JPS6096763A - プラズマ強化化学蒸着によるケイ化チタンを含む低抵抗率膜の製造方法 - Google Patents

プラズマ強化化学蒸着によるケイ化チタンを含む低抵抗率膜の製造方法

Info

Publication number
JPS6096763A
JPS6096763A JP59179148A JP17914884A JPS6096763A JP S6096763 A JPS6096763 A JP S6096763A JP 59179148 A JP59179148 A JP 59179148A JP 17914884 A JP17914884 A JP 17914884A JP S6096763 A JPS6096763 A JP S6096763A
Authority
JP
Japan
Prior art keywords
vapor deposition
chemical vapor
deposition
enhanced chemical
titanium silicide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59179148A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643949B2 (OSRAM
Inventor
リチヤード　エス　ロスラー
ジヨージ　エム　イングル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADOBANSUTO SEMIKONDAKUTAA MATEIRIARUZU AMERIKA Inc
ADVANCED SEMICONDUCTOR MAT
Original Assignee
ADOBANSUTO SEMIKONDAKUTAA MATEIRIARUZU AMERIKA Inc
ADVANCED SEMICONDUCTOR MAT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADOBANSUTO SEMIKONDAKUTAA MATEIRIARUZU AMERIKA Inc, ADVANCED SEMICONDUCTOR MAT filed Critical ADOBANSUTO SEMIKONDAKUTAA MATEIRIARUZU AMERIKA Inc
Publication of JPS6096763A publication Critical patent/JPS6096763A/ja
Publication of JPS643949B2 publication Critical patent/JPS643949B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
    • H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
    • H01L21/28061—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a metal or metal silicide formed by deposition, e.g. sputter deposition, i.e. without a silicidation reaction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
    • H10D64/0112—
    • H10D64/01312—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Vapour Deposition (AREA)
JP59179148A 1983-10-31 1984-08-28 プラズマ強化化学蒸着によるケイ化チタンを含む低抵抗率膜の製造方法 Granted JPS6096763A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US547050 1983-10-31
US06/547,050 US4557943A (en) 1983-10-31 1983-10-31 Metal-silicide deposition using plasma-enhanced chemical vapor deposition

Publications (2)

Publication Number Publication Date
JPS6096763A true JPS6096763A (ja) 1985-05-30
JPS643949B2 JPS643949B2 (OSRAM) 1989-01-24

Family

ID=24183136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59179148A Granted JPS6096763A (ja) 1983-10-31 1984-08-28 プラズマ強化化学蒸着によるケイ化チタンを含む低抵抗率膜の製造方法

Country Status (6)

Country Link
US (1) US4557943A (OSRAM)
JP (1) JPS6096763A (OSRAM)
DE (1) DE3439853A1 (OSRAM)
FR (1) FR2554132B1 (OSRAM)
GB (1) GB2148946B (OSRAM)
NL (1) NL8403011A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62267472A (ja) * 1986-05-15 1987-11-20 バリアン・アソシエイツ・インコ−ポレイテッド メタルシリサイドの低圧化学蒸着
US4908548A (en) * 1987-05-09 1990-03-13 Futaba Denshi Kogyo Kabushiki Kaisha Fluorescent display device

