JPH0361341B2 - - Google Patents
Info
- Publication number
- JPH0361341B2 JPH0361341B2 JP29773085A JP29773085A JPH0361341B2 JP H0361341 B2 JPH0361341 B2 JP H0361341B2 JP 29773085 A JP29773085 A JP 29773085A JP 29773085 A JP29773085 A JP 29773085A JP H0361341 B2 JPH0361341 B2 JP H0361341B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heads
- semiconductor devices
- mold
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000004806 packaging method and process Methods 0.000 claims description 18
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 238000005304 joining Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29773085A JPS62154649A (ja) | 1985-12-26 | 1985-12-26 | 半導体デバイス等のパツケ−ジング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29773085A JPS62154649A (ja) | 1985-12-26 | 1985-12-26 | 半導体デバイス等のパツケ−ジング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62154649A JPS62154649A (ja) | 1987-07-09 |
| JPH0361341B2 true JPH0361341B2 (enrdf_load_stackoverflow) | 1991-09-19 |
Family
ID=17850429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29773085A Granted JPS62154649A (ja) | 1985-12-26 | 1985-12-26 | 半導体デバイス等のパツケ−ジング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154649A (enrdf_load_stackoverflow) |
-
1985
- 1985-12-26 JP JP29773085A patent/JPS62154649A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62154649A (ja) | 1987-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201022003A (en) | Resin sealing compression molding method for electronic component and device therefor | |
| US4741787A (en) | Method and apparatus for packaging semiconductor device and the like | |
| KR0137851B1 (ko) | 트랜스퍼 성형 방법 및 트랜스퍼 성형 기계 | |
| EP1768168A2 (en) | Method of resin seal moulding electronic component and apparatus therefor | |
| JP2014231185A (ja) | 樹脂モールド装置および樹脂モールド方法 | |
| JP2006027138A (ja) | インサート成形方法及び成形装置 | |
| TWI766729B (zh) | 工件搬出裝置、樹脂塑封裝置 | |
| JP2018144335A (ja) | モールド金型、モールドプレス、およびモールド装置 | |
| JPH0361341B2 (enrdf_load_stackoverflow) | ||
| JP6693798B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
| CN206476156U (zh) | 上下覆膜机构及具有该机构的多工位同步快速压封装置 | |
| JPH08244064A (ja) | リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法 | |
| JP7564792B2 (ja) | 樹脂成形品の製造方法、フィルム固定部材、液状樹脂拡大機構、及び樹脂成形装置 | |
| JP3911402B2 (ja) | 半導体封止装置 | |
| JP4855026B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| JPH0354862B2 (enrdf_load_stackoverflow) | ||
| JP4150658B2 (ja) | 樹脂封止装置 | |
| TW202120288A (zh) | 樹脂塑封模具 | |
| JP6901604B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
| JP4253490B2 (ja) | 半導体装置封止装置 | |
| CN218317662U (zh) | 一种热封机构和试剂条灌装设备 | |
| CN116080048B (zh) | 一种自动吸塑包装机及其使用方法 | |
| JP4154746B2 (ja) | 複層ガラスの製造方法および装置 | |
| JP3699801B2 (ja) | 半導体製造部品供給機構 | |
| JP5621147B2 (ja) | 樹脂モールド装置 |