JPS62154649A - 半導体デバイス等のパツケ−ジング装置 - Google Patents
半導体デバイス等のパツケ−ジング装置Info
- Publication number
- JPS62154649A JPS62154649A JP29773085A JP29773085A JPS62154649A JP S62154649 A JPS62154649 A JP S62154649A JP 29773085 A JP29773085 A JP 29773085A JP 29773085 A JP29773085 A JP 29773085A JP S62154649 A JPS62154649 A JP S62154649A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heads
- semiconductor devices
- packaging apparatus
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 6
- 238000005304 joining Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29773085A JPS62154649A (ja) | 1985-12-26 | 1985-12-26 | 半導体デバイス等のパツケ−ジング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29773085A JPS62154649A (ja) | 1985-12-26 | 1985-12-26 | 半導体デバイス等のパツケ−ジング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154649A true JPS62154649A (ja) | 1987-07-09 |
| JPH0361341B2 JPH0361341B2 (enrdf_load_stackoverflow) | 1991-09-19 |
Family
ID=17850429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29773085A Granted JPS62154649A (ja) | 1985-12-26 | 1985-12-26 | 半導体デバイス等のパツケ−ジング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154649A (enrdf_load_stackoverflow) |
-
1985
- 1985-12-26 JP JP29773085A patent/JPS62154649A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0361341B2 (enrdf_load_stackoverflow) | 1991-09-19 |
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