JPS6230719B2 - - Google Patents
Info
- Publication number
- JPS6230719B2 JPS6230719B2 JP57085855A JP8585582A JPS6230719B2 JP S6230719 B2 JPS6230719 B2 JP S6230719B2 JP 57085855 A JP57085855 A JP 57085855A JP 8585582 A JP8585582 A JP 8585582A JP S6230719 B2 JPS6230719 B2 JP S6230719B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible printed
- electronic circuit
- printed wiring
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 description 13
- 230000010354 integration Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585582A JPS58201393A (ja) | 1982-05-20 | 1982-05-20 | 電子回路部品構体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8585582A JPS58201393A (ja) | 1982-05-20 | 1982-05-20 | 電子回路部品構体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58201393A JPS58201393A (ja) | 1983-11-24 |
| JPS6230719B2 true JPS6230719B2 (zh) | 1987-07-03 |
Family
ID=13870487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8585582A Granted JPS58201393A (ja) | 1982-05-20 | 1982-05-20 | 電子回路部品構体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58201393A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207069U (zh) * | 1985-06-14 | 1986-12-27 | ||
| JPS62226691A (ja) * | 1986-03-28 | 1987-10-05 | スナオ電気株式会社 | 電気機械器具における基板ユニツトの製造方法及びその方法の実施に直接使用するプリント配線基板 |
| JPS6375074U (zh) * | 1986-11-04 | 1988-05-19 | ||
| JP2821315B2 (ja) * | 1992-06-02 | 1998-11-05 | 日本電気株式会社 | シングルインラインモジュール |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4822747B1 (zh) * | 1970-12-10 | 1973-07-09 | ||
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS5426671B2 (zh) * | 1976-02-26 | 1979-09-05 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124520Y2 (zh) * | 1971-07-23 | 1976-06-23 | ||
| JPS5426671U (zh) * | 1977-07-26 | 1979-02-21 |
-
1982
- 1982-05-20 JP JP8585582A patent/JPS58201393A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4822747B1 (zh) * | 1970-12-10 | 1973-07-09 | ||
| JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
| JPS5426671B2 (zh) * | 1976-02-26 | 1979-09-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58201393A (ja) | 1983-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0065425B1 (en) | Hybrid integrated circuit component and printed circuit board mounting said component | |
| JP3330387B2 (ja) | 可撓性多層回路配線基板 | |
| US4931908A (en) | Housing for an electronic circuit | |
| JPS6266506A (ja) | 多層セラミツクコンデンサ−を含む高静電容量ブスバ− | |
| JP3226959B2 (ja) | 多層フレキシブルプリント基板の製法 | |
| JPH071821B2 (ja) | 配線基板 | |
| JPS6230719B2 (zh) | ||
| US4568999A (en) | Multilayer ceramic capacitor on printed circuit | |
| JPH09139324A (ja) | チップ型電子部品 | |
| JPH02164096A (ja) | 多層電子回路基板とその製造方法 | |
| JPH0464199B2 (zh) | ||
| JPH0754783B2 (ja) | 積層フィルムコンデンサ | |
| JPH0347341Y2 (zh) | ||
| JP2650639B2 (ja) | 配線基板 | |
| JPH03136396A (ja) | 電子回路部品とその製造方法及び電子回路装置 | |
| JPH06314885A (ja) | プリント多層配線基板モジュール | |
| JP2715957B2 (ja) | 混成集積回路装置 | |
| JPS6230718B2 (zh) | ||
| JPH0231794Y2 (zh) | ||
| JPS6293993A (ja) | 電子回路装置とその実装方法 | |
| JPS58143598A (ja) | 電子回路部品 | |
| JPS6347248B2 (zh) | ||
| JPS5841641B2 (ja) | 抵抗体 | |
| JPH056715Y2 (zh) | ||
| JPS6230720B2 (zh) |