JPS638414A - 熱硬化性粉体組成物 - Google Patents

熱硬化性粉体組成物

Info

Publication number
JPS638414A
JPS638414A JP15199786A JP15199786A JPS638414A JP S638414 A JPS638414 A JP S638414A JP 15199786 A JP15199786 A JP 15199786A JP 15199786 A JP15199786 A JP 15199786A JP S638414 A JPS638414 A JP S638414A
Authority
JP
Japan
Prior art keywords
mixed system
epoxy resin
imidazole
curing agent
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15199786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528726B2 (enExample
Inventor
Katsuji Kitagawa
勝治 北川
Ichiro Akutagawa
芥川　一郎
Toshio Matsuo
松尾　敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP15199786A priority Critical patent/JPS638414A/ja
Publication of JPS638414A publication Critical patent/JPS638414A/ja
Publication of JPH0528726B2 publication Critical patent/JPH0528726B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP15199786A 1986-06-28 1986-06-28 熱硬化性粉体組成物 Granted JPS638414A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15199786A JPS638414A (ja) 1986-06-28 1986-06-28 熱硬化性粉体組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15199786A JPS638414A (ja) 1986-06-28 1986-06-28 熱硬化性粉体組成物

Publications (2)

Publication Number Publication Date
JPS638414A true JPS638414A (ja) 1988-01-14
JPH0528726B2 JPH0528726B2 (enExample) 1993-04-27

Family

ID=15530807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15199786A Granted JPS638414A (ja) 1986-06-28 1986-06-28 熱硬化性粉体組成物

Country Status (1)

Country Link
JP (1) JPS638414A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805967B2 (en) 1999-12-17 2004-10-19 Sony Chemicals Corp. Polyamic acid varnish composition and a flexible printed board
FR2941557A1 (fr) * 2009-01-29 2010-07-30 Commissariat Energie Atomique Procede de preparation d'un article conducteur de l'electricite
US7781542B2 (en) 2004-06-02 2010-08-24 Hexcel Composites, Ltd. Cure accelerators
JP2011105945A (ja) * 2011-01-04 2011-06-02 Hitachi Chem Co Ltd 硬化剤の製造法，及びこれを用いた熱硬化性樹脂組成物
US11217514B2 (en) 2018-05-09 2022-01-04 Mitsubishi Electric Corporation Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040628A (enExample) * 1973-07-19 1975-04-14
JPS5087125A (enExample) * 1973-12-05 1975-07-14
JPS50134098A (enExample) * 1974-04-15 1975-10-23
JPS52119698A (en) * 1976-04-01 1977-10-07 Hitachi Ltd Resin compositions
JPS6173724A (ja) * 1984-09-20 1986-04-15 Mitsubishi Petrochem Co Ltd 樹脂組成物
JPS61103921A (ja) * 1984-10-29 1986-05-22 Mitsubishi Petrochem Co Ltd 熱硬化性樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040628A (enExample) * 1973-07-19 1975-04-14
JPS5087125A (enExample) * 1973-12-05 1975-07-14
JPS50134098A (enExample) * 1974-04-15 1975-10-23
JPS52119698A (en) * 1976-04-01 1977-10-07 Hitachi Ltd Resin compositions
JPS6173724A (ja) * 1984-09-20 1986-04-15 Mitsubishi Petrochem Co Ltd 樹脂組成物
JPS61103921A (ja) * 1984-10-29 1986-05-22 Mitsubishi Petrochem Co Ltd 熱硬化性樹脂組成物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805967B2 (en) 1999-12-17 2004-10-19 Sony Chemicals Corp. Polyamic acid varnish composition and a flexible printed board
US7098267B2 (en) 1999-12-17 2006-08-29 Sony Chemicals Corp. Polyamic acid varnish composition and a flexible printed board
US7781542B2 (en) 2004-06-02 2010-08-24 Hexcel Composites, Ltd. Cure accelerators
FR2941557A1 (fr) * 2009-01-29 2010-07-30 Commissariat Energie Atomique Procede de preparation d'un article conducteur de l'electricite
WO2010086397A1 (fr) * 2009-01-29 2010-08-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de preparation d'un article conducteur de l'electricite
US9048010B2 (en) 2009-01-29 2015-06-02 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for preparing an electrically conducting article
JP2011105945A (ja) * 2011-01-04 2011-06-02 Hitachi Chem Co Ltd 硬化剤の製造法，及びこれを用いた熱硬化性樹脂組成物
US11217514B2 (en) 2018-05-09 2022-01-04 Mitsubishi Electric Corporation Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device

Also Published As

Publication number Publication date
JPH0528726B2 (enExample) 1993-04-27

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