JPS6281715A - 半導体製造装置 - Google Patents
半導体製造装置Info
- Publication number
- JPS6281715A JPS6281715A JP22295385A JP22295385A JPS6281715A JP S6281715 A JPS6281715 A JP S6281715A JP 22295385 A JP22295385 A JP 22295385A JP 22295385 A JP22295385 A JP 22295385A JP S6281715 A JPS6281715 A JP S6281715A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- chemical agent
- nozzle
- semiconductor
- edge plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- 239000013043 chemical agent Substances 0.000 abstract 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000003814 drug Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- CSNNHWWHGAXBCP-UHFFFAOYSA-L magnesium sulphate Substances [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22295385A JPS6281715A (ja) | 1985-10-07 | 1985-10-07 | 半導体製造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22295385A JPS6281715A (ja) | 1985-10-07 | 1985-10-07 | 半導体製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6281715A true JPS6281715A (ja) | 1987-04-15 |
JPH0350410B2 JPH0350410B2 (enrdf_load_stackoverflow) | 1991-08-01 |
Family
ID=16790462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22295385A Granted JPS6281715A (ja) | 1985-10-07 | 1985-10-07 | 半導体製造装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6281715A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63269533A (ja) * | 1987-04-27 | 1988-11-07 | Nec Corp | 半導体基板の現像装置 |
US6938629B2 (en) * | 2002-11-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Rinsing lid for wet bench |
WO2011145439A1 (ja) * | 2010-05-19 | 2011-11-24 | 東京エレクトロン株式会社 | 基板のエッチング方法及びコンピュータ記憶媒体 |
WO2011145440A1 (ja) * | 2010-05-19 | 2011-11-24 | 東京エレクトロン株式会社 | 処理液の供給方法及びコンピュータ記憶媒体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5252568A (en) * | 1975-10-27 | 1977-04-27 | Nec Corp | Production of semiconductor element |
JPS5633834A (en) * | 1979-08-29 | 1981-04-04 | Toshiba Corp | Manufacturing device of semiconductor |
JPS60198818A (ja) * | 1984-03-23 | 1985-10-08 | Nec Corp | フオトレジストの現像装置 |
-
1985
- 1985-10-07 JP JP22295385A patent/JPS6281715A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5252568A (en) * | 1975-10-27 | 1977-04-27 | Nec Corp | Production of semiconductor element |
JPS5633834A (en) * | 1979-08-29 | 1981-04-04 | Toshiba Corp | Manufacturing device of semiconductor |
JPS60198818A (ja) * | 1984-03-23 | 1985-10-08 | Nec Corp | フオトレジストの現像装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63269533A (ja) * | 1987-04-27 | 1988-11-07 | Nec Corp | 半導体基板の現像装置 |
US6938629B2 (en) * | 2002-11-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Rinsing lid for wet bench |
WO2011145439A1 (ja) * | 2010-05-19 | 2011-11-24 | 東京エレクトロン株式会社 | 基板のエッチング方法及びコンピュータ記憶媒体 |
WO2011145440A1 (ja) * | 2010-05-19 | 2011-11-24 | 東京エレクトロン株式会社 | 処理液の供給方法及びコンピュータ記憶媒体 |
Also Published As
Publication number | Publication date |
---|---|
JPH0350410B2 (enrdf_load_stackoverflow) | 1991-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |