JPS6459986A - Ceramic circuit board - Google Patents

Ceramic circuit board

Info

Publication number
JPS6459986A
JPS6459986A JP62217007A JP21700787A JPS6459986A JP S6459986 A JPS6459986 A JP S6459986A JP 62217007 A JP62217007 A JP 62217007A JP 21700787 A JP21700787 A JP 21700787A JP S6459986 A JPS6459986 A JP S6459986A
Authority
JP
Japan
Prior art keywords
thickness
copper
copper plate
board
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62217007A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525397B2 (enrdf_load_html_response
Inventor
Tadashi Tanaka
Kazuo Matsumura
Shoji Tsuruya
Shunichiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62217007A priority Critical patent/JPS6459986A/ja
Publication of JPS6459986A publication Critical patent/JPS6459986A/ja
Publication of JPH0525397B2 publication Critical patent/JPH0525397B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP62217007A 1987-08-31 1987-08-31 Ceramic circuit board Granted JPS6459986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62217007A JPS6459986A (en) 1987-08-31 1987-08-31 Ceramic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62217007A JPS6459986A (en) 1987-08-31 1987-08-31 Ceramic circuit board

Publications (2)

Publication Number Publication Date
JPS6459986A true JPS6459986A (en) 1989-03-07
JPH0525397B2 JPH0525397B2 (enrdf_load_html_response) 1993-04-12

Family

ID=16697361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62217007A Granted JPS6459986A (en) 1987-08-31 1987-08-31 Ceramic circuit board

Country Status (1)

Country Link
JP (1) JPS6459986A (enrdf_load_html_response)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103150A (ja) * 1990-08-23 1992-04-06 Mitsubishi Materials Corp Ｉｃ実装構造
US5986218A (en) * 1995-11-08 1999-11-16 Mitsubishi Denki Kabushiki Kaisha Circuit board with conductor layer for increased breakdown voltage
JP2000020261A (ja) * 1998-07-01 2000-01-21 Ricoh Co Ltd 画像形成装置
US6054762A (en) * 1996-08-27 2000-04-25 Dowa Mining Co., Ltd. Semiconductor substrates of high reliability ceramic metal composites
JP2001168482A (ja) * 1999-09-28 2001-06-22 Toshiba Corp セラミックス回路基板
JP2001267447A (ja) * 2000-03-14 2001-09-28 Toshiba Corp セラミックス回路基板及び半導体装置
JP2004014589A (ja) * 2002-06-04 2004-01-15 Dowa Mining Co Ltd 金属−セラミックス接合体およびその製造方法
EP1416533A2 (en) 2002-10-29 2004-05-06 Ixys Corporation Power device and direct aluminium bonded substrate thereof
JP2006286754A (ja) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd 金属−セラミックス接合基板
JP2008294047A (ja) * 2007-05-22 2008-12-04 T Rad Co Ltd セラミック回路基板構造
JP2008294284A (ja) * 2007-05-25 2008-12-04 Toyota Industries Corp 半導体装置
JP2009043763A (ja) * 2007-08-06 2009-02-26 Toyota Motor Corp 接合層含有部材とその製造方法
JP2009105456A (ja) * 2009-02-12 2009-05-14 Toshiba Corp 半導体装置
JP2010103311A (ja) * 2008-10-23 2010-05-06 Toyota Central R&D Labs Inc 積層基板
EP2306501A2 (en) 2009-10-02 2011-04-06 Ibiden Co., Ltd. Ceramic wiring board and method of manufacturing thereof
JP2011176065A (ja) * 2010-02-24 2011-09-08 Toyota Central R&D Labs Inc 半導体モジュール
JP2012182279A (ja) * 2011-03-01 2012-09-20 Showa Denko Kk 絶縁回路基板およびその製造方法、パワーモジュール用ベースおよびその製造方法
EP1061783B1 (de) 1999-06-14 2013-11-20 Curamik Electronics GmbH Keramik-Metall-Substrat, insbesondere Mehrfachsubstrat
JP2014229898A (ja) * 2013-05-22 2014-12-08 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド 熱応力低減要素を有する電力エレクトロニクス・デバイス
JP2015070061A (ja) * 2013-09-27 2015-04-13 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
WO2015097748A1 (ja) * 2013-12-24 2015-07-02 三菱電機株式会社 電力変換装置、及びパワーモジュール
CN107004644A (zh) * 2014-12-18 2017-08-01 三菱电机株式会社 绝缘电路基板、功率模块以及功率单元
WO2020067427A1 (ja) * 2018-09-27 2020-04-02 デンカ株式会社 接合基板、金属回路基板及び回路基板
WO2021100126A1 (ja) * 2019-11-19 2021-05-27 トヨタ自動車株式会社 半導体装置
EP3745452A4 (en) * 2018-01-24 2021-10-27 Mitsubishi Materials Corporation PROCESS FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
CN113767455A (zh) * 2019-05-02 2021-12-07 阿莫善斯有限公司 陶瓷基板及陶瓷基板制造方法
WO2023052589A1 (de) * 2021-10-01 2023-04-06 Rogers Germany Gmbh Metall-keramik-substrat und verfahren zur herstellung eines metall-keramik-substrats

