CN105653083A - Transparent conductive substrate - Google Patents
Transparent conductive substrate Download PDFInfo
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- CN105653083A CN105653083A CN201510830924.9A CN201510830924A CN105653083A CN 105653083 A CN105653083 A CN 105653083A CN 201510830924 A CN201510830924 A CN 201510830924A CN 105653083 A CN105653083 A CN 105653083A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Crystallography & Structural Chemistry (AREA)
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Abstract
The invention provides a transparent conductive substrate. The transparent conductive substrate includes a transparent substrate, a wiring portion having a conductor pattern arranged on the transparent substrate, and a blackened layer arranged on the conductor pattern. The blackened layer is a single layer containing a nickel-zinc alloy, and has a thickness of 30-70 nm, wherein the mass ratio of nickel to zinc is 3.0-105.
Description
Technical field
The present invention relates to a kind of transparent conductive base, specifically relate to a kind of transparent conductive base being applied to touch panel etc.
Background technology
In the past, it is known that, the image display devices such as liquid crystal indicator comprise makes distribution be formed at the surface of transparent film with latticed pattern and the touch panel base material that becomes.
Such distribution has metalluster, and therefore, the user that can produce liquid crystal indicator is visually observed the such unfavorable condition of luminous reflectance of distribution or this distribution. Thus, worry can make the visual reduction of liquid crystal indicator.
Therefore, disclose a kind of light-transmissive conductive material, it has the conductive metal layer making metal section and visible light transmission portion patterning and formed on transparent base, wherein, the metal fine forming metal section is laminated with the alloy mutually different at least two floor blackening layer of composition (with reference to Japanese Patent No. 4972381 publication).
In this light-transmissive conductive material, reduce the luminous reflectance of metal fine, thus improve the visuality of liquid crystal indicator.
But, in the light-transmissive conductive material of Japanese Patent No. 4972381 publication, owing to being provided with the blackening layer of mutually different more than two layers of composition, consequently, it is desirable to implement multiple process, to form blackening layer. Specifically, it is necessary to prepare multiple for implement blackening layer process plating bath groove and the transparent base with metal fine is flooded in each bath, carries out plating. Therefore, make production unit become big or make operation operation become miscellaneous, its result, produce the poor such unfavorable condition of productivity.
Summary of the invention
It is an object of the present invention to provide the visual excellent of a kind of image display device and the transparent conductive base that productivity is good.
A kind of transparent conductive base of the present invention, it is characterised in that, this transparent conductive base comprises transparent substrate and distribution portion, and described distribution portion has: conductive pattern, and it is arranged on described transparent substrate; And blackening layer, it is arranged on described conductive pattern, and described blackening layer is the individual layer containing nickel zinc alloy, and the thickness of described blackening layer is 30nm��70nm, and the nickel in described blackening layer is 3.0��105 relative to the mass ratio of zinc.
In addition, in the transparent conductive base of the present invention, it is preferred that the thickness of described conductive pattern is 0.2 ��m��0.5 ��m.
In addition, in the transparent conductive base of the present invention, it is preferred that the live width of described conductive pattern is 5 ��m��8 ��m.
In the transparent conductive base of the present invention, owing to blackening layer is made up of the individual layer containing nickel zinc alloy, therefore, it is not necessary to implement multiple plating to form blackening layer, thus make productivity good.In addition, it is 3.0��105 owing to the thickness of blackening layer is the nickel in 30nm��70nm and described blackening layer relative to the mass ratio of zinc, accordingly, it may be possible to suppress distribution portion to be visually observed, thus makes the visual excellent of image display device.
Accompanying drawing explanation
What Fig. 1 represented is the sectional view of an enforcement mode of the transparent conductive base of the present invention.
Fig. 2 A and Fig. 2 B is the vertical view of the transparent conductive base of Fig. 1, and wherein, Fig. 2 A is the vertical view of the entirety of this transparent conductive base, and that Fig. 2 B represents is the partial enlargement figure of Fig. 2 A.
Fig. 3 A��Fig. 3 D is the process picture sheet of the transparent conductive base manufacturing Fig. 1, and wherein, Fig. 3 A represents the operation preparing transparent substrate, and Fig. 3 B represents the operation of configuration electrically conductive film, and Fig. 3 C represents the operation of configuration melanism film, and Fig. 3 D represents the operation implementing pattern process.
