JPS6148543A - 半導体素子結線用銅合金線 - Google Patents

半導体素子結線用銅合金線

Info

Publication number
JPS6148543A
JPS6148543A JP59168684A JP16868484A JPS6148543A JP S6148543 A JPS6148543 A JP S6148543A JP 59168684 A JP59168684 A JP 59168684A JP 16868484 A JP16868484 A JP 16868484A JP S6148543 A JPS6148543 A JP S6148543A
Authority
JP
Japan
Prior art keywords
copper alloy
alloy wire
wire
copper
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59168684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6238414B2 (cg-RX-API-DMAC10.html
Inventor
Kazuo Sawada
沢田　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP59168684A priority Critical patent/JPS6148543A/ja
Publication of JPS6148543A publication Critical patent/JPS6148543A/ja
Publication of JPS6238414B2 publication Critical patent/JPS6238414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07551—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP59168684A 1984-08-10 1984-08-10 半導体素子結線用銅合金線 Granted JPS6148543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59168684A JPS6148543A (ja) 1984-08-10 1984-08-10 半導体素子結線用銅合金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59168684A JPS6148543A (ja) 1984-08-10 1984-08-10 半導体素子結線用銅合金線

Publications (2)

Publication Number Publication Date
JPS6148543A true JPS6148543A (ja) 1986-03-10
JPS6238414B2 JPS6238414B2 (cg-RX-API-DMAC10.html) 1987-08-18

Family

ID=15872552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59168684A Granted JPS6148543A (ja) 1984-08-10 1984-08-10 半導体素子結線用銅合金線

Country Status (1)

Country Link
JP (1) JPS6148543A (cg-RX-API-DMAC10.html)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61113740A (ja) * 1984-11-09 1986-05-31 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61258463A (ja) * 1985-05-13 1986-11-15 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS6293326A (ja) * 1985-10-18 1987-04-28 Sumitomo Electric Ind Ltd ボンデイングワイヤ
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
KR100926932B1 (ko) 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 산화가 방지되는 구리 와이어를 갖는 반도체 패키지 및 그제조 방법
CN103151091A (zh) * 2011-12-01 2013-06-12 贺利氏材料科技公司 用于微电子装置中接合的掺杂4n铜线
WO2016135993A1 (ja) 2015-02-26 2016-09-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6002337B1 (ja) * 2015-08-12 2016-10-05 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR101670209B1 (ko) 2015-06-15 2016-10-27 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어
WO2016189758A1 (ja) 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR20160144390A (ko) 2014-04-21 2016-12-16 신닛테츠스미킹 마테리알즈 가부시키가이샤 반도체 장치용 본딩 와이어
WO2016203659A1 (ja) 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR20160150634A (ko) 2015-05-26 2016-12-30 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어
CN108369914A (zh) * 2015-12-15 2018-08-03 新日铁住金高新材料株式会社 半导体装置用接合线
KR20190019948A (ko) 2016-06-20 2019-02-27 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 구리 합금 본딩 와이어
KR20190120420A (ko) 2017-12-28 2019-10-23 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
US10468370B2 (en) 2015-07-23 2019-11-05 Nippon Micrometal Corporation Bonding wire for semiconductor device
EP3667709A4 (en) * 2017-08-09 2021-06-09 NIPPON STEEL Chemical & Material Co., Ltd. CU ALLOY BOND WIRE FOR SEMICONDUCTOR COMPONENTS
WO2021111908A1 (ja) 2019-12-02 2021-06-10 日鉄マイクロメタル株式会社 半導体装置用銅ボンディングワイヤ及び半導体装置
WO2021167083A1 (ja) 2020-02-21 2021-08-26 日鉄マイクロメタル株式会社 銅ボンディングワイヤ
WO2022270077A1 (ja) 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2022270051A1 (ja) 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR20230001012A (ko) 2021-06-25 2023-01-03 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20230001011A (ko) 2021-06-25 2023-01-03 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20240026928A (ko) 2021-06-25 2024-02-29 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20240027868A (ko) 2022-06-24 2024-03-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 반도체 장치용 본딩 와이어
WO2024247286A1 (ja) 2023-05-30 2024-12-05 日鉄マイクロメタル株式会社 ボンディングワイヤ
KR20240172735A (ko) 2023-05-30 2024-12-10 닛데쓰마이크로메탈가부시키가이샤 본딩 와이어
KR20250027657A (ko) 2022-06-24 2025-02-27 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 반도체 장치용 본딩 와이어

