JPS63126297A - 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 - Google Patents
多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤Info
- Publication number
- JPS63126297A JPS63126297A JP27227086A JP27227086A JPS63126297A JP S63126297 A JPS63126297 A JP S63126297A JP 27227086 A JP27227086 A JP 27227086A JP 27227086 A JP27227086 A JP 27227086A JP S63126297 A JPS63126297 A JP S63126297A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- resin
- printed wiring
- wiring board
- particulate matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims description 67
- 239000011347 resin Substances 0.000 claims description 67
- 239000000126 substance Substances 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 23
- 239000013618 particulate matter Substances 0.000 claims description 23
- 238000007772 electroless plating Methods 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229920006015 heat resistant resin Polymers 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 239000009719 polyimide resin Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000010419 fine particle Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 5
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 2
- -1 permanganate Chemical compound 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 239000011236 particulate material Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052851 sillimanite Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27227086A JPS63126297A (ja) | 1986-11-14 | 1986-11-14 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27227086A JPS63126297A (ja) | 1986-11-14 | 1986-11-14 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63126297A true JPS63126297A (ja) | 1988-05-30 |
| JPH0455555B2 JPH0455555B2 (enrdf_load_stackoverflow) | 1992-09-03 |
Family
ID=17511507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27227086A Granted JPS63126297A (ja) | 1986-11-14 | 1986-11-14 | 多層プリント配線板並びにそれの製造方法と無電解めっき用絶縁剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63126297A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3913966A1 (de) * | 1988-04-28 | 1989-11-09 | Ibiden Co Ltd | Klebstoff zum stromlosen plattieren und gedruckte schaltung unter verwendung dieses klebstoffs |
| JPH0298995A (ja) * | 1988-10-06 | 1990-04-11 | Ibiden Co Ltd | 多層配線板の製造方法 |
| JPH02143492A (ja) * | 1988-11-24 | 1990-06-01 | Ibiden Co Ltd | 高密度多層プリント配線板の製造方法 |
| JPH02188992A (ja) * | 1989-01-18 | 1990-07-25 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| US5344893A (en) * | 1991-07-23 | 1994-09-06 | Ibiden Co., Ltd. | Epoxy/amino powder resin adhesive for printed circuit board |
| WO1998047329A1 (fr) * | 1997-04-15 | 1998-10-22 | Ibiden Co., Ltd. | Adhesif utile pour effectuer le depot autocatalytique, composition de produit de depart utile pour preparer de l'adhesif pour depot catalytique et carte imprimee |
| US5976762A (en) * | 1996-03-06 | 1999-11-02 | Fuji Photo Film Co., Ltd. | Photosensitive element and process for producing multilayer printed wiring board |
| JP2000068642A (ja) * | 1998-08-25 | 2000-03-03 | Fujitsu Ltd | 多層回路基板の製造方法 |
| US6835895B1 (en) | 1996-12-19 | 2004-12-28 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US7291385B2 (en) | 2003-08-05 | 2007-11-06 | Fujifilm Corporation | Conductive film and method for preparing the same |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0817548B1 (en) | 1996-01-11 | 2006-04-05 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| EP0999731B1 (en) | 1997-07-08 | 2011-01-05 | Ibiden Co., Ltd. | Printed wiring board comprising conductor circuits for solder pads |
| MY120077A (en) | 1998-06-26 | 2005-08-30 | Ibiden Co Ltd | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
| EP1940209B1 (en) | 1998-07-08 | 2010-06-02 | Ibiden Co., Ltd. | Printed wiring board and method of producing the same |
| MY144573A (en) * | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
| MY139405A (en) | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
| DE112011105153T5 (de) * | 2011-04-13 | 2014-01-16 | Sankyo Kasei Co. Ltd. | Im Spritzgussverfahren hergestellte Schaltkreiskomponente |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196872A (ja) * | 1975-02-21 | 1976-08-25 | Netsukokaseijushiseikeibutsuno metsukiho | |
| JPS56100497A (en) * | 1980-01-11 | 1981-08-12 | Mitsumi Electric Co Ltd | Ceramic circuit board |