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JP2505736B2 (ja) * 1985-06-18 1996-06-12 キヤノン株式会社 半導体装置の製造方法
US4668530A (en) * 1985-07-23 1987-05-26 Massachusetts Institute Of Technology Low pressure chemical vapor deposition of refractory metal silicides
US4796562A (en) * 1985-12-03 1989-01-10 Varian Associates, Inc. Rapid thermal cvd apparatus
US4709655A (en) * 1985-12-03 1987-12-01 Varian Associates, Inc. Chemical vapor deposition apparatus
US4732801A (en) * 1986-04-30 1988-03-22 International Business Machines Corporation Graded oxide/nitride via structure and method of fabrication therefor
US4800105A (en) * 1986-07-22 1989-01-24 Nihon Shinku Gijutsu Kabushiki Kaisha Method of forming a thin film by chemical vapor deposition
NL8700820A (nl) * 1987-04-08 1988-11-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
FR2622052B1 (fr) * 1987-10-19 1990-02-16 Air Liquide Procede de depot de siliciure de metal refractaire pour la fabrication de circuits integres
FR2623014B1 (fr) * 1987-11-09 1990-03-23 France Etat Procede de depot selectif d'un siliciure de metal refractaire sur des zones de silicium
US5057375A (en) * 1988-04-15 1991-10-15 Gordon Roy G Titanium silicide-coated glass windows
US5167986A (en) * 1988-04-15 1992-12-01 Gordon Roy G Titanium silicide-coated glass windows
US4957777A (en) * 1988-07-28 1990-09-18 Massachusetts Institute Of Technology Very low pressure chemical vapor deposition process for deposition of titanium silicide films
US5104694A (en) * 1989-04-21 1992-04-14 Nippon Telephone & Telegraph Corporation Selective chemical vapor deposition of a metallic film on the silicon surface
KR930011413B1 (ko) * 1990-09-25 1993-12-06 가부시키가이샤 한도오따이 에네루기 겐큐쇼 펄스형 전자파를 사용한 플라즈마 cvd 법
JPH06101462B2 (ja) * 1991-04-30 1994-12-12 インターナショナル・ビジネス・マシーンズ・コーポレイション 過フッ化炭化水素ポリマ膜を基板に接着する方法および 基板
KR970009274B1 (ko) * 1991-11-11 1997-06-09 미쓰비시덴키 가부시키가이샤 반도체장치의 도전층접속구조 및 그 제조방법
US5320880A (en) * 1992-10-20 1994-06-14 Micron Technology, Inc. Method of providing a silicon film having a roughened outer surface
US5814599A (en) * 1995-08-04 1998-09-29 Massachusetts Insitiute Of Technology Transdermal delivery of encapsulated drugs
US5426003A (en) * 1994-02-14 1995-06-20 Westinghouse Electric Corporation Method of forming a plasma sprayed interconnection layer on an electrode of an electrochemical cell
US5665640A (en) * 1994-06-03 1997-09-09 Sony Corporation Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor
US5628829A (en) * 1994-06-03 1997-05-13 Materials Research Corporation Method and apparatus for low temperature deposition of CVD and PECVD films
WO1995034092A1 (en) * 1994-06-03 1995-12-14 Materials Research Corporation A method of nitridization of titanium thin films
US5975912A (en) * 1994-06-03 1999-11-02 Materials Research Corporation Low temperature plasma-enhanced formation of integrated circuits
US5972790A (en) * 1995-06-09 1999-10-26 Tokyo Electron Limited Method for forming salicides
US5780050A (en) 1995-07-20 1998-07-14 Theratech, Inc. Drug delivery compositions for improved stability of steroids
US6002961A (en) * 1995-07-25 1999-12-14 Massachusetts Institute Of Technology Transdermal protein delivery using low-frequency sonophoresis
US6041253A (en) * 1995-12-18 2000-03-21 Massachusetts Institute Of Technology Effect of electric field and ultrasound for transdermal drug delivery
US5947921A (en) * 1995-12-18 1999-09-07 Massachusetts Institute Of Technology Chemical and physical enhancers and ultrasound for transdermal drug delivery
DK1563788T3 (da) 1995-08-29 2015-05-11 Nitto Denko Corp Mikroperforering af human hud til stofindgift og overvågningsformål
JPH09111460A (ja) * 1995-10-11 1997-04-28 Anelva Corp チタン系導電性薄膜の作製方法
US6234990B1 (en) 1996-06-28 2001-05-22 Sontra Medical, Inc. Ultrasound enhancement of transdermal transport
US5908659A (en) * 1997-01-03 1999-06-01 Mosel Vitelic Inc. Method for reducing the reflectivity of a silicide layer
US6432479B2 (en) 1997-12-02 2002-08-13 Applied Materials, Inc. Method for in-situ, post deposition surface passivation of a chemical vapor deposited film
US8287483B2 (en) * 1998-01-08 2012-10-16 Echo Therapeutics, Inc. Method and apparatus for enhancement of transdermal transport
JP2002500075A (ja) 1998-01-08 2002-01-08 ソントラ メディカル， インコーポレイテッド 超音波伝達で増強される経皮輸送
US7066884B2 (en) 1998-01-08 2006-06-27 Sontra Medical, Inc. System, method, and device for non-invasive body fluid sampling and analysis
US6046098A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Process of forming metal silicide interconnects
US20040171980A1 (en) * 1998-12-18 2004-09-02 Sontra Medical, Inc. Method and apparatus for enhancement of transdermal transport
US6821571B2 (en) 1999-06-18 2004-11-23 Applied Materials Inc. Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers
US20030078499A1 (en) 1999-08-12 2003-04-24 Eppstein Jonathan A. Microporation of tissue for delivery of bioactive agents
US6541369B2 (en) 1999-12-07 2003-04-01 Applied Materials, Inc. Method and apparatus for reducing fixed charges in a semiconductor device
US6795727B2 (en) 2001-10-17 2004-09-21 Pedro Giammarusti Devices and methods for promoting transcutaneous movement of substances
US8116860B2 (en) * 2002-03-11 2012-02-14 Altea Therapeutics Corporation Transdermal porator and patch system and method for using same
US9918665B2 (en) 2002-03-11 2018-03-20 Nitto Denko Corporation Transdermal porator and patch system and method for using same
AU2003220143A1 (en) 2002-03-11 2003-09-29 Altea Therapeutics Corporation Transdermal integrated actuator device, methods of making and using same
US8016811B2 (en) 2003-10-24 2011-09-13 Altea Therapeutics Corporation Method for transdermal delivery of permeant substances
US20060094944A1 (en) 2004-10-28 2006-05-04 Sontra Medical Corporation System and method for analyte sampling and analysis with error correction
ES2490595T3 (es) 2005-02-17 2014-09-04 Abbott Laboratories Administración transmucosal de composiciones de fármacos para tratar y prevenir trastornos en animales
US7432069B2 (en) 2005-12-05 2008-10-07 Sontra Medical Corporation Biocompatible chemically crosslinked hydrogels for glucose sensing
KR101433550B1 (ko) 2007-03-07 2014-08-27 에코 테라퓨틱스, 인크. 경피 피분석물 모니터링 시스템 및 피분석물 검출 방법
DE602008005299D1 (de) 2007-04-27 2011-04-14 Echo Therapeutics Inc Hautpermeationsvorrichtung für Analytenmessung oder transdermale Arzneiabgabe
WO2010101626A1 (en) * 2009-03-02 2010-09-10 Seventh Sense Biosystems, Inc. Techniques and devices associated with blood sampling
US9295417B2 (en) 2011-04-29 2016-03-29 Seventh Sense Biosystems, Inc. Systems and methods for collecting fluid from a subject
US9033898B2 (en) 2010-06-23 2015-05-19 Seventh Sense Biosystems, Inc. Sampling devices and methods involving relatively little pain
WO2010101625A2 (en) 2009-03-02 2010-09-10 Seventh Sense Biosystems, Inc. Oxygen sensor
US9041541B2 (en) 2010-01-28 2015-05-26 Seventh Sense Biosystems, Inc. Monitoring or feedback systems and methods
US20120016308A1 (en) 2010-07-16 2012-01-19 Seventh Sense Biosystems, Inc. Low-pressure packaging for fluid devices
US20130158482A1 (en) 2010-07-26 2013-06-20 Seventh Sense Biosystems, Inc. Rapid delivery and/or receiving of fluids
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Citations (2)

