JPS62122139A - 半導体記憶装置 - Google Patents

半導体記憶装置

Info

Publication number
JPS62122139A
JPS62122139A JP60262814A JP26281485A JPS62122139A JP S62122139 A JPS62122139 A JP S62122139A JP 60262814 A JP60262814 A JP 60262814A JP 26281485 A JP26281485 A JP 26281485A JP S62122139 A JPS62122139 A JP S62122139A
Authority
JP
Japan
Prior art keywords
cell array
side direction
divided cell
array region
bonding pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60262814A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564852B2 (enExample
Inventor
Hitonori Hayano
早野　仁紀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60262814A priority Critical patent/JPS62122139A/ja
Publication of JPS62122139A publication Critical patent/JPS62122139A/ja
Publication of JPH0564852B2 publication Critical patent/JPH0564852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP60262814A 1985-11-21 1985-11-21 半導体記憶装置 Granted JPS62122139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60262814A JPS62122139A (ja) 1985-11-21 1985-11-21 半導体記憶装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60262814A JPS62122139A (ja) 1985-11-21 1985-11-21 半導体記憶装置

Publications (2)

Publication Number Publication Date
JPS62122139A true JPS62122139A (ja) 1987-06-03
JPH0564852B2 JPH0564852B2 (enExample) 1993-09-16

Family

ID=17380982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60262814A Granted JPS62122139A (ja) 1985-11-21 1985-11-21 半導体記憶装置

Country Status (1)

Country Link
JP (1) JPS62122139A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435945A (en) * 1987-07-30 1989-02-07 Nec Corp Semiconductor integrated circuit
JPH0298950A (ja) * 1988-10-06 1990-04-11 Mitsubishi Electric Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609152A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609152A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435945A (en) * 1987-07-30 1989-02-07 Nec Corp Semiconductor integrated circuit
JPH0298950A (ja) * 1988-10-06 1990-04-11 Mitsubishi Electric Corp 半導体装置
US4974053A (en) * 1988-10-06 1990-11-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for multiple packaging configurations

Also Published As

Publication number Publication date
JPH0564852B2 (enExample) 1993-09-16

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