Fig. 4 A and Fig. 4 B is the touch panel base material of the transparent conductive base with Fig. 1, and wherein, Fig. 4 A represents sectional view, and Fig. 4 B represents the vertical view of the entirety of Fig. 4 A.
Fig. 5 is the sectional view of the image display device of the transparent conductive base comprising Fig. 1.
Embodiment
In FIG, paper upper and lower is to for upper and lower is to (thickness direction, i.e. the 1st direction), it is upside (thickness direction side, i.e. the 1st side, direction, visual observation side) on the upside of paper, it is downside (another side of thickness direction, the side that namely the 1st another side, direction is contrary with visual observation side) on the downside of paper. Direction, paper left and right is direction, left and right (width, the 2nd namely orthogonal with the 1st direction direction), it is left side (width side, i.e. the 2nd side, direction) on the left of paper, it is right side (another side of width, i.e. the 2nd another side, direction) on the right side of paper. The thick direction of paper paper be front and back to (3rd direction orthogonal with the 1st direction and the 2nd direction), paper nearby side be front side (the 3rd side, direction), paper depth side is rear side (the 3rd another side, direction). In the direction of other figure, also taking the direction of Fig. 1 as benchmark. Specifically, taking the direction arrow of each figure as benchmark. In addition, the A-A sectional view of Fig. 2 A is equivalent to Fig. 1. In addition, the A-A sectional view of Fig. 4 B is equivalent to Fig. 4 A.
Transparent conductive base 1 is in the tabular with specific thickness, and along the prescribed direction orthogonal with thickness direction (direction, face, specifically be direction, left and right and front and back to) extension, has smooth upper surface and smooth lower surface. Transparent conductive base 1 is a part of the touch panel substrate etc. being such as located in image display device, and that is, it is not image display device. That is, transparent conductive base 1 is the part for making image display device, does not comprise the image-displaying members such as LCD assembly, and is made up of transparency carrier 2 described later and Wiring pattern 3, the device of its industry of circulating separately as part, can be applied to. In addition, it is also possible to transparent conductive base 1 is prepared into there is flexible transparent conducting film.
Specifically, as shown in Figure 1, Figure 2 shown in A and Fig. 2 B, transparent conductive base 1 comprise transparent substrate 2 and be configured at transparent substrate 2 upper surface, as the Wiring pattern 3 in distribution portion. Preferably, transparent conductive base 1 is made up of transparent substrate 2 and Wiring pattern 3.
As shown in Figure 2 A, transparency carrier 2 is formed as the film like corresponding with the outer shape of transparent conductive base 1 when overlooking or thin plate shape). As the transparent material for the formation of transparency carrier 2, the such as insulating material such as organic transparent material, inorganic transparent material can be listed.As organic transparent material, olefin material and the such as trimeric cyanamide based polymers etc. such as the acryhic materials such as polyester material, such as polymethyl acrylate, such as polycarbonate material, the such as polyethylene (PE) such as such as polyethylene terephthalate (PET), polypropylene (PP), cycloolefine polymer (COP) can be listed. As inorganic transparent material, such as glass etc. can be listed. Transparency carrier 2 can be used alone or be used in combination. From the viewpoint of frivolous property, it is preferable to organic transparent material, it is more preferable to list polyester material.
The full light transmittance of transparency carrier 2 is such as more than 80%, it is preferable to more than 90%, and is such as less than 100%.
From the viewpoint of the perviousness of light and treatability, the thickness of transparency carrier 2 is such as more than 5 ��m, it is preferable to more than 15 ��m, and is such as less than 100 ��m, it is preferable to less than 50 ��m.
Wiring pattern 3 is configured at the upper surface of transparent substrate 2.
As shown in Figure 2 A and 2 B, Wiring pattern 3 is formed as latticed pattern when overlooking (square lattice shape pattern) by multiple distribution and becomes.
Wiring pattern 3 comprises conductive pattern 4 and blackening layer 5.
Conductive pattern 4 is the conductor layer being formed with pattern, and it is located at the upper surface of transparent substrate 2. The upper surface (that is, the face of the side that the contact surface contacted with same transparent substrate 2 of conductive pattern 4 is contrary) of conductive pattern 4 is covered by blackening layer 5 (aftermentioned), and the side of conductive pattern 4 is not covered by blackening layer 5. That is, the side of conductive pattern 4 exposes from blackening layer 5.
