JPS6032360B2 - 電導性金属層上にハンダのパタ−ンを形成する方法 - Google Patents
電導性金属層上にハンダのパタ−ンを形成する方法Info
- Publication number
- JPS6032360B2 JPS6032360B2 JP54141147A JP14114779A JPS6032360B2 JP S6032360 B2 JPS6032360 B2 JP S6032360B2 JP 54141147 A JP54141147 A JP 54141147A JP 14114779 A JP14114779 A JP 14114779A JP S6032360 B2 JPS6032360 B2 JP S6032360B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- reaction product
- metal layer
- solder
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 title claims description 21
- 239000002184 metal Substances 0.000 title claims description 21
- 238000000576 coating method Methods 0.000 claims description 48
- 239000011248 coating agent Substances 0.000 claims description 42
- 239000008199 coating composition Substances 0.000 claims description 30
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 18
- 239000007795 chemical reaction product Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- -1 hydroxyalkyl ester Chemical class 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims 1
- 230000001568 sexual effect Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 25
- 239000010949 copper Substances 0.000 description 25
- 239000000976 ink Substances 0.000 description 17
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 238000007650 screen-printing Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 230000003213 activating effect Effects 0.000 description 6
- 239000002518 antifoaming agent Substances 0.000 description 6
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000000454 talc Substances 0.000 description 5
- 229910052623 talc Inorganic materials 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000001056 green pigment Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N ethyl trimethyl methane Natural products CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004063 acid-resistant material Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Chemical class CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7842748 | 1978-11-01 | ||
| GB42748/78 | 1978-11-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5562976A JPS5562976A (en) | 1980-05-12 |
| JPS6032360B2 true JPS6032360B2 (ja) | 1985-07-27 |
Family
ID=10500726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54141147A Expired JPS6032360B2 (ja) | 1978-11-01 | 1979-10-31 | 電導性金属層上にハンダのパタ−ンを形成する方法 |
Country Status (10)
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8103183A (pt) * | 1980-05-27 | 1982-02-09 | Du Pont | Camada foto-sensivel fina;elemento foto-resistor;substrato com uma camada foto-sensivel fina laminada;e processo para aparacao de camada foto-sensivel e de um material polimerico fino |
| JPS62178542A (ja) * | 1986-01-30 | 1987-08-05 | Nippon Kayaku Co Ltd | （メタ）アクリル酸エステル及びコ−テイング又は印刷インキ用反応性化合物 |
| ATE108914T1 (de) * | 1987-03-12 | 1994-08-15 | Siemens Ag | Strahlungsvernetzbares polymersystem zur anwendung als photoresist und dielektrikum für mikroverdrahtungen. |
| CA2055833C (en) * | 1990-11-20 | 2001-04-24 | Katsue Nishikawa | Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same |
| WO2009110503A1 (ja) | 2008-03-05 | 2009-09-11 | 株式会社日本触媒 | 重合体、硬化性樹脂組成物、硬化物、及び物品 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1549956A (enrdf_load_html_response) * | 1967-03-02 | 1968-12-13 | ||
| US3661576A (en) * | 1970-02-09 | 1972-05-09 | Brady Co W H | Photopolymerizable compositions and articles |
| US3876432A (en) * | 1972-09-11 | 1975-04-08 | Sun Chemical Corp | Fatty ester modified epoxy resin photopolymerizable compositions |
