CN100486411C - Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter - Google Patents
Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter Download PDFInfo
- Publication number
- CN100486411C CN100486411C CNB2004800399105A CN200480039910A CN100486411C CN 100486411 C CN100486411 C CN 100486411C CN B2004800399105 A CNB2004800399105 A CN B2004800399105A CN 200480039910 A CN200480039910 A CN 200480039910A CN 100486411 C CN100486411 C CN 100486411C
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- copper foil
- copper
- electromagnetic wave
- wave shield
- layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
An excellent copper foil for used for the electromagnetic wave shield, provided on the front of a display, and having low apparent brightness and chromaticity, few patterns, and little unevenness. An electromagnetic wave shield filter produced by using the copper foil is also disclosed. A copper foil for an electromagnetic wave shield having a surface brightness of 1-20 in L<*> and chromaticities a<*> and b<*> are between +5 and -5 is produced by forming a coloring layer made of copper, cobalt and zinc on the surface of a copper foil. Patterns and unevenness are reduced in the appearance of the thus produced copper foil, and an electromagnetic wave shield filter employing this copper foil and provided on the front of a display ensures excellent appearance and good visibility of the display.
Description
Technical field
The present invention relates to copper foil for electromagnetic wave shield filter and use the electromagnetic shielding filter of this Copper Foil.In more detail, the present invention relates to be arranged at PDP (plasma display panel, plasma panel), cathode ray tube (CRT) etc. display unit the front copper foil for electromagnetic wave shield filter and use the electromagnetic shielding filter of this Copper Foil.
Background technology
For display unit such as PDP, CRT, be necessary that in the device front electromagnetic shielding filter being set prevents irradiation of electromagnetic waves.For electromagnetic shielding filter,, proposed to form the method for conductive membrane and use metal forming or the method for conducting fibre formation conductive mesh by evaporation in order to take into account electromagnetic wave shielding performance and translucidus.By excellent electric conductivity and cheap Copper Foil are carried out the metal covering etch (substractive) that etching forms conductive mesh, owing to can form the copper mesh of conductivity height and fine rule, thereby electromagnetic wave shielding performance and translucidus are good, and can overlap to be used in and make the etching technique of using in the printed substrate, so highly productive.Consider that from the angle of electromagnetic wave shielding performance and translucidus and intensity the live width of copper mesh is generally 5～30 μ m.Because single copper mesh operability is poor, therefore, also carries out following operation: the use transparent adhesives is carried out etching to Copper Foil again and is formed copper mesh after pasting Copper Foil on the supporter.When supporter is transparent resin film or glass, can directly be used as electromagnetic shielding filter.Also copper mesh can be transferred to transparent resin film or on glass from supporter.
In order not damage the image quality of display unit, wish to be difficult to discern the copper mesh that forms by the metal covering etching method, therefore except graph thinning, also require the brightness and the colourity on surface little, striped or spot are few.Little and the thickness of surface roughness is the printed substrate electrolytic copper foil of 9～18 μ m, and the linearity of the fine rule that forms by etching is good, and etching factor height, cross sectional shape are good, are suitable for forming fine rule, but brightness, colourity height, the identity of copper mesh increases.As the method for the blackization that reduces surperficial brightness, colourity, the known method that black chromium plating and black coating nickel are arranged, but chromium is big to environmental impact in the black chromium plating, and the etching difficulty.During black coating nickel is handled, because there is the problem of deceiving the molten mistake of nickel dam in the infiltration of etching solution.In addition,, in appearance striped and spot few electromagnetic wave shielding Copper Foil little as reflectivity, once had file (for example the spy opens the 2003-201597 communique) to disclose and be characterized as the alloy layer that has stanniferous, nickel and molybdenum in its surface, reflectivity is 1%～15% Copper Foil.This Copper Foil does not have to use harmful chromium, has eliminated the problem of the cosmetic variation that the infiltration owing to etching solution produces in addition yet, is applicable to electromagnetic shielding filter.The blackization of copper mesh surface and with transparent resin film or the bonding face of glassy phase, can be with one side, also can be different faces.When the blackization of copper mesh surface and with the bonding face of transparent resin or glassy phase not simultaneously, perhaps only single Copper Foil is carried out etching and when using as copper mesh, the black processing can be carried out in any stage, but considering from the angle of productivity excellence, generally is that the Copper Foil after the blackization is carried out etch processes.