Material for the formation of conductive pattern 4 is conductive material, specifically, such as gold and silver, copper, nickel, aluminium, magnesium, tungsten, cobalt, zinc, iron and their alloy etc. can be listed, it is preferable that list gold and silver, copper, from the viewpoint of cost and processibility, it is more preferable to enumerate copper.
The thickness T1 of conductive pattern 4 is such as more than 0.1 ��m, it is preferable to more than 0.2 ��m, and is such as less than 1.0 ��m, it is preferable to less than 0.5 ��m. By making the thickness T1 of conductive pattern 4 in described scope, it is possible to reduce situation about being visually observed from the side of Wiring pattern 3 such that it is able to improve visuality when carrying out visual observation from the side of image display device.
The thickness T1 of conductive pattern 4 can by such as the surface resistivity of conductive pattern 4 being measured and surface resistivity is converted into thickness and calculates.
Live width (width of the distribution) W of conductive pattern 4, i.e. Wiring pattern 3 is such as more than 1 ��m, it is preferable to more than 3 ��m, it is more preferable to be more than 5 ��m, and is such as less than 50 ��m, it is preferable to less than 10 ��m, it is more preferable to be less than 8 ��m. By making the live width of conductive pattern 4 in described scope, it is possible to reliably improve the visuality when the upper surface of image display device carries out visual observation.
The live width of conductive pattern 4 can utilize the image procossing of such as SEM photograph to measure.
In conductive pattern 4, thickness is such as more than 0.01 relative to the ratio (T1/W) of live width, it is preferable to more than 0.02, and is such as less than 0.50, it is preferable to less than 0.10. By making the ratio of the thickness of conductive pattern 4 in described scope, it is possible to reliably improve the upper surface from image display device and visuality when side carries out visual observation.
As shown in Figure 2 B, conductive pattern 4, i.e. the intervals P of Wiring pattern 3 are that the length till another center is played at a center in the two of adjacent configuration distributions in unit cell pattern, it is such as more than 200 ��m, it is preferably more than 350 ��m, and it is such as less than 800 ��m, it is preferable to less than 650 ��m.
The opening rate of conductive pattern 4, i.e. Wiring pattern 3 is such as more than 95%, it is preferable to more than 96%, and is such as less than 99%.
Opening rate can by as L and utilizing " (opening rate)={ (L/P) using the distance (value subtracting live width W from intervals P and obtain) spatially between the two of adjacent configuration distributions2} �� 100 " formula calculate.
As shown in Figure 1, blackening layer 5 is configured at the upper surface of conductive pattern 4.
The pattern that blackening layer 5 is formed as when overlooking and conductive pattern 4 is roughly the same. Specifically, blackening layer 5 is only located at the upper surface of conductive pattern 4 in the way of overlapping with conductive pattern 4 when through-thickness projects.
Blackening layer 5 is formed by nickel zinc alloy (NiZn), and it is individual layer.
Nickel in blackening layer 5 is 3.0��105 relative to the mass ratio (Ni/Zn) of zinc. It is preferably more than 5.0, it is more preferable to be more than 10, and it is preferably less than 80, it is more preferable to be less than 50, more preferably less than 30. By making the mass ratio of nickel in described scope, it is possible to reduce reflectivity and the uneven color of Wiring pattern 3, thus suppress Wiring pattern 3 to be visually observed. Its result, it is possible to improve the visuality of image display device.
The mass ratio of nickel zinc alloy can utilize such as energy dispersion type X line optical spectroscopy to measure.
The thickness T2 of blackening layer 5 is 30nm��70nm. It is preferably 30nm��50nm. By making the thickness of blackening layer 5 in described scope, it is possible to reduce reflectivity and the uneven color of Wiring pattern 3, thus suppress Wiring pattern 3 to be visually observed. Its result, it is possible to improve the visuality of image display device.
The thickness of blackening layer 5 can utilize such as laser microscope to measure.
The live width of blackening layer 5 is identical with spacing with the live width (W) of described conductive pattern 4 with spacing.
The thickness of blackening layer 5 is such as more than 0.06 relative to the ratio (T2/T1) of the thickness of conductive pattern 4, it is preferable to more than 0.10, and is such as less than 0.50, it is preferable to less than 0.30. By making described ratio in described scope, it is possible to reduce situation about being visually observed from the side of Wiring pattern 3 such that it is able to improve visuality when carrying out visual observation from the side of image display device.
