JPS6232623B2 - - Google Patents
Info
- Publication number
- JPS6232623B2 JPS6232623B2 JP262780A JP262780A JPS6232623B2 JP S6232623 B2 JPS6232623 B2 JP S6232623B2 JP 262780 A JP262780 A JP 262780A JP 262780 A JP262780 A JP 262780A JP S6232623 B2 JPS6232623 B2 JP S6232623B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tab
- cutting
- frame
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 238000004080 punching Methods 0.000 description 8
- 239000008188 pellet Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 231100000681 Certain safety factor Toxicity 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262780A JPS56100456A (en) | 1980-01-16 | 1980-01-16 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262780A JPS56100456A (en) | 1980-01-16 | 1980-01-16 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56100456A JPS56100456A (en) | 1981-08-12 |
| JPS6232623B2 true JPS6232623B2 (enrdf_load_stackoverflow) | 1987-07-15 |
Family
ID=11534625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP262780A Granted JPS56100456A (en) | 1980-01-16 | 1980-01-16 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56100456A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62254456A (ja) * | 1986-04-26 | 1987-11-06 | Yamada Seisakusho:Kk | リ−ドフレ−ム |
| JP6357415B2 (ja) * | 2014-12-26 | 2018-07-11 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
1980
- 1980-01-16 JP JP262780A patent/JPS56100456A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56100456A (en) | 1981-08-12 |
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