JPH0456460B2 - - Google Patents
Info
- Publication number
- JPH0456460B2 JPH0456460B2 JP18447383A JP18447383A JPH0456460B2 JP H0456460 B2 JPH0456460 B2 JP H0456460B2 JP 18447383 A JP18447383 A JP 18447383A JP 18447383 A JP18447383 A JP 18447383A JP H0456460 B2 JPH0456460 B2 JP H0456460B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead frame
- punching
- punch
- stripper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18447383A JPS6077449A (ja) | 1983-10-04 | 1983-10-04 | 半導体リ−ドフレ−ム用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18447383A JPS6077449A (ja) | 1983-10-04 | 1983-10-04 | 半導体リ−ドフレ−ム用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6077449A JPS6077449A (ja) | 1985-05-02 |
| JPH0456460B2 true JPH0456460B2 (enrdf_load_stackoverflow) | 1992-09-08 |
Family
ID=16153776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18447383A Granted JPS6077449A (ja) | 1983-10-04 | 1983-10-04 | 半導体リ−ドフレ−ム用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6077449A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2800243B2 (ja) * | 1989-04-03 | 1998-09-21 | 松下電器産業株式会社 | プレス加工装置 |
| JP2003258183A (ja) * | 2002-03-04 | 2003-09-12 | Shinko Electric Ind Co Ltd | リードフレームの製造方法 |
-
1983
- 1983-10-04 JP JP18447383A patent/JPS6077449A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6077449A (ja) | 1985-05-02 |