JPS63148647A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS63148647A
JPS63148647A JP61295901A JP29590186A JPS63148647A JP S63148647 A JPS63148647 A JP S63148647A JP 61295901 A JP61295901 A JP 61295901A JP 29590186 A JP29590186 A JP 29590186A JP S63148647 A JPS63148647 A JP S63148647A
Authority
JP
Japan
Prior art keywords
bonding pad
bonding
silicon nitride
nitride film
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61295901A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546980B2 (enExample
Inventor
Tetsuya Okuzumi
奥住　哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61295901A priority Critical patent/JPS63148647A/ja
Publication of JPS63148647A publication Critical patent/JPS63148647A/ja
Publication of JPH0546980B2 publication Critical patent/JPH0546980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4807—Shape of bonding interfaces, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4845—Details of ball bonds
    • H01L2224/48451—Shape
    • H01L2224/48453—Shape of the interface with the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61295901A 1986-12-12 1986-12-12 半導体装置 Granted JPS63148647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61295901A JPS63148647A (ja) 1986-12-12 1986-12-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61295901A JPS63148647A (ja) 1986-12-12 1986-12-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS63148647A true JPS63148647A (ja) 1988-06-21
JPH0546980B2 JPH0546980B2 (enExample) 1993-07-15

Family

ID=17826621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61295901A Granted JPS63148647A (ja) 1986-12-12 1986-12-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS63148647A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61187262A (ja) * 1985-02-14 1986-08-20 Matsushita Electronics Corp 半導体素子
JPS6220352A (ja) * 1985-07-18 1987-01-28 Nec Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61187262A (ja) * 1985-02-14 1986-08-20 Matsushita Electronics Corp 半導体素子
JPS6220352A (ja) * 1985-07-18 1987-01-28 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0546980B2 (enExample) 1993-07-15

Similar Documents

Publication Publication Date Title
US5886412A (en) Angularly offset and recessed stacked die multichip device
US5349233A (en) Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame
JPS5821850A (ja) 樹脂封止型半導体装置
JPS6156608B2 (enExample)
JPS63148647A (ja) 半導体装置
JPS61214444A (ja) 半導体装置
JPH05206361A (ja) 半導体装置
JPH0357248A (ja) テープキャリア方式による樹脂封止型半導体装置
JPS62219541A (ja) 半導体装置
JPS635250Y2 (enExample)
JPS62296541A (ja) 樹脂封止型半導体装置
JPS5891651A (ja) 半導体装置
KR940010298A (ko) 반도체 패키지 및 그의 제조방법
JP2506938Y2 (ja) 樹脂封止型電子回路装置
JPS62226636A (ja) プラスチツクチツプキヤリア
JPS63175454A (ja) 半導体モジュール
JP2815974B2 (ja) 半導体装置
JPH06295934A (ja) フィルムキャリアリード及びそれを用いたｌｓｉ構造
JPS5844593Y2 (ja) ビ−ム・リ−ド型半導体装置
JPS63248155A (ja) 半導体装置
JPS60194553A (ja) 混成集積回路装置
JPS6163042A (ja) 樹脂封止半導体装置
JPH0360035A (ja) 半導体装置
JPS60254756A (ja) 樹脂封止型半導体装置およびその製造方法
JP2568812B2 (ja) 実装体