JPH023621Y2 - - Google Patents

Info

Publication number
JPH023621Y2
JPH023621Y2 JP1984000403U JP40384U JPH023621Y2 JP H023621 Y2 JPH023621 Y2 JP H023621Y2 JP 1984000403 U JP1984000403 U JP 1984000403U JP 40384 U JP40384 U JP 40384U JP H023621 Y2 JPH023621 Y2 JP H023621Y2
Authority
JP
Japan
Prior art keywords
bonding pads
chip
container
bonding
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984000403U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60113636U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984000403U priority Critical patent/JPS60113636U/ja
Publication of JPS60113636U publication Critical patent/JPS60113636U/ja
Application granted granted Critical
Publication of JPH023621Y2 publication Critical patent/JPH023621Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/5453—
    • H10W72/5473—
    • H10W72/932—

Landscapes

  • Wire Bonding (AREA)
JP1984000403U 1984-01-06 1984-01-06 半導体集積回路装置 Granted JPS60113636U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984000403U JPS60113636U (ja) 1984-01-06 1984-01-06 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984000403U JPS60113636U (ja) 1984-01-06 1984-01-06 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60113636U JPS60113636U (ja) 1985-08-01
JPH023621Y2 true JPH023621Y2 (enExample) 1990-01-29

Family

ID=30472210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984000403U Granted JPS60113636U (ja) 1984-01-06 1984-01-06 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60113636U (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636578Y2 (ja) * 1987-04-10 1994-09-21 日本電気株式会社 半導体集積回路
JP2679669B2 (ja) * 1995-02-28 1997-11-19 日本電気株式会社 半導体装置
JP4566860B2 (ja) * 2005-08-19 2010-10-20 ルネサスエレクトロニクス株式会社 半導体集積回路装置の設計装置および配線方法ならびにプログラム
JP2015173205A (ja) * 2014-03-12 2015-10-01 株式会社東芝 半導体装置及びワイヤボンディング装置

Also Published As

Publication number Publication date
JPS60113636U (ja) 1985-08-01

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