JPS625654U - - Google Patents

Info

Publication number
JPS625654U
JPS625654U JP1985096856U JP9685685U JPS625654U JP S625654 U JPS625654 U JP S625654U JP 1985096856 U JP1985096856 U JP 1985096856U JP 9685685 U JP9685685 U JP 9685685U JP S625654 U JPS625654 U JP S625654U
Authority
JP
Japan
Prior art keywords
resin
sealed
connectors
semiconductor device
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985096856U
Other languages
English (en)
Other versions
JPH046213Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985096856U priority Critical patent/JPH046213Y2/ja
Publication of JPS625654U publication Critical patent/JPS625654U/ja
Application granted granted Critical
Publication of JPH046213Y2 publication Critical patent/JPH046213Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図、第２図は従来構造図、第３図は本考案
の一実施例構造図、第４図、第５図は本考案に適
用する接続子の構造図である。図において１は半
導体基体、Ｓは半田、２は接続子、２′，２″は
凸部、３はリード線、３′はヘツダ部、４は封止
樹脂である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個の半導体チツプを夫々接続子を介して積
    層状に半田接続して樹脂封止するようにした樹脂
    封止型半導体装置において前記接続子の少くとも
    一面に先端が平面で且つ前記半導体チツプの径よ
    り小さい凸部もしくは台形部を備えたことを特徴
    とする樹脂封止型半導体装置。
JP1985096856U 1985-06-26 1985-06-26 Expired JPH046213Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985096856U JPH046213Y2 (ja) 1985-06-26 1985-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985096856U JPH046213Y2 (ja) 1985-06-26 1985-06-26

Publications (2)

Publication Number Publication Date
JPS625654U true JPS625654U (ja) 1987-01-14
JPH046213Y2 JPH046213Y2 (ja) 1992-02-20

Family

ID=30963104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985096856U Expired JPH046213Y2 (ja) 1985-06-26 1985-06-26

Country Status (1)

Country Link
JP (1) JPH046213Y2 (ja)

Also Published As

Publication number Publication date
JPH046213Y2 (ja) 1992-02-20

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