Summary of the invention
In PDP, for the revisal form and aspect etc., except electromagnetic shielding filter, a plurality of optical filters etc. are set also, but in order to promote the simplification of structure, by reducing the number of plies of optical filter etc., make electromagnetic shielding filter become and be easy to be identified.For this reason, require brightness and colourity to reduce to copper foil for electromagnetic wave shield filter, than more black in the past, and requirement does not have the uniform outer appearance of aberration, but open the copper foil for electromagnetic wave shield filter of being put down in writing in the 2003-201597 communique the spy, can't satisfy brightness and colourity.By increasing surface roughness, can reduce brightness and colourity, but, since on Copper Foil and transparent resin film or the bonding employed adhesive of glass transfer printing the surface configuration of Copper Foil, by the formed concavo-convex cloud that is called " haze (haze) " that causes producing of this transfer printing, thereby transparency decline, therefore can not increase surface roughness.If carried out the surface of blackization is the face different with adhesive surface, just can not produce the haze that causes owing to the surface configuration transfer printing, but because the surperficial damaged of copper mesh when bonding, thereby also becomes and be easy to be identified.
Summary of the invention
In view of the above problems, the purpose of this invention is to provide the brightness on surface and colourity is low and haze is little, the copper foil for electromagnetic wave shield filter that is difficult to be identified.
(1) the present invention relates to a kind of copper foil for electromagnetic wave shield filter, it is characterized in that, the brightness L that at least one is surperficial
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5.
(2) in addition, the present invention relates to the copper foil for electromagnetic wave shield filter of record in (1), it is characterized in that it has copper foil layer and the dyed layer that contains copper, cobalt and zinc at least one face of copper foil layer, dyed layer is positioned at brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 surface and copper foil layer between.
(3) outside inferior, the present invention relates to the copper foil for electromagnetic wave shield filter of record in (1) or (2), it is characterized in that, the content of the copper of dyed layer, cobalt and zinc is with respect to the total amount of copper, cobalt and zinc, copper is 40～70 weight %, and cobalt is 10～30 weight %, and zinc is 10～30 weight %.
(4) in addition, the present invention relates to the copper foil for electromagnetic wave shield filter of each record in (1)～(3), it is characterized in that, the total amount of the content of the copper of dyed layer, cobalt, zinc is 3～10mg/dm
2
(5) in addition, the present invention relates to the copper foil for electromagnetic wave shield filter of each record in (1)～(4), it is characterized in that, the surface roughness that at least one is surperficial, it is 0.1～0.5 μ m in center line average roughness Ra.
(6) in addition, the present invention relates to the copper foil for electromagnetic wave shield filter of each record in (1)～(5), it is characterized in that, have trickle roughened layer that copper foil layer, the copper particulate by containing molybdenum on the single face at least of copper foil layer form and the dyed layer that contains copper, cobalt and zinc on trickle roughened layer, dyed layer is positioned at brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 the surface and trickle roughened layer between.
(7) moreover, the present invention relates to use the electromagnetic shielding filter of any one copper foil for electromagnetic wave shield filter of putting down in writing in (1)～(6).
(8) in addition, the present invention relates to be used for the electromagnetic shielding filter described in (7) of used for plasma display screen.
Dyed layer is to suppress reflection of incident light by the aggregate that forms trickle acicular texture, realizes the outward appearance of black.Even only also can obtain sufficient appearance of black with dyed layer itself, combine but suppress effect with the same reflection that produces by trickle roughened layer, can realize the more outward appearance of black.
Copper foil for electromagnetic wave shield filter of the present invention is for example made by form the dyed layer that contains copper, cobalt and zinc at least one surface of Copper Foil.And copper foil for electromagnetic wave shield filter of the present invention can be made by form trickle roughened layer that is made of the copper particulate that contains molybdenum and the dyed layer that contains copper, cobalt and zinc successively on Copper Foil.
Copper foil for electromagnetic wave shield filter of the present invention, the brightness on surface and colourity is low and haze is little is difficult to be identified, thereby is applicable to the electromagnetic shielding filter of display unit such as PDP.