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0935286A4 (en) * 1997-05-26 2008-04-09 Sumitomo Electric Industries COPPER CIRCUIT CONNECTING SUBSTRATE AND ITS MANUFACTURE
JP5294579B2 (ja) * 2007-06-28 2013-09-18 株式会社豊田中央研究所 セラミックセンサ
JP2009272647A (ja) * 2009-08-12 2009-11-19 Dowa Holdings Co Ltd 回路基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121978A (en) * 1979-03-16 1980-09-19 Tokyo Shibaura Electric Co Bonding structure of ceramic and metal
JPS59121890A (ja) * 1982-12-28 1984-07-14 株式会社東芝 セラミツクスと金属との接合体
JPS61156791A (ja) * 1984-12-28 1986-07-16 株式会社東芝 セラミツクス回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121978A (en) * 1979-03-16 1980-09-19 Tokyo Shibaura Electric Co Bonding structure of ceramic and metal
JPS59121890A (ja) * 1982-12-28 1984-07-14 株式会社東芝 セラミツクスと金属との接合体
JPS61156791A (ja) * 1984-12-28 1986-07-16 株式会社東芝 セラミツクス回路基板

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103150A (ja) * 1990-08-23 1992-04-06 Mitsubishi Materials Corp Ｉｃ実装構造
US5986218A (en) * 1995-11-08 1999-11-16 Mitsubishi Denki Kabushiki Kaisha Circuit board with conductor layer for increased breakdown voltage
US6054762A (en) * 1996-08-27 2000-04-25 Dowa Mining Co., Ltd. Semiconductor substrates of high reliability ceramic metal composites
JP2000020261A (ja) * 1998-07-01 2000-01-21 Ricoh Co Ltd 画像形成装置
EP1061783B1 (de) 1999-06-14 2013-11-20 Curamik Electronics GmbH Keramik-Metall-Substrat, insbesondere Mehrfachsubstrat
JP2001168482A (ja) * 1999-09-28 2001-06-22 Toshiba Corp セラミックス回路基板
JP2001267447A (ja) * 2000-03-14 2001-09-28 Toshiba Corp セラミックス回路基板及び半導体装置
US7048866B2 (en) 2002-06-04 2006-05-23 Dowa Mining Co., Ltd. Metal/ceramic bonding article and method for producing same
JP2004014589A (ja) * 2002-06-04 2004-01-15 Dowa Mining Co Ltd 金属−セラミックス接合体およびその製造方法
EP1416533A2 (en) 2002-10-29 2004-05-06 Ixys Corporation Power device and direct aluminium bonded substrate thereof
EP2317549A3 (en) * 2002-10-29 2011-09-14 Ixys Corporation Direct bonded substrate for a power semiconductor device.
JP2006286754A (ja) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd 金属−セラミックス接合基板
JP2008294047A (ja) * 2007-05-22 2008-12-04 T Rad Co Ltd セラミック回路基板構造
JP2008294284A (ja) * 2007-05-25 2008-12-04 Toyota Industries Corp 半導体装置
JP2009043763A (ja) * 2007-08-06 2009-02-26 Toyota Motor Corp 接合層含有部材とその製造方法
