JPS6251501B2 - - Google Patents

Info

Publication number
JPS6251501B2
JPS6251501B2 JP56040319A JP4031981A JPS6251501B2 JP S6251501 B2 JPS6251501 B2 JP S6251501B2 JP 56040319 A JP56040319 A JP 56040319A JP 4031981 A JP4031981 A JP 4031981A JP S6251501 B2 JPS6251501 B2 JP S6251501B2
Authority
JP
Japan
Prior art keywords
lead
package
semiconductor device
present
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56040319A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57155758A (en
Inventor
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56040319A priority Critical patent/JPS57155758A/ja
Publication of JPS57155758A publication Critical patent/JPS57155758A/ja
Publication of JPS6251501B2 publication Critical patent/JPS6251501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56040319A 1981-03-23 1981-03-23 Semiconductor device Granted JPS57155758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56040319A JPS57155758A (en) 1981-03-23 1981-03-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56040319A JPS57155758A (en) 1981-03-23 1981-03-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57155758A JPS57155758A (en) 1982-09-25
JPS6251501B2 true JPS6251501B2 (enExample) 1987-10-30

Family

ID=12577286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56040319A Granted JPS57155758A (en) 1981-03-23 1981-03-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57155758A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
JPS58184746A (ja) * 1982-04-22 1983-10-28 Toshiba Corp 外囲器
JPS5980955A (ja) * 1982-10-29 1984-05-10 Matsushita Electronics Corp 電子部品装置
JPS59104544U (ja) * 1982-12-29 1984-07-13 松下電器産業株式会社 集積回路装置
JPS59189662A (ja) * 1983-04-13 1984-10-27 Fujitsu Ltd 樹脂封止型半導体装置
JPS6088561U (ja) * 1983-11-22 1985-06-18 日本電気株式会社 半導体装置
JPS6116556A (ja) * 1984-07-03 1986-01-24 Matsushita Electronics Corp 樹脂封止型半導体装置
JPS6132490A (ja) * 1984-07-24 1986-02-15 富士通株式会社 フラツトリ−ドパツケ−ジ型電子部品の取付け構造
JPS6398640U (enExample) * 1986-12-16 1988-06-25

Also Published As

Publication number Publication date
JPS57155758A (en) 1982-09-25

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