JPS60113636U - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS60113636U
JPS60113636U JP1984000403U JP40384U JPS60113636U JP S60113636 U JPS60113636 U JP S60113636U JP 1984000403 U JP1984000403 U JP 1984000403U JP 40384 U JP40384 U JP 40384U JP S60113636 U JPS60113636 U JP S60113636U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
bonding
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984000403U
Other languages
English (en)
Japanese (ja)
Other versions
JPH023621Y2 (enExample
Inventor
原島　信之
Original Assignee
日本電気アイシーマイコンシステム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気アイシーマイコンシステム株式会社 filed Critical 日本電気アイシーマイコンシステム株式会社
Priority to JP1984000403U priority Critical patent/JPS60113636U/ja
Publication of JPS60113636U publication Critical patent/JPS60113636U/ja
Application granted granted Critical
Publication of JPH023621Y2 publication Critical patent/JPH023621Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/5453—
    • H10W72/5473—
    • H10W72/932—

Landscapes

  • Wire Bonding (AREA)
JP1984000403U 1984-01-06 1984-01-06 半導体集積回路装置 Granted JPS60113636U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984000403U JPS60113636U (ja) 1984-01-06 1984-01-06 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984000403U JPS60113636U (ja) 1984-01-06 1984-01-06 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS60113636U true JPS60113636U (ja) 1985-08-01
JPH023621Y2 JPH023621Y2 (enExample) 1990-01-29

Family

ID=30472210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984000403U Granted JPS60113636U (ja) 1984-01-06 1984-01-06 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS60113636U (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63162534U (enExample) * 1987-04-10 1988-10-24
JPH08236585A (ja) * 1995-02-28 1996-09-13 Nec Corp 半導体装置
JP2007052725A (ja) * 2005-08-19 2007-03-01 Nec Electronics Corp 半導体集積回路装置の設計装置および配線方法ならびにプログラム
JP2015173205A (ja) * 2014-03-12 2015-10-01 株式会社東芝 半導体装置及びワイヤボンディング装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63162534U (enExample) * 1987-04-10 1988-10-24
JPH08236585A (ja) * 1995-02-28 1996-09-13 Nec Corp 半導体装置
JP2007052725A (ja) * 2005-08-19 2007-03-01 Nec Electronics Corp 半導体集積回路装置の設計装置および配線方法ならびにプログラム
JP2015173205A (ja) * 2014-03-12 2015-10-01 株式会社東芝 半導体装置及びワイヤボンディング装置

Also Published As

Publication number Publication date
JPH023621Y2 (enExample) 1990-01-29

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