TWI265088B - Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter - Google Patents

Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter

Info

Publication number
TWI265088B
TWI265088B TW94100074A TW94100074A TWI265088B TW I265088 B TWI265088 B TW I265088B TW 94100074 A TW94100074 A TW 94100074A TW 94100074 A TW94100074 A TW 94100074A TW I265088 B TWI265088 B TW I265088B
Authority
TW
Taiwan
Prior art keywords
electromagnetic wave
wave shield
copper foil
shield filter
display
Prior art date
Application number
TW94100074A
Other languages
English (en)
Other versions
TW200526404A (en
Inventor
Nobuchika Yagihashi
Kiyotaka Nakaya
Original Assignee
Nippon Denkai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Ltd filed Critical Nippon Denkai Ltd
Publication of TW200526404A publication Critical patent/TW200526404A/zh
Application granted granted Critical
Publication of TWI265088B publication Critical patent/TWI265088B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroplating Methods And Accessories (AREA)
TW94100074A 2004-01-06 2005-01-03 Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter TWI265088B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004000718 2004-01-06

Publications (2)

Publication Number Publication Date
TW200526404A TW200526404A (en) 2005-08-16
TWI265088B true TWI265088B (en) 2006-11-01

Family

ID=34746958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94100074A TWI265088B (en) 2004-01-06 2005-01-03 Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter

Country Status (4)

Country Link
JP (1) JP4365372B2 (zh)
CN (1) CN100486411C (zh)
TW (1) TWI265088B (zh)
WO (1) WO2005067362A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP5167181B2 (ja) * 2009-03-25 2013-03-21 大日本印刷株式会社 電磁波遮蔽フィルタ
JP5419514B2 (ja) * 2009-03-30 2014-02-19 太陽ホールディングス株式会社 穴埋め用樹脂組成物及びこの樹脂組成物を充填したプリント配線板
CN102181889B (zh) * 2011-04-08 2012-07-04 联合铜箔(惠州)有限公司 一种电解铜箔用添加剂、电解铜箔生产工艺和电解铜箔
JP6186805B2 (ja) * 2013-03-28 2017-08-30 大日本印刷株式会社 タッチパネル
US10923644B2 (en) * 2018-08-20 2021-02-16 Lg Chem, Ltd. Embedded electrode substrate for transparent light emitting device display and method for manufacturing thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685486A (ja) * 1992-09-01 1994-03-25 Nippon Sheet Glass Co Ltd 電磁波遮蔽体
JPH1197877A (ja) * 1997-09-19 1999-04-09 Oji Paper Co Ltd 電磁波シールド用透明導電性フィルム
JP3363083B2 (ja) * 1997-12-17 2003-01-07 住友大阪セメント株式会社 透明基体およびその製造方法
KR100625919B1 (ko) * 1998-08-05 2006-09-20 닛본 이따 가라스 가부시끼가이샤 반사 방지 착색막 코팅 유리 및 플라스마 디스플레이 패널용 광학 필터
JP4004161B2 (ja) * 1998-11-26 2007-11-07 三井化学株式会社 透明積層体及びそれを用いたディスプレイ用フィルター
JP2000238170A (ja) * 1998-12-22 2000-09-05 Mitsui Chemicals Inc 透明導電性フィルム
JP2002372617A (ja) * 2001-06-14 2002-12-26 Fuji Photo Film Co Ltd 光学フィルターおよび画像表示装置
JP2003201597A (ja) * 2002-01-09 2003-07-18 Nippon Denkai Kk 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体
JP2004288972A (ja) * 2003-03-24 2004-10-14 Shin Etsu Polymer Co Ltd 電磁波シールド体及びその製造方法

Also Published As

Publication number Publication date
WO2005067362A1 (ja) 2005-07-21
CN100486411C (zh) 2009-05-06
JP4365372B2 (ja) 2009-11-18
JPWO2005067362A1 (ja) 2007-12-27
CN1902994A (zh) 2007-01-24
TW200526404A (en) 2005-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees