JPS56100497A - Ceramic circuit board - Google Patents

Ceramic circuit board

Info

Publication number
JPS56100497A
JPS56100497A JP188580A JP188580A JPS56100497A JP S56100497 A JPS56100497 A JP S56100497A JP 188580 A JP188580 A JP 188580A JP 188580 A JP188580 A JP 188580A JP S56100497 A JPS56100497 A JP S56100497A
Authority
JP
Japan
Prior art keywords
circuit board
ceramic circuit
ceramic
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP188580A
Other languages
Japanese (ja)
Other versions
JPS6352796B2 (en
Inventor
Masayuki Mitsui
Fumio Iida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP188580A priority Critical patent/JPS56100497A/en
Publication of JPS56100497A publication Critical patent/JPS56100497A/en
Publication of JPS6352796B2 publication Critical patent/JPS6352796B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP188580A 1980-01-11 1980-01-11 Ceramic circuit board Granted JPS56100497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP188580A JPS56100497A (en) 1980-01-11 1980-01-11 Ceramic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP188580A JPS56100497A (en) 1980-01-11 1980-01-11 Ceramic circuit board

Publications (2)

Publication Number Publication Date
JPS56100497A true JPS56100497A (en) 1981-08-12
JPS6352796B2 JPS6352796B2 (en) 1988-10-20

Family

ID=11514016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP188580A Granted JPS56100497A (en) 1980-01-11 1980-01-11 Ceramic circuit board

Country Status (1)

Country Link
JP (1) JPS56100497A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200219A (en) * 1986-02-27 1987-09-03 Canon Inc Encoder
JPS62216295A (en) * 1986-03-17 1987-09-22 株式会社　日本ドウロ−イングコンサルタント Manufacture of double-sided multilayer printed board
JPS63126297A (en) * 1986-11-14 1988-05-30 イビデン株式会社 Multilayer printed interconnection board and manufacture of the same
US7390974B2 (en) 1998-02-26 2008-06-24 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424405A (en) * 1977-07-26 1979-02-23 Fesch Maschf Ferdinand Receiving shovel for agriculture and forestory
JPS556823A (en) * 1978-06-30 1980-01-18 Oki Electric Ind Co Ltd Method of manufacturing ceramic multiilayer wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424405A (en) * 1977-07-26 1979-02-23 Fesch Maschf Ferdinand Receiving shovel for agriculture and forestory
JPS556823A (en) * 1978-06-30 1980-01-18 Oki Electric Ind Co Ltd Method of manufacturing ceramic multiilayer wiring board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200219A (en) * 1986-02-27 1987-09-03 Canon Inc Encoder
JPH0545164B2 (en) * 1986-02-27 1993-07-08 Canon Kk
JPS62216295A (en) * 1986-03-17 1987-09-22 株式会社　日本ドウロ−イングコンサルタント Manufacture of double-sided multilayer printed board
JPS63126297A (en) * 1986-11-14 1988-05-30 イビデン株式会社 Multilayer printed interconnection board and manufacture of the same
JPH0455555B2 (en) * 1986-11-14 1992-09-03 Ibiden Co Ltd
US7390974B2 (en) 1998-02-26 2008-06-24 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US7622183B2 (en) 1998-02-26 2009-11-24 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US7737366B2 (en) 1998-02-26 2010-06-15 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US8115111B2 (en) 1998-02-26 2012-02-14 Ibiden Co., Ltd. Multilayer printed wiring board with filled viahole structure
US8987603B2 (en) 1998-02-26 2015-03-24 Ibiden Co,. Ltd. Multilayer printed wiring board with filled viahole structure

Also Published As

Publication number Publication date
JPS6352796B2 (en) 1988-10-20

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