Embodiment
Copper foil for electromagnetic wave shield filter of the present invention has, the dyed layer that contains copper, cobalt and zinc on the single face at least of copper foil layer and copper foil layer for example, and in this copper foil for electromagnetic wave shield filter, dyed layer is positioned at brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 surface and copper foil layer between.Dyed layer can only exist on the single face of copper foil layer, also can all exist on the two sides.This copper foil for electromagnetic wave shield filter for example can be made by form the dyed layer that contains copper, cobalt and zinc on the surface of Copper Foil.Copper Foil can use any in rolled copper foil, the electrolytic copper foil, but considers from the large tracts of land electromagnetic shielding filter and the cheap equal angles that form wide cut, still is fit to use electrolytic copper foil.Preferred 1～18 μ m of the thickness of Copper Foil, if blocked up, then owing to be difficult to form fine rule by etching, thereby institute is not preferred.
In addition, above-mentioned copper foil for electromagnetic wave shield filter, the trickle roughened layer that can also on copper foil layer, contain dyed layer and form by the copper particulate that contains molybdenum.For example also can between copper foil layer and dyed layer, have the trickle roughened layer that forms by the copper particulate that contains molybdenum.For such copper foil for electromagnetic wave shield filter, dyed layer is positioned at brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 the surface and trickle roughened layer between.
Trickle roughened layer and dyed layer by the copper particulate that contains molybdenum forms can form on glassy surface on the electrolytic copper foil and alligatoring face arbitrary.In addition, be the surface of the copper foil for electromagnetic wave shield filter of the bonding adhesive surface of transparent resin film or glassy phase as supporter with electromagnetic shielding filter, can be in the surface of the glassy surface of copper foil layer and alligatoring face side any one.These can arbitrarily determine by the manufacturing process of electromagnetic shielding filter.Be used for bonding surface, for example the brightness L of copper foil for electromagnetic wave shield filter
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 surface, it is 0.1～0.5 μ m that its surface roughness is preferably center line average roughness Ra, more preferably 0.1～0.3 μ m.If center line average roughness Ra is greater than 0.5 μ m, then the haze of the adhesive phase that is caused by the transfer printing of surface configuration becomes big, and the transparency of electromagnetic shielding filter descends, thereby is not preferred.In addition, if center line average roughness Ra less than 0.1 μ m, then bonding force is insufficient, reliability decrease, thereby also be not preferred.By forming the trickle roughened layer that constitutes by the copper particulate that contains molybdenum, can take into account bonding force and the preferred surface roughness that prevents haze with supporter.The method of trickle alligatoring like this has the method for putting down in writing in No. 3429290 communique of special permission.
The feature of copper foil for electromagnetic wave shield filter of the present invention is the brightness L that at least one is surperficial
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5.Brightness and chrominance passband are crossed the color colour difference meter and are measured, and can use the L of regulation among the JIS Z 8729
*a
*b
*The XYZ color specification system of regulation is represented among color specification system, the JIS Z 8701.In the color specification system separately, brightness is by L
*Represent that with Y colourity is by a
*b
*Represent with xy.Among the present invention, brightness and colourity are by the L of regulation among the JIS Z 8729
*a
*b
*Color specification system is stipulated.Brightness value is more little, means to be difficult to see that black light is not reflected, and theoretic minimum value is 0.Coordinate on the chrominance representation chromatic diagram, expression form and aspect and chroma.For L
*a
*b
*Color specification system, a
*b
*Be 0 o'clock the theoretic achromatization of coordinate representation simultaneously.To brightness L
*Be 1～20 scope, the surface of Copper Foil is black, and naked eyes are difficult to discern its difference.Preferred brightness L
*Value low more good more, can reach target effect 1～20 usually.On the other hand, if colourity a
*, b
*Be respectively+5～-5, then naked eyes are difficult to discern form and aspect.If a
*Surpass+5, then copper mesh looks to take on a red color and is, if less than-5 then be green system; If b
*Surpass+5, then be yellow system, be blue system less than-5.a
*Preferable range be+4～-2, b
*Preferable range be+2～-5.
At brightness L
*Be 1～20, colourity a
*, b
*Be respectively+5～-5 surface and copper foil layer between, in the dyed layer that contains copper, cobalt, zinc that forms, the content of copper, cobalt, zinc is with respect to the total amount of copper, cobalt, zinc, copper is preferably 40～70 weight %, more preferably 50～70 weight %, cobalt is preferably 10～30 weight %, more preferably 10～25 weight %, zinc is preferably 10～30%, more preferably 20～25 weight %.In addition, the total amount of the content of the copper in the dyed layer, cobalt and zinc is preferably 3～10mg/dm
2The formation of dyed layer is preferably carried out after trickle alligatoring, that is to say that preferred dyed layer forms on the surface of trickle roughened layer.
