JPS63140634U - - Google Patents

Info

Publication number
JPS63140634U
JPS63140634U JP3301487U JP3301487U JPS63140634U JP S63140634 U JPS63140634 U JP S63140634U JP 3301487 U JP3301487 U JP 3301487U JP 3301487 U JP3301487 U JP 3301487U JP S63140634 U JPS63140634 U JP S63140634U
Authority
JP
Japan
Prior art keywords
wiring
insulating film
metal wiring
interlayer insulating
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3301487U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3301487U priority Critical patent/JPS63140634U/ja
Publication of JPS63140634U publication Critical patent/JPS63140634U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】
第１図は一実施例を示す断面図、第２図Ａない
し同図Ｆは同実施例の製造工程を示す断面図、第
３図Ａないし同図Ｇは同実施例の他の製造工程を
示す断面図、第４図Ａないし同図Ｅは従来の多層
配線の製造工程を示す断面図である。 ２……下地、４……下層メタル配線、１０……
層間絶縁膜、１２……上層メタル配線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 下層メタル配線と上層メタル配線との間に層間
    絶縁膜が介在し、両メタル配線が前記層間絶縁膜
    のビアホールを経て接続されている配線において
    、前記上層メタル配線の表面がビアホール部分と
    前記層間絶縁膜上部分とで同一高さになつている
    ことを特徴とする半導体集積回路装置の配線。
JP3301487U 1987-03-05 1987-03-05 Pending JPS63140634U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3301487U JPS63140634U (ja) 1987-03-05 1987-03-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3301487U JPS63140634U (ja) 1987-03-05 1987-03-05

Publications (1)

Publication Number Publication Date
JPS63140634U true JPS63140634U (ja) 1988-09-16

Family

ID=30840228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3301487U Pending JPS63140634U (ja) 1987-03-05 1987-03-05

Country Status (1)

Country Link
JP (1) JPS63140634U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60192348A (ja) * 1984-03-13 1985-09-30 Fuji Electric Corp Res & Dev Ltd 半導体集積回路の多層配線の形成方法
JPS61208849A (ja) * 1985-03-13 1986-09-17 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61208851A (ja) * 1985-03-13 1986-09-17 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61239646A (ja) * 1985-04-16 1986-10-24 Nec Corp 多層配線の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60192348A (ja) * 1984-03-13 1985-09-30 Fuji Electric Corp Res & Dev Ltd 半導体集積回路の多層配線の形成方法
JPS61208849A (ja) * 1985-03-13 1986-09-17 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61208851A (ja) * 1985-03-13 1986-09-17 Mitsubishi Electric Corp 半導体装置の製造方法
JPS61239646A (ja) * 1985-04-16 1986-10-24 Nec Corp 多層配線の形成方法

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