The reflectivity of blackening layer 5 is such as less than 25%, it is preferable to less than 20%, it is more preferable to be less than 15%, more preferably less than 10%, and be such as more than 1%. Reflectivity can by such as using spectrophotometer to carry out scanning and measure in the such useful range of wavelength of 380nm��780nm.
The form and aspect a of blackening layer 5*With form and aspect b*It is respectively-10��10, it is preferable to 0��10, it is more preferable to be 0��5. Form and aspect can by such as using spectrophotometer to carry out scanning and measure in the such useful range of wavelength of 380nm��780nm.
The manufacture method of transparent conductive base
Next, the manufacture method of this transparent conductive base 1 is described.
The manufacture method of transparent conductive base 1 comprises following operation: prepare the operation of transparency carrier 2, the operation configuring electrically conductive film 8 on transparent substrate 2, the operation configuring melanism film 9 on electrically conductive film 8 and electrically conductive film 8 and melanism film 9 carry out the operation of pattern process.
As shown in Figure 3A, first, prepare to have the transparency carrier 2 of described structure, material, size.
, as shown in Figure 3 B, then transparent substrate 2 configures electrically conductive film 8.
Specifically, at the upper surface upper conductor film 8 of transparent substrate 2.
Such as, as the method configuring electrically conductive film 8 on transparency carrier 2, it is possible to use such as plated by electroless plating, metallide, sputtering (d.c. sputtering) etc.
Preferably combination uses sputtering and both metallides. Specifically, utilize sputtering to make a part (basis film) for electrically conductive film 8 be formed at two faces of transparent substrate 2, then, make electrically conductive film 8 be increased to the thickness of expectation by implementing metallide. Pass through the method, it is possible to reduce and make this and can reliably form electrically conductive film 8 (and even conductive pattern 4) with the thickness expected.
Condition, specifically non-active gas, the voltage etc. of sputtering suitably can be set. Moreover, it is possible to the ionic concn in the temperature of the condition of metallide, specifically electrolysis plating bath, electrolysis plating bath, current density etc. are suitably set.
, as shown in Figure 3 C, then electrically conductive film 8 configures melanism film 9.
Specifically, the upper surface of the electrically conductive film 8 of the upper surface being formed at transparent substrate 2 forms melanism film 9.
As the method configuring melanism film 9 on electrically conductive film 8, it is possible to use such as plated by electroless plating, metallide, sputtering etc., can preferably list metallide. Make this consequently, it is possible to reduce and can reliably form melanism film 9 with the thickness expected.
When to be implemented metallide, as long as the plating bath of nickel zinc contains nickel and zinc, it is possible to use known plating bath.
Ni concentration is such as more than 5g/L, it is preferable to more than 10g/L, and is such as below 100g/L, it is preferable to below 50g/L.
Zn concentration is such as more than 1g/L, it is preferable to more than 2g/L, and is such as below 50g/L, it is preferable to below 20g/L.
Ni concentration is such as more than 2.0 relative to the mass ratio (Ni/Zn) of Zn concentration, it is preferable to more than 3.0, and is such as less than 10, it is preferable to less than 5.0.
The plating time is such as more than 0.2 minute, it is preferable to more than 0.5 minute, and is such as less than 7 minutes, it is preferable to less than 5 minutes.
By the Ni concentration of plating bath and Zn concentration, plating time etc. are suitably adjusted, it is possible to the Ni/Zn concentration of the coating (melanism film 9 and even blackening layer 5) obtained, thickness etc. are adjusted.
Thus, melanism film-electrically conductive film duplexer that on transparent substrate 2, laminated conductor film 8 becomes successively has been obtained with melanism film 9.
, as shown in Figure 3 D, then electrically conductive film 8 and melanism film 9 are carried out pattern process.
Specifically, the electrically conductive film 8 of upper surface and melanism film 9 being formed at transparent substrate 2 is carried out pattern process and become the pattern shown in Fig. 2 A.
As the method carrying out pattern process, such as, stacking resist pattern on the surface of melanism film 9, then, utilizes etching to remove melanism film 9 and the electrically conductive film 8 in not region, is peeled off by resist pattern afterwards.
Thus, melanism film 9 and electrically conductive film 8 are carried out pattern process, thus obtain the blackening layer 5 and conductive pattern 4 that are formed as predetermined pattern.