Cited By (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61113740A (ja) * 1984-11-09 1986-05-31 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61258463A (ja) * 1985-05-13 1986-11-15 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS6293326A (ja) * 1985-10-18 1987-04-28 Sumitomo Electric Ind Ltd ボンデイングワイヤ
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
KR100926932B1 (ko) 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 산화가 방지되는 구리 와이어를 갖는 반도체 패키지 및 그제조 방법
CN103151091A (zh) * 2011-12-01 2013-06-12 贺利氏材料科技公司 用于微电子装置中接合的掺杂4n铜线
KR20160144390A (ko) 2014-04-21 2016-12-16 신닛테츠스미킹 마테리알즈 가부시키가이샤 반도체 장치용 본딩 와이어
JP2017163169A (ja) * 2014-04-21 2017-09-14 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
US10950570B2 (en) 2014-04-21 2021-03-16 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor device
US10032741B2 (en) 2015-02-26 2018-07-24 Nippon Micrometal Corporation Bonding wire for semiconductor device
JP2016164991A (ja) * 2015-02-26 2016-09-08 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2016135993A1 (ja) 2015-02-26 2016-09-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
EP3086362A4 (en) * 2015-02-26 2017-05-31 Nippon Micrometal Corporation Bonding wire for semiconductor devices
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KR20170113528A (ko) 2015-02-26 2017-10-12 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어
DE112015006616B3 (de) * 2015-05-26 2020-03-26 Nippon Micrometal Corporation Bonddraht für Halbleitervorrichtung
US10497663B2 (en) 2015-05-26 2019-12-03 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
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US11721660B2 (en) 2021-06-25 2023-08-08 Nippon Micrometal Corporation Bonding wire for semiconductor devices
KR20240015611A (ko) 2021-06-25 2024-02-05 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20240015610A (ko) 2021-06-25 2024-02-05 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20240026928A (ko) 2021-06-25 2024-02-29 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20240026924A (ko) 2021-06-25 2024-02-29 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20230001012A (ko) 2021-06-25 2023-01-03 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
KR20240026929A (ko) 2021-06-25 2024-02-29 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
WO2022270077A1 (ja) 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
US11929343B2 (en) 2021-06-25 2024-03-12 Nippon Micrometal Corporation Bonding wire for semiconductor devices
KR20230001011A (ko) 2021-06-25 2023-01-03 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
WO2022270051A1 (ja) 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2022270075A1 (ja) 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
KR20250016058A (ko) 2022-06-24 2025-02-03 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 반도체 장치용 본딩 와이어
KR20250027657A (ko) 2022-06-24 2025-02-27 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 반도체 장치용 본딩 와이어
US12166006B2 (en) 2022-06-24 2024-12-10 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor devices
KR20240027868A (ko) 2022-06-24 2024-03-04 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 반도체 장치용 본딩 와이어
KR20240172735A (ko) 2023-05-30 2024-12-10 닛데쓰마이크로메탈가부시키가이샤 본딩 와이어
US12290883B2 (en) 2023-05-30 2025-05-06 Nippon Micrometal Corporation Bonding wire
WO2024247286A1 (ja) 2023-05-30 2024-12-05 日鉄マイクロメタル株式会社 ボンディングワイヤ
KR20260003646A (ko) 2023-05-30 2026-01-07 닛데쓰마이크로메탈가부시키가이샤 본딩 와이어

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