JPS6077449A - 半導体リ−ドフレ−ム用金型 - Google Patents
半導体リ−ドフレ−ム用金型Info
- Publication number
- JPS6077449A JPS6077449A JP18447383A JP18447383A JPS6077449A JP S6077449 A JPS6077449 A JP S6077449A JP 18447383 A JP18447383 A JP 18447383A JP 18447383 A JP18447383 A JP 18447383A JP S6077449 A JPS6077449 A JP S6077449A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lead frame
- punching
- mold
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 238000004080 punching Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18447383A JPS6077449A (ja) | 1983-10-04 | 1983-10-04 | 半導体リ−ドフレ−ム用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18447383A JPS6077449A (ja) | 1983-10-04 | 1983-10-04 | 半導体リ−ドフレ−ム用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6077449A true JPS6077449A (ja) | 1985-05-02 |
| JPH0456460B2 JPH0456460B2 (enrdf_load_stackoverflow) | 1992-09-08 |
Family
ID=16153776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18447383A Granted JPS6077449A (ja) | 1983-10-04 | 1983-10-04 | 半導体リ−ドフレ−ム用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6077449A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02263524A (ja) * | 1989-04-03 | 1990-10-26 | Matsushita Electric Ind Co Ltd | プレス加工装置 |
| EP1343205A3 (en) * | 2002-03-04 | 2004-09-08 | Shinko Electric Industries Co. Ltd. | Lead frame manufacturing method |
-
1983
- 1983-10-04 JP JP18447383A patent/JPS6077449A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02263524A (ja) * | 1989-04-03 | 1990-10-26 | Matsushita Electric Ind Co Ltd | プレス加工装置 |
| EP1343205A3 (en) * | 2002-03-04 | 2004-09-08 | Shinko Electric Industries Co. Ltd. | Lead frame manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0456460B2 (enrdf_load_stackoverflow) | 1992-09-08 |
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