Dyed layer by copper, cobalt and zinc constitute can be formed by electro-plating method copper facing simultaneously, cobalt and zinc.The brightness of dyed layer is different and different according to the content of copper, cobalt, zinc with colourity.If the ratio deficiency of copper 40 weight % just have the tendency that brightness is increased,, thereby be undesirable if surpass 70 weight % then can present rubescent tendency.When if the ratio of zinc surpasses the ratio less than 10 weight % of 30 weight % and cobalt, then have the tendency that colored yellow is, brightness is increased.If the ratio of the ratio less than 10 weight % of zinc and cobalt surpasses 30 weight % in addition, then have the tendency that colored blue is, brightness is increased, thereby do not wish.The total amount of the content of the copper of dyed layer, cobalt, zinc is preferably 3～10mg/dm
2, further preferred range is 6～10mg/dm
2If not enough 3mg/dm
2, the tendency that then has brightness to increase, colourity also present the tendency of the redness that approaches copper.In addition, even surpass 10mg/dm
2, also can't see improvement to brightness and colourity.
The employed electroplate liquid of dyed layer that formation contains copper, cobalt, zinc is the aqueous solution that contains copper compound, cobalt compound and zinc compound, wherein copper compound is the copper compound that copper sulphate, copper chloride, copper carbonate, Kocide SD etc. contain copper, cobalt compound is the cobalt compound that cobaltous sulfate, cobalt chloride, cobalt carbonate, cobalt hydroxide etc. contain cobalt, and zinc compound is the compound that zinc sulfate, zinc chloride, zinc carbonate, zinc hydroxide etc. contain zinc.Can also suitably add electrolyte slaine of not electroplating and the buffers such as boric acid that are used for the stable electrical bath pH value such as sodium sulphate that are used to reduce resistance in the electroplate liquid.
The copper ion concentration that is used to form the electroplate liquid of dyed layer is preferably 1.9～3.8g/L, more preferably 2.5～3.2g/L, concentration of cobalt ions is preferably 1.8～3.5g/L, more preferably 2.4～2.9g/L, the concentration of zinc ion is preferably 2.0～3.9g/L, more preferably 2.4～3.3g/L.Hope is electroplated under such condition: current density 2.0～6.0A/dm for example
2, preferred 2.5～6.0A/dm
2, 20～30 ℃ of temperature of electroplating solution, electroplating time 3～10 seconds, preferred 3～6 seconds.
In the trickle roughened layer that is made of the copper particulate that contains molybdenum, the content of molybdenum is preferably 0.01～1 weight % with respect to the total amount of copper and molybdenum, more preferably 0.1～1 weight %.
Can form the trickle roughened layer that constitutes by the copper particulate that contains molybdenum by following method: for example, as specially permit put down in writing in No. 3429290 communique, with Copper Foil as negative electrode, use contains the electroplate liquid of copper ion, molybdenum ion, zinc ion, chloride ion, under current density, carry out electric field treatment less than the limiting current density of electroplate liquid, use the electroplate liquid contain copper ion then, under current density, carry out electric field treatment less than the limiting current density of electroplate liquid.
Form antirust coat after forming dyed layer, the chemical treatment in the manufacturing processes such as the rust-preventing characteristic when carrying out the Copper Foil keeping, etching and processing makes the resistance to chemical reagents raising.Antirust processing only otherwise influence form and aspect with regard to there is no particular limitation, employed various antirust processing can be suitable in the copper foil for printed circuit board.The antirust processing of being undertaken by chromium is not owing to influence form and aspect, thereby comparatively suitable.
Electromagnetic shielding filter of the present invention has used copper foil for electromagnetic wave shield filter of the present invention, has the structure that constitutes by transparency carriers such as transparent resin film, transparent resin plate or glass and conductivity net, wherein, the conductivity net pastes on the transparency carrier by adhesive as the conductivity loop of being processed into the loop shape of netted grade by copper foil for electromagnetic wave shield filter of the present invention.Only the single face of copper foil for electromagnetic wave shield filter is brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 surperficial the time, the face that the conductivity net is pasted on the transparency carrier can be brightness L
*Be 1～20, colourity a
*, b
*Respectively doing for oneself+5～-5 surface, also can be another side.Trickle roughened layer be preferably formed in be used for face and copper foil layer that transparency carrier is pasted mutually between.
