JPS6141134B2 - - Google Patents

Info

Publication number
JPS6141134B2
JPS6141134B2 JP16638081A JP16638081A JPS6141134B2 JP S6141134 B2 JPS6141134 B2 JP S6141134B2 JP 16638081 A JP16638081 A JP 16638081A JP 16638081 A JP16638081 A JP 16638081A JP S6141134 B2 JPS6141134 B2 JP S6141134B2
Authority
JP
Japan
Prior art keywords
mold
pot
plunger
resin
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16638081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5868940A (ja
Inventor
Kosuke Tange
Yoshitaka Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP16638081A priority Critical patent/JPS5868940A/ja
Publication of JPS5868940A publication Critical patent/JPS5868940A/ja
Publication of JPS6141134B2 publication Critical patent/JPS6141134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP16638081A 1981-10-20 1981-10-20 樹脂封止型半導体のトランスフア成形装置 Granted JPS5868940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16638081A JPS5868940A (ja) 1981-10-20 1981-10-20 樹脂封止型半導体のトランスフア成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16638081A JPS5868940A (ja) 1981-10-20 1981-10-20 樹脂封止型半導体のトランスフア成形装置

Publications (2)

Publication Number Publication Date
JPS5868940A JPS5868940A (ja) 1983-04-25
JPS6141134B2 true JPS6141134B2 (enrdf_load_stackoverflow) 1986-09-12

Family

ID=15830333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16638081A Granted JPS5868940A (ja) 1981-10-20 1981-10-20 樹脂封止型半導体のトランスフア成形装置

Country Status (1)

Country Link
JP (1) JPS5868940A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064818U (ja) * 1983-10-13 1985-05-08 トーワ株式会社 トランスフア−モ−ルド金型装置
JPS6185829A (ja) * 1984-10-03 1986-05-01 Michio Osada 半導体素子のトランスフア樹脂モ−ルド成形方法
JPS61280910A (ja) * 1985-06-07 1986-12-11 Toshiba Corp 樹脂封止金型
JPS62273742A (ja) * 1986-05-22 1987-11-27 Sumitomo Heavy Ind Ltd トランスフア−成形装置
JP2866867B2 (ja) * 1987-08-05 1999-03-08 三菱電機株式会社 半導体装置の樹脂封止装置及び樹脂封止方法
US5082615A (en) * 1987-12-18 1992-01-21 Mitsubishi Denki Kabushiki Kaisha Method for packaging semiconductor devices in a resin
US4874308A (en) * 1988-04-04 1989-10-17 Atlas Gary N Vacuum assisted transfer mold and vent pin
GB2252746B (en) * 1991-01-17 1995-07-12 Towa Corp A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
JP3566426B2 (ja) * 1995-10-30 2004-09-15 Ｔｏｗａ株式会社 電子部品の樹脂成形装置
CN107466160B (zh) * 2016-06-06 2022-04-29 宁波舜宇光电信息有限公司 摄像模组的模塑电路板的制造设备及其制造方法

Also Published As

Publication number Publication date
JPS5868940A (ja) 1983-04-25

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