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JPS5644765A (en) * 1979-09-20 1981-04-24 Daijietsuto Kogyo Kk Covered hard metal tool
JPS5956574A (ja) * 1982-09-24 1984-04-02 Fujitsu Ltd チタン・シリサイド膜の形成方法

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US3658577A (en) * 1969-10-01 1972-04-25 Gene F Wakefield Vapor phase deposition of silicide refractory coatings
US4180596A (en) * 1977-06-30 1979-12-25 International Business Machines Corporation Method for providing a metal silicide layer on a substrate
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US4239819A (en) * 1978-12-11 1980-12-16 Chemetal Corporation Deposition method and products
JPS584975A (ja) * 1981-06-30 1983-01-12 Fujitsu Ltd 半導体装置の製造方法
US4359490A (en) * 1981-07-13 1982-11-16 Fairchild Camera & Instrument Corp. Method for LPCVD co-deposition of metal and silicon to form metal silicide
JPS57147431A (en) * 1981-10-06 1982-09-11 Semiconductor Energy Lab Co Ltd Plasma gas phase method
DE3211752C2 (de) * 1982-03-30 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum selektiven Abscheiden von aus Siliziden hochschmelzender Metalle bestehenden Schichtstrukturen auf im wesentlichen aus Silizium bestehenden Substraten und deren Verwendung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5644765A (en) * 1979-09-20 1981-04-24 Daijietsuto Kogyo Kk Covered hard metal tool
JPS5956574A (ja) * 1982-09-24 1984-04-02 Fujitsu Ltd チタン・シリサイド膜の形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62267472A (ja) * 1986-05-15 1987-11-20 バリアン・アソシエイツ・インコ−ポレイテッド メタルシリサイドの低圧化学蒸着
US4908548A (en) * 1987-05-09 1990-03-13 Futaba Denshi Kogyo Kabushiki Kaisha Fluorescent display device

Also Published As

Publication number Publication date
FR2554132A1 (fr) 1985-05-03
GB2148946A (en) 1985-06-05
US4557943A (en) 1985-12-10
DE3439853A1 (de) 1985-05-09
NL8403011A (nl) 1985-05-17
GB2148946B (en) 1986-02-26
GB8426071D0 (en) 1984-11-21
FR2554132B1 (fr) 1988-09-23
JPS643949B2 (OSRAM) 1989-01-24

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