| DE2326314C2 (de) * | 1973-05-23 | 1983-10-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Reliefstrukturen |
| JPS5017827A (enrdf_load_html_response) * | 1973-06-18 | 1975-02-25 | ||
| FR2255629B1 (enrdf_load_html_response) * | 1973-12-20 | 1976-10-22 | Ibm | |
| US4072592A (en) * | 1974-05-20 | 1978-02-07 | Mobil Oil Corporation | Radiation curable coating |
| US4003877A (en) * | 1974-05-24 | 1977-01-18 | Dynachem Corporation | Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions |
| DE2534012C3 (de) * | 1975-07-30 | 1981-05-14 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung von Bindemitteln |
| DE2702660C3 (de) * | 1976-01-27 | 1980-07-10 | Ppg Industries, Inc., Pittsburgh, Pa. (V.St.A.) | Durch Strahlung härtbare Überzugsmasse und Verfahren zu ihrer Herstellung |
| JPS52117985A (en) * | 1976-03-30 | 1977-10-03 | Hitachi Chem Co Ltd | Photosensitive polymer composition |
| CA1116919A (en) * | 1976-10-27 | 1982-01-26 | Joseph E. Gervay | Flame retardant radiation sensitive element of photopolymerizable composition containing halogen and an acrylonitrile containing polymeric binder |
-
1979
- 1979-10-29 NO NO793475A patent/NO159729C/no unknown
- 1979-10-31 SE SE7909024A patent/SE445647B/sv not_active IP Right Cessation
- 1979-10-31 JP JP54141147A patent/JPS6032360B2/ja not_active Expired
- 1979-10-31 DE DE19792944097 patent/DE2944097A1/de active Granted
- 1979-10-31 FR FR7927062A patent/FR2440978B1/fr not_active Expired
- 1979-10-31 BR BR7907098A patent/BR7907098A/pt not_active IP Right Cessation
- 1979-10-31 IT IT12796/79A patent/IT1124219B/it active
- 1979-10-31 DK DK460579A patent/DK460579A/da not_active Application Discontinuation
- 1979-11-02 CH CH983779A patent/CH645395A5/de not_active IP Right Cessation
-
1987
- 1987-10-15 HK HK755/87A patent/HK75587A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| SE7909024L (sv) | 1980-05-02 |
| IT7912796A0 (it) | 1979-10-31 |
| DE2944097A1 (de) | 1980-05-14 |
| NO159729C (no) | 1989-02-01 |
| FR2440978B1 (fr) | 1985-07-19 |
| SE445647B (sv) | 1986-07-07 |
| CH645395A5 (en) | 1984-09-28 |
| NO793475L (no) | 1980-05-05 |
| JPS5562976A (en) | 1980-05-12 |
| NO159729B (no) | 1988-10-24 |
| DK460579A (da) | 1980-05-02 |
| FR2440978A1 (fr) | 1980-06-06 |
| DE2944097C2 (enrdf_load_html_response) | 1988-07-28 |
| BR7907098A (pt) | 1980-10-07 |
| IT1124219B (it) | 1986-05-07 |
| HK75587A (en) | 1987-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4390615A (en) | Coating compositions | |
| JP3511146B2 (ja) | 光重合性組成物 | |
| US4786579A (en) | Heat-resistant photosensitive resin composition | |
| JPH04136857A (ja) | 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法およびプリント回路板 | |
| US5990189A (en) | Coating compositions | |
| WO1989007785A1 (en) | Coating compositions | |
| JPH04355450A (ja) | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 | |
| JPS6032360B2 (ja) | 電導性金属層上にハンダのパタ−ンを形成する方法 | |
| GB2032939A (en) | Coating Compositions | |
| JPS61201237A (ja) | 感光性樹脂組成物 | |
| JPH07115048A (ja) | 剥離方法 | |
| JPH0484136A (ja) | パターン形成方法 | |
| JP2003295429A (ja) | 感光性樹脂組成物 | |
| JP3415919B2 (ja) | 感光性樹脂組成物及びこれを用いた感光性エレメント | |
| JPS63310196A (ja) | 金属パターンの形成方法 | |
| WO1991003770A1 (en) | Resists | |
| JPS62159140A (ja) | 感光性樹脂組成物およびそのパタ−ン形成法 | |
| JPS63262893A (ja) | ソルダ−レジストパタ−ンの作製方法 | |
| JPH06506068A (ja) | レジスト形成 | |
| JPH02133417A (ja) | 硬化性組成物 | |
| JP3750755B2 (ja) | 感光性樹脂組成物及びこれを用いた感光性エレメント | |
| GB2318796A (en) | Coating compositions | |
| JPH05313369A (ja) | 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法 | |
| JPH0693540B2 (ja) | プリント回路板の製造方法 | |
| JPH02135350A (ja) | 感光性樹脂組成物 |