JPS61177446U - - Google Patents

Info

Publication number
JPS61177446U
JPS61177446U JP6163485U JP6163485U JPS61177446U JP S61177446 U JPS61177446 U JP S61177446U JP 6163485 U JP6163485 U JP 6163485U JP 6163485 U JP6163485 U JP 6163485U JP S61177446 U JPS61177446 U JP S61177446U
Authority
JP
Japan
Prior art keywords
chip
bonding pad
capacitor
die bonding
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6163485U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6163485U priority Critical patent/JPS61177446U/ja
Publication of JPS61177446U publication Critical patent/JPS61177446U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案による基板の断面図、第2図は
従来基板の断面図である。 1……トランジスタチツプ、2……ダイボンデ
イングパツド、3……上部配線導体、4……下部
電極、5……スルーホール、6……基板、7……
絶縁層、8……チツプコンデンサ、9……はんだ
、10……配線導体。

Claims (1)

    【実用新案登録請求の範囲】
  1. チツプ搭載用のダイボンデイングパツド部に多
    層技術によりコンデンサーを形成したことを特徴
    とする混成集積回路基板。
JP6163485U 1985-04-24 1985-04-24 Pending JPS61177446U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6163485U JPS61177446U (ja) 1985-04-24 1985-04-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6163485U JPS61177446U (ja) 1985-04-24 1985-04-24

Publications (1)

Publication Number Publication Date
JPS61177446U true JPS61177446U (ja) 1986-11-05

Family

ID=30590087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6163485U Pending JPS61177446U (ja) 1985-04-24 1985-04-24

Country Status (1)

Country Link
JP (1) JPS61177446U (ja)

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