JP2010103311A (ja) * 2008-10-23 2010-05-06 Toyota Central R&D Labs Inc 積層基板
JP2009105456A (ja) * 2009-02-12 2009-05-14 Toshiba Corp 半導体装置
EP2306501A2 (en) 2009-10-02 2011-04-06 Ibiden Co., Ltd. Ceramic wiring board and method of manufacturing thereof
JP2011176065A (ja) * 2010-02-24 2011-09-08 Toyota Central R&D Labs Inc 半導体モジュール
JP2012182279A (ja) * 2011-03-01 2012-09-20 Showa Denko Kk 絶縁回路基板およびその製造方法、パワーモジュール用ベースおよびその製造方法
JP2014229898A (ja) * 2013-05-22 2014-12-08 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド 熱応力低減要素を有する電力エレクトロニクス・デバイス
JP2015070061A (ja) * 2013-09-27 2015-04-13 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
WO2015097748A1 (ja) * 2013-12-24 2015-07-02 三菱電機株式会社 電力変換装置、及びパワーモジュール
JPWO2015097748A1 (ja) * 2013-12-24 2017-03-23 三菱電機株式会社 電力変換装置
CN107004644A (zh) * 2014-12-18 2017-08-01 三菱电机株式会社 绝缘电路基板、功率模块以及功率单元
US10170433B2 (en) 2014-12-18 2019-01-01 Mitsubishi Electric Corporation Insulated circuit board, power module and power unit
CN107004644B (zh) * 2014-12-18 2019-05-07 三菱电机株式会社 绝缘电路基板、功率模块以及功率单元
US11676882B2 (en) 2018-01-24 2023-06-13 Mitsubishi Materials Corporation Method of manufacturing power module substrate board and ceramic-copper bonded body
EP3745452A4 (en) * 2018-01-24 2021-10-27 Mitsubishi Materials Corporation PROCESS FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, AND CERAMIC-COPPER JOINT BODY
WO2020067427A1 (ja) * 2018-09-27 2020-04-02 デンカ株式会社 接合基板、金属回路基板及び回路基板
US11497125B2 (en) 2018-09-27 2022-11-08 Denka Company Limited Bonded substrate, metal circuit board, and circuit board
JPWO2020067427A1 (ja) * 2018-09-27 2021-09-02 デンカ株式会社 接合基板、金属回路基板及び回路基板
CN113767455A (zh) * 2019-05-02 2021-12-07 阿莫善斯有限公司 陶瓷基板及陶瓷基板制造方法
JPWO2021100126A1 (enrdf_load_html_response) * 2019-11-19 2021-05-27
WO2021100126A1 (ja) * 2019-11-19 2021-05-27 トヨタ自動車株式会社 半導体装置
US12159810B2 (en) 2019-11-19 2024-12-03 Denso Corporation Semiconductor device
WO2023052589A1 (de) * 2021-10-01 2023-04-06 Rogers Germany Gmbh Metall-keramik-substrat und verfahren zur herstellung eines metall-keramik-substrats
JP2024534254A (ja) * 2021-10-01 2024-09-18 ロジャーズ ジャーマニー ゲーエムベーハー 金属セラミック基板及び金属セラミック基板の製造方法

Also Published As

Publication number Publication date
JPH0525397B2 (enrdf_load_html_response) 1993-04-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080412

Year of fee payment: 15