Its result, has obtained transparent conductive base 1. That is, in transparent conductive base 1, blackening layer 5, conductive pattern 4 and transparent substrate 2 it is provided with successively towards downside from upside.
Further, this transparent conductive base 1 is adopted, it is possible to by simply to manufacture at the nickel zinc alloy coating (blackening layer 5) of the upper surface of conductive pattern 4 formation individual layer, therefore productivity is excellent.
In addition, adopt this transparent conductive base 1, reduce reflectivity and the uneven color of Wiring pattern 3.Its result, it is possible to suppress Wiring pattern to be visually observed, thus make the visual excellent of image display device.
In addition, adopt this transparent conductive base 1, obtain by carrying out pattern process after forming electrically conductive film 8 and melanism film 9. Namely, it is possible to manufacture transparent conductive base 1 by implementing distribution formation and Darkening process continuously. Accordingly, it may be possible to shorten manufacturing time, reduce costs, additionally it is possible to reduce environmental pressure.
Further, the transparent conductive base 1 shown in Fig. 3 D circulates as a part for the touch panel substrate 10 shown in construction drawing 4A and Fig. 4 B, can be applied to industrial device (part).
The clear adhesive oxidant layer 6 that touch panel base material 10 shown in Fig. 4 A and Fig. 4 B comprises two transparent conductive bases 1 and is configured between two transparent conductive bases 1. That is, touch panel base material 10 including as transparent conductive base 1 lower transparent conductive substrate 1a, be arranged on the clear adhesive oxidant layer 6 on lower transparent conductive substrate 1a and be arranged on clear adhesive oxidant layer 6, as the upside transparent conductive base 1b of transparent conductive base 1.
Lower transparent conductive substrate 1a is described transparent conductive base 1, comprises transparent substrate 2a (transparent substrate 2) and Wiring pattern 3a (Wiring pattern 3).
Clear adhesive oxidant layer 6 is located at the upper surface of lower transparent conductive substrate 1a. That is, clear adhesive oxidant layer 6 configures in the part mode from Wiring pattern 3a exposure of the upper surface of the upper surface and side and transparent substrate 2a that cover Wiring pattern 3a.
Clear adhesive oxidant layer 6 is formed as the film like corresponding with the outer shape of transparent conductive base 1 when overlooking or thin plate shape. As the transparent material for the formation of clear adhesive oxidant layer 6, as long as it has the transparency, cementability or binding property, it is possible to use such as acrylic acid series caking agent, silicon-type caking agent and rubber system caking agent etc.
The thickness of clear adhesive oxidant layer 6 (play from the upper surface of the transparent substrate 2a of lower transparent conductive substrate 1a upside transparent conductive base 1b transparent substrate 2b lower surface till distance) be such as more than 5 ��m, it is preferably more than 25 ��m, and it is such as less than 200 ��m, it is preferable to less than 50 ��m.
Upside transparent conductive base 1b is described transparent conductive base 1, comprises transparent substrate 2b (transparent substrate 2) and Wiring pattern 3b (Wiring pattern 3). Upside transparent conductive base 1b is located at the upper surface of clear adhesive oxidant layer 6. That is, transparent conductive base 1b in upside configures in the way of making the lower surface of transparent substrate 2b contact with the upper surface of clear adhesive oxidant layer 6.
In addition, as shown in Figure 4 B, in the transparent conductive base 1b of upside, Wiring pattern 3b is configured to same Wiring pattern 3a in the way of its square lattice shape pattern does not overlap each other with the square lattice shape pattern of Wiring pattern 3a (imagination line) and staggers half pitch.
Touch panel base material 10 can obtain in the following way: the upper surface at lower transparent conductive substrate 1a applies aqueous clear adhesive agent and makes it dry and form clear adhesive oxidant layer 6, then, upside transparent conductive base 1b is configured at the upper surface of clear adhesive oxidant layer 6. In addition, touch panel base material 10 also can obtain in the following way: by lower transparent conductive substrate 1a and upside transparent conductive base 1b to be oppositely disposed in the way of transparent both sided adhesive tape (sheet being made up of clear adhesive oxidant layer 6) to each other, then, lower transparent conductive substrate 1a and upside transparent conductive base 1b is pressed relative to transparent both sided adhesive tape.