Electromagnetic shielding filter of the present invention for example can be made like this, after pasting copper foil for electromagnetic wave shield filter with adhesive on the transparency carrier, form desirable conductivity loop and make electromagnetic shielding filter by copper foil for electromagnetic wave shield filter is etched with.In addition, also can on the supporter beyond the transparency carrier, after the formation conductivity loop, this conductivity loop be transferred on the transparency carrier with the same manner with adhesive.Electromagnetic shielding filter of the present invention can be configured in various display unit, for example on the surface of display unit such as PDP (plasma panel), cathode ray tube (CRT), is especially suitable for use as the electromagnetic shielding filter for PDP.
The present invention is described by the following examples.
Embodiment
Use the electroplate liquid of forming shown in the table 1, (Nippon Denkai, Ltd. makes at electrolytic copper foil, thickness is the center line average roughness Ra=0.20 μ m of 18 μ m, glassy surface) glassy surface on, carry out electroplating processes and form dyed layer, make copper foil for electromagnetic wave shield filter.For the surface of the dyed layer of this copper foil for electromagnetic wave shield filter, use color colour difference meter (Konica Minolta Co., Ltd produces, the CR-241 type) to measure the color aberration.The result is as shown in table 1.In addition, on the mylar made membrane of thickness 50 μ m,, as adhesive surface, use the bonding copper foil for electromagnetic wave shield filter of acrylic resin adhesive with painted aspect across the adhesive phase of film.Afterwards, use copper chloride to carry out etching, remove copper foil for electromagnetic wave shield filter (copper foil layer and dyed layer, perhaps copper foil layer, trickle roughened layer and dyed layer) comprehensively, its outward appearance of visualization is estimated the influence of the roughness on copper foil for electromagnetic wave shield filter surface to adhesive phase.Film is clear to be read literal then is O if can see through, if profile is unintelligible be *.
In the table 1, A1～A4 is a copper foil for electromagnetic wave shield filter of the present invention, and B1～B7 is the comparative example for the superiority that shows A1～A4.In the Copper Foil of A1～A4 any is not present redness or blue or yellow black.In addition, A1～A3 is without roughening treatment, and A4 has experienced to form the dyed layer that is made of copper, cobalt and zinc of the present invention after the roughening treatment, demonstrates identical appearance.Wherein, for A4, with carrying out roughening treatment irrelevant, do not find the variation of center line average roughness, its reason is because the difference that exists is that general surface roughness measurement method can't detected nuance.
Table 1
Alligatoring A: at ZnSO
47H
2O:57.5g/L, CuSO
45H
2O:50g/L, Na
2MoO
42H
2In the coarsening solution of O:2.0g/L, chlorine 20ppm, with 8A/dm
2The particle that carried out alligatoring with 0.5 second time adheres to processing (the alligatoring grain is paid け and handled), then, and at CuSO
45H
2O:125g/L, H
2SO
4: in the coarsening solution of 100g/L, with 4A/dm
2Carry out the reinforcement of alligatoring particle with 5 second time and handle, make that extremely trickle alligatoring particle evenly distributes, do not see the difference of alligatoring front and rear surfaces roughness measured value.
By above result as can be known, copper foil for electromagnetic wave shield filter of the present invention is black, and haze is little after the etching, and the transparency is good, can be used as copper foil for electromagnetic wave shield filter.
The possibility of industrial utilization
The present invention is in appearance brightness, colourity is little and striped, spot are few, can be used for the display front The good Copper Foil of electromagnetic wave shielding purposes.
Claims (6)
1. a copper foil for electromagnetic wave shield filter is characterized in that, has copper foil layer and the dyed layer that contains copper, cobalt and zinc at least one face of copper foil layer, at least one surperficial brightness L of this copper foil for electromagnetic wave shield filter
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5, dyed layer is positioned at brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 surface and copper foil layer between, the content of the copper of dyed layer, cobalt and zinc is with respect to the total amount of copper, cobalt and zinc, copper is 40～70 weight %, cobalt is 10～30 weight %, zinc is 10～30 weight %.
2. copper foil for electromagnetic wave shield filter according to claim 1 is characterized in that, the total amount of the content of the copper of dyed layer, cobalt and zinc is 3～10mg/dm
2
3. copper foil for electromagnetic wave shield filter according to claim 1 is characterized in that, at least one surperficial surface roughness is counted 0.1～0.5 μ m with center line average roughness Ra.
