JPH0354862B2 - - Google Patents
Info
- Publication number
- JPH0354862B2 JPH0354862B2 JP27203785A JP27203785A JPH0354862B2 JP H0354862 B2 JPH0354862 B2 JP H0354862B2 JP 27203785 A JP27203785 A JP 27203785A JP 27203785 A JP27203785 A JP 27203785A JP H0354862 B2 JPH0354862 B2 JP H0354862B2
- Authority
- JP
- Japan
- Prior art keywords
- section
- lead frame
- plate
- mold
- tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 22
- 238000000465 moulding Methods 0.000 claims description 19
- 238000003860 storage Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000032258 transport Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27203785A JPS62131544A (ja) | 1985-12-03 | 1985-12-03 | 半導体デバイス等のモ−ルド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27203785A JPS62131544A (ja) | 1985-12-03 | 1985-12-03 | 半導体デバイス等のモ−ルド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131544A JPS62131544A (ja) | 1987-06-13 |
| JPH0354862B2 true JPH0354862B2 (enrdf_load_stackoverflow) | 1991-08-21 |
Family
ID=17508242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27203785A Granted JPS62131544A (ja) | 1985-12-03 | 1985-12-03 | 半導体デバイス等のモ−ルド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131544A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06225881A (ja) * | 1993-02-01 | 1994-08-16 | Aloka Co Ltd | 超音波診断装置 |
-
1985
- 1985-12-03 JP JP27203785A patent/JPS62131544A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62131544A (ja) | 1987-06-13 |
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