JPS6337498B2 - - Google Patents

Info

Publication number
JPS6337498B2
JPS6337498B2 JP55012496A JP1249680A JPS6337498B2 JP S6337498 B2 JPS6337498 B2 JP S6337498B2 JP 55012496 A JP55012496 A JP 55012496A JP 1249680 A JP1249680 A JP 1249680A JP S6337498 B2 JPS6337498 B2 JP S6337498B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
wire bonding
semiconductor
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55012496A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56110244A (en
Inventor
Hajime Murakami
Shinji Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP1249680A priority Critical patent/JPS56110244A/ja
Publication of JPS56110244A publication Critical patent/JPS56110244A/ja
Publication of JPS6337498B2 publication Critical patent/JPS6337498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1249680A 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof Granted JPS56110244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1249680A JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Publications (2)

Publication Number Publication Date
JPS56110244A JPS56110244A (en) 1981-09-01
JPS6337498B2 true JPS6337498B2 (enExample) 1988-07-26

Family

ID=11806975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1249680A Granted JPS56110244A (en) 1980-02-06 1980-02-06 Printed circuit board for semiconductor device and wire bonding method thereof

Country Status (1)

Country Link
JP (1) JPS56110244A (enExample)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140858A (enExample) * 1974-05-02 1975-11-12
JPS5310426B2 (enExample) * 1974-10-04 1978-04-13
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS5237768A (en) * 1975-09-19 1977-03-23 Seiko Instr & Electronics Ltd Substrate having positioning marks
JPS52127069A (en) * 1976-04-16 1977-10-25 Shinkawa Ltd Wire bonding apparatus
JPS5329068A (en) * 1976-08-31 1978-03-17 Sony Corp Automatic wire bonding unit
JPS5390863A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Wire bonding method and mark provided on subsutrate
JPS5826664B2 (ja) * 1977-09-27 1983-06-04 松下電器産業株式会社 自動ワイヤボンデイング方法
JPS5847704Y2 (ja) * 1978-04-10 1983-10-31 日本電気株式会社 半導体装置用容器
JPS5827657B2 (ja) * 1978-04-12 1983-06-10 株式会社日立製作所 テ−プキヤリア方式のボンデイング方法及びその装置
JPS5629357A (en) * 1979-08-18 1981-03-24 Mitsubishi Electric Corp Semiconductor container
JPS5737768A (en) * 1980-08-18 1982-03-02 Pioneer Electronic Corp Bookshelf type record player

Also Published As

Publication number Publication date
JPS56110244A (en) 1981-09-01

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