JPS6217382B2 - - Google Patents

Info

Publication number
JPS6217382B2
JPS6217382B2 JP54013358A JP1335879A JPS6217382B2 JP S6217382 B2 JPS6217382 B2 JP S6217382B2 JP 54013358 A JP54013358 A JP 54013358A JP 1335879 A JP1335879 A JP 1335879A JP S6217382 B2 JPS6217382 B2 JP S6217382B2
Authority
JP
Japan
Prior art keywords
tab
lead
leads
heat
tips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54013358A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55107251A (en
Inventor
Susumu Okikawa
Fumihito Inoe
Takehiko Yanagida
Kazuo Shimizu
Keizo Ootsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1335879A priority Critical patent/JPS55107251A/ja
Publication of JPS55107251A publication Critical patent/JPS55107251A/ja
Publication of JPS6217382B2 publication Critical patent/JPS6217382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1335879A 1979-02-09 1979-02-09 Electronic part and its packaging construction Granted JPS55107251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1335879A JPS55107251A (en) 1979-02-09 1979-02-09 Electronic part and its packaging construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1335879A JPS55107251A (en) 1979-02-09 1979-02-09 Electronic part and its packaging construction

Publications (2)

Publication Number Publication Date
JPS55107251A JPS55107251A (en) 1980-08-16
JPS6217382B2 true JPS6217382B2 (enExample) 1987-04-17

Family

ID=11830868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1335879A Granted JPS55107251A (en) 1979-02-09 1979-02-09 Electronic part and its packaging construction

Country Status (1)

Country Link
JP (1) JPS55107251A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714021B2 (ja) * 1983-12-27 1995-02-15 株式会社東芝 樹脂封止型半導体装置
JPH0773122B2 (ja) * 1983-12-27 1995-08-02 株式会社東芝 封止型半導体装置
US4862246A (en) * 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
JPH02260450A (ja) * 1989-03-30 1990-10-23 Mitsubishi Electric Corp 半導体装置およびその実装方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4421066Y1 (enExample) * 1966-07-20 1969-09-08
DE2328798A1 (de) * 1972-06-23 1974-01-17 Philips Nv Halbleiteranordnung
JPS5812736B2 (ja) * 1974-10-17 1983-03-10 日本電気株式会社 ジユシフウシガタハンドウタイソウチ

Also Published As

Publication number Publication date
JPS55107251A (en) 1980-08-16

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