Adopt this touch panel base material 10, owing to comprising lower transparent conductive substrate 1a and upside transparent conductive base 1b, accordingly, it may be possible to suppress Wiring pattern 3 to be visually observed, thus make the visual excellent of image display device. So, it is possible to touch panel base material 10 is applied to such as image display device.
Then, the liquid crystal indicator 30 of an example as the image display device using touch panel base material 10 is described with reference to Fig. 5.
Liquid crystal indicator 30 is such as touch panel formula mobile phone, and operator (or visual observation person) carries out visual observation and operation from the upside of liquid crystal indicator 30. Liquid crystal indicator 30 including as the image-displaying member of tabular LCD assembly (LCD assembly) 14, by with LCD assembly 14 interval in the way of be located at the Polarizer 12 of table side of LCD assembly 14 and be configured at the touch panel 26 of the upper surface of Polarizer 12.
It is provided with circuit substrate and housing etc. in the downside of LCD assembly 14, this is not illustrated.
The direction, left and right at liquid crystal indicator 30 and front and back central part upwards between LCD assembly 14 and Polarizer 12 become the clearance layer 13 as gas cloud. In addition, clearance layer 13 is divided out by the interval part 21 being configured at peripheral end portion in frame-shaped.
Touch panel 26 comprises the touch panel substrate 10 of the upper surface being configured at Polarizer 12 and is adhered to the protective glass layers 11 of the upside of touch panel substrate 10 by transparent binder layer 25.
In the touch panel 26 of Fig. 5, the touch panel substrate 10 shown in Fig. 4 A is configured at liquid crystal indicator 30 to maintain the state of its upper and lower configuration upwards.
Variation
In the enforcement mode of Fig. 2 A and Fig. 4 B, the latticed pattern of Wiring pattern 3 (3a, 3b) is square lattice shape, but also can make Wiring pattern 3 (3a, 3b) such as to be rectangle reticulation, rhombus reticulation, Polygons reticulation, this do not illustrated.
In addition, in the enforcement mode of Fig. 4 A and Fig. 4 B, Wiring pattern 3 (3a, 3b) is formed as latticed pattern respectively, it may also be, such as, Wiring pattern 3 (3a, 3b) is formed as striped design, this is not illustrated. Specifically, in this embodiment, the Wiring pattern 3a of lower transparent conductive substrate 1a is formed as the multiple striped design extended in the way of separated from each other interval along a direction of in-plane, and the Wiring pattern 3b of upside transparent conductive base 1b is formed as the striped design extended in the way of separated from each other interval along the direction orthogonal with a direction of described in-plane. That is, in this embodiment, when through-thickness projects, latticed pattern is formed by Wiring pattern 3a and Wiring pattern 3b.
In addition, in the enforcement mode of Fig. 4 A and Fig. 4 B, lower transparent conductive substrate 1a and upside transparent conductive base 1b includes blackening layer 5, it may also be, such as, only lower transparent conductive substrate 1a and upside transparent conductive base 1b any one comprises blackening layer 5, this is not illustrated. From the viewpoint of reliably improve the visuality of image display device, it is preferred that lower transparent conductive substrate 1a and upside transparent conductive base 1b includes blackening layer 5.
In addition, in the enforcement mode shown in Fig. 5, as image-displaying member exemplified with LCD assembly 14, but it is not limited thereto, it is also possible to exemplify such as CRT, inorganic EL indicating meter, OLED display, LED indicating meter, LD indicating meter, Field Emission Display, plasma display etc.
Embodiment
Hereinafter, illustrate that embodiment and comparative example specifically describe the present invention further. In addition, the present invention is not limited to any embodiment and comparative example. Moreover, it is possible to the blending ratio (content ratio) used in following record, physical property values, the concrete numerical value such as parameter are replaced to record in described " embodiment " the blending ratio corresponding with above numerical value (content ratio), physical property values, the higher limit (numerical value defined with " below ", " being less than ") of parameter etc. or lower value (with " more than ", " exceeding " numerical value of defining).
Measuring method
The thickness of copper film (conductive pattern) calculates in the following way: uses surface resistivity time meter (" LorestaEP ", Mitsubishi chemical Co., Ltd manufactures) to measure the surface resistivity of copper film, and is converted into the value of thickness.
Sweep type confocal laser microscope (" OLS3000 ", Olympus Co., Ltd manufacture) is utilized to measure the thickness of nickel zinc alloy coating (blackening layer).
