遮蔽シート、電磁波遮蔽シートの製造方法及び画像表示装置
CN101881851A (zh) Pdp滤光片及其制备方法
JP4047841B2 (ja) 電磁波遮蔽用シールド材
JP2010010461A (ja) ディスプレイ装置用複合フィルタ

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090506

Termination date: 20111227