4. copper foil for electromagnetic wave shield filter according to claim 1, it is characterized in that, have trickle roughened layer that copper foil layer, the copper particulate by containing molybdenum on the single face at least of copper foil layer form and the dyed layer that contains copper, cobalt and zinc on trickle roughened layer, dyed layer is positioned at brightness L
*Be 1～20, colourity a
*, b
*Respectively do for oneself+5～-5 the surface and trickle roughened layer between.
5. use the electromagnetic shielding filter of any one described copper foil for electromagnetic wave shield filter in the claim 1～4.
6. be used for the electromagnetic shielding filter described in the claim 5 of used for plasma display screen.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004000718 | 2004-01-06 | ||
| JP000718/2004 | 2004-01-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1902994A CN1902994A (en) | 2007-01-24 |
| CN100486411C true CN100486411C (en) | 2009-05-06 |
Family
ID=34746958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800399105A Expired - Fee Related CN100486411C (en) | 2004-01-06 | 2004-12-27 | Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4365372B2 (en) |
| CN (1) | CN100486411C (en) |
| TW (1) | TWI265088B (en) |
| WO (1) | WO2005067362A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006103189A (en) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | Surface-treated copper foil and circuit board |
| JP5167181B2 (en) * | 2009-03-25 | 2013-03-21 | 大日本印刷株式会社 | Electromagnetic wave shielding filter |
| JP5419514B2 (en) * | 2009-03-30 | 2014-02-19 | 太陽ホールディングス株式会社 | Hole filling resin composition and printed wiring board filled with this resin composition |
| CN102181889B (en) * | 2011-04-08 | 2012-07-04 | 联合铜箔(惠州)有限公司 | Additive for electrolytic copper foil, electrolytic copper foil manufacturing process and electrolytic copper foil |
| JP6186805B2 (en) * | 2013-03-28 | 2017-08-30 | 大日本印刷株式会社 | Touch panel |
| WO2020040518A1 (en) * | 2018-08-20 | 2020-02-27 | 주식회사 엘지화학 | Embedded electrode substrate for transparent light-emitting element display, and method for manufacturing same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0685486A (en) * | 1992-09-01 | 1994-03-25 | Nippon Sheet Glass Co Ltd | Electromagnetic shielding body |
| JPH1197877A (en) * | 1997-09-19 | 1999-04-09 | Oji Paper Co Ltd | Transparent conductive film for electromagnetic wave shielding |
| JP3363083B2 (en) * | 1997-12-17 | 2003-01-07 | 住友大阪セメント株式会社 | Transparent substrate and method for producing the same |
| WO2000007955A1 (en) * | 1998-08-05 | 2000-02-17 | Nippon Sheet Glass Co., Ltd. | Antireflection colored film coated glass article and plasma display panel optical filter |
| JP4004161B2 (en) * | 1998-11-26 | 2007-11-07 | 三井化学株式会社 | Transparent laminate and display filter using the same |
| JP2000238170A (en) * | 1998-12-22 | 2000-09-05 | Mitsui Chemicals Inc | Transparent conductive film |
| JP2002372617A (en) * | 2001-06-14 | 2002-12-26 | Fuji Photo Film Co Ltd | Optical filter and image display device |
| JP2003201597A (en) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | Copper foil, production method therefor and electromagnetic wave shield body obtained by using the copper foil |
| JP2004288972A (en) * | 2003-03-24 | 2004-10-14 | Shin Etsu Polymer Co Ltd | Electromagnetic wave shielding body and its manufacturing method |
-
2004
- 2004-12-27 WO PCT/JP2004/019529 patent/WO2005067362A1/en active Application Filing
- 2004-12-27 CN CNB2004800399105A patent/CN100486411C/en not_active Expired - Fee Related
- 2004-12-27 JP JP2005516850A patent/JP4365372B2/en active Active
-
2005
- 2005-01-03 TW TW94100074A patent/TWI265088B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1902994A (en) | 2007-01-24 |
| JPWO2005067362A1 (en) | 2007-12-27 |
| JP4365372B2 (en) | 2009-11-18 |
| TW200526404A (en) | 2005-08-16 |
| WO2005067362A1 (en) | 2005-07-21 |
| TWI265088B (en) | 2006-11-01 |
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Granted publication date: 20090506 Termination date: 20111227 |