Embodiment 1
Manufacture the folded body of melanism film-copper film layer
Utilize d.c. sputtering as transparent substrate, the one side of the PET film of thickness 50 ��m forms the copper film of thickness 80nm, thus obtains duplexer. Duplexer is immersed in electrolytic copper plating bath, by current density 0.5A/dm3When, implements metallide process the thickness of copper film is increased, thus forms the copper film of total thickness 200nm (0.2 ��m), has thus obtained copper film layer and folded body. Folded for this copper film layer body is taken out from plating bath, and it has been carried out washing, drying.
Then, folded for copper film layer body is immersed in using Ni plate as, in the electrolytic nickel zinc alloy coating bath of anode electrode, utilizing rectifier that applying voltage is set as 1V, thus on the surface of copper film, defines nickel zinc alloy coating. Now, application time is adjusted and make the thickness of coating become 30nm. Thus, the folded body of melanism film-copper film layer is made.
In addition, electrolytic nickel zinc alloy coating bath is composed as follows.
The concentration of ammonium compound is 2.5 quality %, and the concentration of chalcogenide compound is 1.5 quality %.
Manufacture transparent conducting film
Then, the resist pattern that stacking specifies on the surface of the melanism film of the folded body of melanism film-copper film layer, utilizes etching method melanism film and the copper film in not region to be removed, afterwards, has peeled off resist pattern. Thus, making the transparent conducting film comprising Wiring pattern, melanism film and copper film are formed as square lattice shape (latticed) pattern and become by Wiring pattern. In addition, the live width of Wiring pattern is 6 ��m, and intervals is 450 ��m, and opening rate is 97%.
Embodiment 2��embodiment 10
In the way of making the Ni concentration in electrolytic nickel zinc alloy coating bath and Zn concentration become in table 1 concentration recorded, nickelous chloride and zinc chloride are mixed, and the thickness of nickel zinc alloy coating is changed in table 1 record thickness, in addition, similarly to Example 1, make the folded body of melanism film-copper film layer, then, transparent conducting film is made.
Comparative example 1��comparative example 5
In the way of making the Ni concentration in electrolytic nickel zinc alloy coating bath and Zn concentration become in table 1 concentration recorded, nickelous chloride and zinc chloride are mixed, and the thickness of nickel zinc alloy coating is changed in table 1 record thickness, in addition, similarly to Example 1, make the folded body of melanism film-copper film layer, then, transparent conducting film is made.
Embodiment 11��embodiment 21
Electrolytic copper plating layer and electrolytic copper nickel zinc coating plating time and plating bath concentration etc. separately are suitably adjusted, the thickness of copper film (conductive pattern) and melanism film (blackening layer) is changed to the thickness of table 2, in addition, similarly to Example 1, transparent conducting film is made.
Embodiment 22��embodiment 25
The respective plating time and plating bath concentration etc. of electrolytic copper plating layer and electrolytic copper nickel zinc coating is suitably adjusted, the thickness of copper film (conductive pattern) and melanism film (blackening layer) is changed to the thickness of table 2, in addition, similarly to Example 1, the folded body of melanism film-copper film layer is made. Then, it may also be useful to the live width of Wiring pattern is changed to 10 ��m from 6 ��m by the folded body of this melanism film-copper film layer, in addition, utilizes etching method to carry out pattern process similarly to Example 1, thus makes transparent conducting film.
Evaluate
1. reflectivity
Folded for the melanism film-copper film layer of embodiment 1��embodiment 10 and comparative example 1��comparative example 5 body is cut into 5cm �� 5cm, and as evaluation sample. Use spectrophotometer (" V-670D ", Japan Spectroscopy Corporation manufactures) to be scanned by evaluation sample in the such useful range of wavelength of 380nm��780nm, thus measure reflectivity Y value. The results are shown in table 1.
2. uneven color
Folded for the melanism film-copper film layer of embodiment 1��embodiment 10 and comparative example 1��comparative example 5 body is cut into 5cm �� 5cm, and as evaluation sample. Use spectrophotometer (" V-670D ", Japan Spectroscopy Corporation manufacture) to be scanned by evaluation sample in the such useful range of wavelength of 380nm��780nm, thus measure form and aspect (a*��b*)��
By a*And b*The average evaluation being 10��-10 is zero, by a*And b*In at least one more than 10 or the average evaluation being less than-10 for ��. Result is represented in table 1.
