JPS5633834A - Manufacturing device of semiconductor - Google Patents

Manufacturing device of semiconductor

Info

Publication number
JPS5633834A
JPS5633834A JP11004679A JP11004679A JPS5633834A JP S5633834 A JPS5633834 A JP S5633834A JP 11004679 A JP11004679 A JP 11004679A JP 11004679 A JP11004679 A JP 11004679A JP S5633834 A JPS5633834 A JP S5633834A
Authority
JP
Japan
Prior art keywords
developing solution
solution
rotary head
temperature
sprayed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11004679A
Other languages
Japanese (ja)
Other versions
JPS6329406B2 (en
Inventor
Masatoshi Matsushita
Terumi Rokushiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11004679A priority Critical patent/JPS5633834A/en
Publication of JPS5633834A publication Critical patent/JPS5633834A/en
Publication of JPS6329406B2 publication Critical patent/JPS6329406B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)

Abstract

PURPOSE:To always maintain the temperature of a developing solution at an optimum temperature and to reduce a using amount of the developing solution by intermittently controlling the developing solution wherein the developing solution is showery sprayed to the semiconductor wafer having a resist surface installed on a rotary head rotating at a low speed. CONSTITUTION:The semiconductor wafer 13 having the resist surface treated by exposure is installed on the rotary head 12 and the rotary head 12 is rotated at a low-speed rotation with small centrifugal force. (For example, 50-100rpm). And the developing solution is showerly sprayed to the wafer 13 from a storage section 15 for treatment solution through a valve 16 and a nozzle 19. In this case, the quantity of flow is intermittently controlled. In this way, a decrease in solution temperature by evaporation of the developing solution is prevented compared to a conventional method of sprinkling a sprayed developing solution to the wafer on the rotary head rotating at a high speed and the solution temperature on the resist surface is always maintained at an optimum state. The spray of the developing solution is also prevented to reduce the using amount to about half.
JP11004679A 1979-08-29 1979-08-29 Manufacturing device of semiconductor Granted JPS5633834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11004679A JPS5633834A (en) 1979-08-29 1979-08-29 Manufacturing device of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11004679A JPS5633834A (en) 1979-08-29 1979-08-29 Manufacturing device of semiconductor

Publications (2)

Publication Number Publication Date
JPS5633834A true JPS5633834A (en) 1981-04-04
JPS6329406B2 JPS6329406B2 (en) 1988-06-14

Family

ID=14525727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11004679A Granted JPS5633834A (en) 1979-08-29 1979-08-29 Manufacturing device of semiconductor

Country Status (1)

Country Link
JP (1) JPS5633834A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276323A (en) * 1985-05-31 1986-12-06 Toshiba Corp Forming method for resist pattern
JPS6281715A (en) * 1985-10-07 1987-04-15 Nec Kyushu Ltd Semiconductor manufacturing equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102123A (en) * 1978-01-27 1979-08-11 Matsushita Electric Ind Co Ltd Developing method
JPS54103034A (en) * 1978-01-30 1979-08-14 Matsushita Electric Ind Co Ltd Automatic developer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102123A (en) * 1978-01-27 1979-08-11 Matsushita Electric Ind Co Ltd Developing method
JPS54103034A (en) * 1978-01-30 1979-08-14 Matsushita Electric Ind Co Ltd Automatic developer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61276323A (en) * 1985-05-31 1986-12-06 Toshiba Corp Forming method for resist pattern
JPS6281715A (en) * 1985-10-07 1987-04-15 Nec Kyushu Ltd Semiconductor manufacturing equipment
JPH0350410B2 (en) * 1985-10-07 1991-08-01 Kyushu Nippon Electric

Also Published As

Publication number Publication date
JPS6329406B2 (en) 1988-06-14

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