JPS5815360U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS5815360U
JPS5815360U JP10974881U JP10974881U JPS5815360U JP S5815360 U JPS5815360 U JP S5815360U JP 10974881 U JP10974881 U JP 10974881U JP 10974881 U JP10974881 U JP 10974881U JP S5815360 U JPS5815360 U JP S5815360U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
heat sink
leads
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10974881U
Other languages
English (en)
Other versions
JPS6218054Y2 (ja
Inventor
松島　巖
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP10974881U priority Critical patent/JPS5815360U/ja
Publication of JPS5815360U publication Critical patent/JPS5815360U/ja
Application granted granted Critical
Publication of JPS6218054Y2 publication Critical patent/JPS6218054Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の樹脂封止型半導体装置の一例の一部の樹
脂を切開した平面図、第２図は第１図の■−■線に沿う
断面図、第３図はこの考案の一実施例の樹脂封止型半導
体装置の一部の樹脂を切開した平面図、第４図は第３図
のＩＶ−ＩＶ線に沿う断面図である。 １０・・・・・・特定のリード、１１．１２・・・・・
・他のリード、１３・・・・・・放熱板、１４・・・・
・・半導体ペレット、１６．１７・・・・・・接続細線
、１８・・・・・・絶縁部材、１９・・・・・・樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 複数のリードと、特定のリードの先端に設けられかつ他
    のリードと段差を有する大面積の放熱板と、前記放熱板
    の上に固着された半導体ペレットと、前記半導体ペレッ
    トの上面電極と前記他のリードとの間を接続する接続細
    線と、前記半導体ペレットを含む主要部分を封止した樹
    脂とを有する樹脂封止型半導体装置において、 前記他のリードの先端を、その周縁が他のリードの先端
    部分および前記放熱板の端縁部分からはみ出す絶縁部材
    を介在して、前記放熱板上に重なり合うように配置した
    ことを特徴とする樹脂封止型半導体装置。
JP10974881U 1981-07-22 1981-07-22 樹脂封止型半導体装置 Granted JPS5815360U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10974881U JPS5815360U (ja) 1981-07-22 1981-07-22 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10974881U JPS5815360U (ja) 1981-07-22 1981-07-22 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5815360U true JPS5815360U (ja) 1983-01-31
JPS6218054Y2 JPS6218054Y2 (ja) 1987-05-09

Family

ID=29904116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10974881U Granted JPS5815360U (ja) 1981-07-22 1981-07-22 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5815360U (ja)

Also Published As

Publication number Publication date
JPS6218054Y2 (ja) 1987-05-09

Similar Documents

Publication Publication Date Title
JPS5827934U (ja) 半導体装置
JPS5815360U (ja) 樹脂封止型半導体装置
JPS6155770B2 (ja)
JPS60130649U (ja) 樹脂封止型半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS5933254U (ja) 半導体装置
JPS58148931U (ja) 半導体装置
JPS6112243U (ja) 樹脂封止型半導体装置
JPS6037253U (ja) 半導体装置
JPS60151132U (ja) 半導体装置
JPS59191744U (ja) 半導体装置
JPS5895062U (ja) 半導体装置
JPS5840843U (ja) 樹脂封止型半導体装置
JPS6081652U (ja) 樹脂封止型半導体装置
JPS5863758U (ja) 樹脂封止型半導体装置
JPS5856446U (ja) 樹脂封止半導体装置
JPS6142856U (ja) 半導体装置
JPS58155849U (ja) 半導体装置
JPS5895641U (ja) 樹脂封止半導体装置
JPS5991747U (ja) 半導体装置
JPS58155836U (ja) 半導体装置
JPS5954942U (ja) 樹脂封止型半導体装置
JPS5996843U (ja) 半導体装置
JPS5877057U (ja) 樹脂封止形半導体装置