| JPS56138993A (en) * | 1980-04-01 | 1981-10-29 | Nippon Telegraph & Telephone | Method of producing multilayer printed cirucit board |
| JPS5954296A (ja) * | 1982-09-21 | 1984-03-29 | 日本電信電話株式会社 | 多層印刷配線板の製造方法 |
| JPS617695A (ja) * | 1984-06-21 | 1986-01-14 | イビデン株式会社 | 長尺の可撓性両面プリント配線板の製造方法 |
| JPS61121393A (ja) * | 1984-11-19 | 1986-06-09 | 旭化成株式会社 | 多層配線板の製造方法 |
| JPS61154198A (ja) * | 1984-12-27 | 1986-07-12 | 日立コンデンサ株式会社 | 多層印刷配線板の製造方法 |
-
1986
- 1986-11-14 JP JP27227086A patent/JPS63126297A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196872A (ja) * | 1975-02-21 | 1976-08-25 | Netsukokaseijushiseikeibutsuno metsukiho | |
| JPS56100497A (en) * | 1980-01-11 | 1981-08-12 | Mitsumi Electric Co Ltd | Ceramic circuit board |
| JPS56138993A (en) * | 1980-04-01 | 1981-10-29 | Nippon Telegraph & Telephone | Method of producing multilayer printed cirucit board |
| JPS5954296A (ja) * | 1982-09-21 | 1984-03-29 | 日本電信電話株式会社 | 多層印刷配線板の製造方法 |
| JPS617695A (ja) * | 1984-06-21 | 1986-01-14 | イビデン株式会社 | 長尺の可撓性両面プリント配線板の製造方法 |
| JPS61121393A (ja) * | 1984-11-19 | 1986-06-09 | 旭化成株式会社 | 多層配線板の製造方法 |
| JPS61154198A (ja) * | 1984-12-27 | 1986-07-12 | 日立コンデンサ株式会社 | 多層印刷配線板の製造方法 |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3913966B4 (de) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung |
| US5589255A (en) * | 1988-04-28 | 1996-12-31 | Ibiden Co., Ltd. | Adhesive for electroless plating, printed circuit boards and method of producing the same |
| DE3913966A1 (de) * | 1988-04-28 | 1989-11-09 | Ibiden Co Ltd | Klebstoff zum stromlosen plattieren und gedruckte schaltung unter verwendung dieses klebstoffs |
| JPH0298995A (ja) * | 1988-10-06 | 1990-04-11 | Ibiden Co Ltd | 多層配線板の製造方法 |
| JPH02143492A (ja) * | 1988-11-24 | 1990-06-01 | Ibiden Co Ltd | 高密度多層プリント配線板の製造方法 |
| JPH02188992A (ja) * | 1989-01-18 | 1990-07-25 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| US5344893A (en) * | 1991-07-23 | 1994-09-06 | Ibiden Co., Ltd. | Epoxy/amino powder resin adhesive for printed circuit board |
| US5447996A (en) * | 1991-07-23 | 1995-09-05 | Ibiden Co., Ltd. | Adhesive comprising cured amino resin powder for printed circuit board |
| US5688583A (en) * | 1991-07-23 | 1997-11-18 | Ibiden Co., Ltd. | Adhesive for printed circuit board |
| US5741575A (en) * | 1991-07-23 | 1998-04-21 | Ibiden Co., Ltd. | Adhesive for printed circuit board |
| US5795618A (en) * | 1991-07-23 | 1998-08-18 | Ibiden Co., Ltd | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board |
| US5976762A (en) * | 1996-03-06 | 1999-11-02 | Fuji Photo Film Co., Ltd. | Photosensitive element and process for producing multilayer printed wiring board |
| US7371976B2 (en) | 1996-12-19 | 2008-05-13 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US7585541B2 (en) | 1996-12-19 | 2009-09-08 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| USRE43509E1 (en) | 1996-12-19 | 2012-07-17 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US6930255B2 (en) | 1996-12-19 | 2005-08-16 | Ibiden Co., Ltd | Printed circuit boards and method of producing the same |
| US7712212B2 (en) | 1996-12-19 | 2010-05-11 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board |
| US7361849B2 (en) | 1996-12-19 | 2008-04-22 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US7615162B2 (en) | 1996-12-19 | 2009-11-10 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US7385146B2 (en) | 1996-12-19 | 2008-06-10 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US7388159B2 (en) | 1996-12-19 | 2008-06-17 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US7449791B2 (en) | 1996-12-19 | 2008-11-11 | Ibiden Co., Ltd. | Printed circuit boards and method of producing the same |
| US6835895B1 (en) | 1996-12-19 | 2004-12-28 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| WO1998047329A1 (fr) * | 1997-04-15 | 1998-10-22 | Ibiden Co., Ltd. | Adhesif utile pour effectuer le depot autocatalytique, composition de produit de depart utile pour preparer de l'adhesif pour depot catalytique et carte imprimee |
| JP2000068642A (ja) * | 1998-08-25 | 2000-03-03 | Fujitsu Ltd | 多層回路基板の製造方法 |
| US7291385B2 (en) | 2003-08-05 | 2007-11-06 | Fujifilm Corporation | Conductive film and method for preparing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455555B2 (enrdf_load_stackoverflow) | 1992-09-03 |
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