3. distribution visuality (upper surface)
The transparent conducting film of each embodiment and each comparative example is positioned on platform in the way of the upper surface of blackening layer is positioned at upside under the light source of three wave band light emitting-type luminescent lamps, can the visual transparent conducting film from upside, have confirmed be visually observed latticed Wiring pattern.
Being zero by the average evaluation not being visually observed latticed Wiring pattern, the average evaluation that minimal visual is observed latticed Wiring pattern is ��, by the average evaluation that is visually observed latticed Wiring pattern for ��. The results are shown in table 1 and table 2.
4. distribution visuality (side)
The transparent conducting film of each embodiment is positioned on platform in the way of its upper surface is positioned at upside under the light source of three wave band light emitting-type luminescent lamps, relative to the angle visual transparent conducting film of transparent conducting film from vergence direction (45 ��).
Being zero by the average evaluation not being visually observed latticed Wiring pattern, the average evaluation that minimal visual is observed latticed Wiring pattern is ��, by the average evaluation that is visually observed latticed Wiring pattern for ��. The results are shown in table 1 and table 2.
Table 1
Table 2
In addition, although the illustrated embodiment as the present invention provides described explanation, but this is only illustrate, it should not do limited explanation. The variation of the apparent the present invention obtained by those skilled in the art is included in the claim book of the present invention.
Claims (3)
1. a transparent conductive base, it is characterised in that,
This transparent conductive base comprises transparent substrate and distribution portion,
Described distribution portion has:
Conductive pattern, it is arranged on described transparent substrate; And
Blackening layer, it is arranged on described conductive pattern,
Described blackening layer is the individual layer containing nickel zinc alloy,
The thickness of described blackening layer is 30nm��70nm,
Nickel in described blackening layer is 3.0��105 relative to the mass ratio of zinc.
2. transparent conductive base according to claim 1, it is characterised in that,
The thickness of described conductive pattern is 0.2 ��m��0.5 ��m.
3. transparent conductive base according to claim 1, it is characterised in that,
The live width of described conductive pattern is 5 ��m��8 ��m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-240914 | 2014-11-28 | ||
| JP2014240914A JP2016103138A (en) | 2014-11-28 | 2014-11-28 | Transparent conductive base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105653083A true CN105653083A (en) | 2016-06-08 |
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ID=56089491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510830924.9A Pending CN105653083A (en) | 2014-11-28 | 2015-11-25 | Transparent conductive substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016103138A (en) |
| KR (1) | KR20160065004A (en) |
| CN (1) | CN105653083A (en) |
| TW (1) | TW201619983A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109416605A (en) * | 2016-07-12 | 2019-03-01 | 住友金属矿山株式会社 | Structure base board, conductive board, manufacturing method, the manufacturing method of conductive board that structure base board is laminated is laminated |
| CN110113887A (en) * | 2019-06-13 | 2019-08-09 | 东莞市润盈电子有限公司 | One kind covering copper glass substrate and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4972381B2 (en) | 2006-11-06 | 2012-07-11 | 富士フイルム株式会社 | Translucent conductive material, manufacturing method thereof, and translucent electromagnetic wave shielding film |
-
2014
- 2014-11-28 JP JP2014240914A patent/JP2016103138A/en active Pending
-
2015
- 2015-11-25 CN CN201510830924.9A patent/CN105653083A/en active Pending
- 2015-11-26 TW TW104139482A patent/TW201619983A/en unknown
- 2015-11-26 KR KR1020150166104A patent/KR20160065004A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109416605A (en) * | 2016-07-12 | 2019-03-01 | 住友金属矿山株式会社 | Structure base board, conductive board, manufacturing method, the manufacturing method of conductive board that structure base board is laminated is laminated |
| CN109416605B (en) * | 2016-07-12 | 2022-06-07 | 住友金属矿山株式会社 | Laminate substrate, conductive substrate, method for producing laminate substrate, and method for producing conductive substrate |
| CN110113887A (en) * | 2019-06-13 | 2019-08-09 | 东莞市润盈电子有限公司 | One kind covering copper glass substrate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016103138A (en) | 2016-06-02 |
| KR20160065004A (en) | 2016-06-08 |
| TW201619983A (en) | 2016-06-01 |
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Application publication date: 20160608 |