FR2440978A1 - Compositions de revetement et procede de formation d'un revetement a partir de ladite composition - Google Patents

Compositions de revetement et procede de formation d'un revetement a partir de ladite composition

Info

Publication number
FR2440978A1
FR2440978A1 FR7927062A FR7927062A FR2440978A1 FR 2440978 A1 FR2440978 A1 FR 2440978A1 FR 7927062 A FR7927062 A FR 7927062A FR 7927062 A FR7927062 A FR 7927062A FR 2440978 A1 FR2440978 A1 FR 2440978A1
Authority
FR
France
Prior art keywords
reaction product
coating
filler
polymerisable
organic solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7927062A
Other languages
English (en)
Other versions
FR2440978B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coates Brothers and Co Ltd
Original Assignee
Coates Brothers and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coates Brothers and Co Ltd filed Critical Coates Brothers and Co Ltd
Publication of FR2440978A1 publication Critical patent/FR2440978A1/fr
Application granted granted Critical
Publication of FR2440978B1 publication Critical patent/FR2440978B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

COMPOSITION DE REVETEMENT POUR LA PRODUCTION DE REVETEMENT PHOTOPOLYMERISABLE SUR DES PANNEAUX DE CIRCUIT DANS LA PRODUCTION DE RESISTS DE SOUDURE. LA COMPOSITION COMPREND UN PRODUIT DE REACTION POLYMERISABLE ETHYLENIQUEMENT INSATURE D'UN POLYEPOXYDE ET D'UN ACIDE CARBOXYLIQUE ETHYLENIQUEMENT INSATURE, CE PRODUIT ETANT SOLIDE OU SEMI-SOLIDE, UNE CHARGE MINERALE INERTE, LA CHARGE ET LE PRODUIT DE REACTION ETANT PRESENTS DANS UN RAPPORT EN POIDS DE 20 A 65PARTIES DE CHARGES POUR 80 A 35PARTIES DU PRODUIT DE REACTION, UN INITIATEUR DE PHOTOPOLYMERISATION POUR LE PRODUIT DE REACTION POLYMERISABLE ET UN SOLVANT ORGANIQUE VOLATIL POUR LE PRODUIT DE REACTION POLYMERISABLE. APPLICATION A LA FABRICATION DE PANNEAUX DE CIRCUITS IMPRIMES.
FR7927062A 1978-11-01 1979-10-31 Compositions de revetement et procede de formation d'un revetement a partir de ladite composition Expired FR2440978B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7842748 1978-11-01

Publications (2)

Publication Number Publication Date
FR2440978A1 true FR2440978A1 (fr) 1980-06-06
FR2440978B1 FR2440978B1 (fr) 1985-07-19

Family

ID=10500726

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7927062A Expired FR2440978B1 (fr) 1978-11-01 1979-10-31 Compositions de revetement et procede de formation d'un revetement a partir de ladite composition

Country Status (10)

Country Link
JP (1) JPS6032360B2 (fr)
BR (1) BR7907098A (fr)
CH (1) CH645395A5 (fr)
DE (1) DE2944097A1 (fr)
DK (1) DK460579A (fr)
FR (1) FR2440978B1 (fr)
HK (1) HK75587A (fr)
IT (1) IT1124219B (fr)
NO (1) NO159729C (fr)
SE (1) SE445647B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281808A2 (fr) * 1987-03-12 1988-09-14 Siemens Aktiengesellschaft Système de polymères réticulables par radiation pour application comme photorésist et diélectrique pour microcomposant

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8103183A (pt) * 1980-05-27 1982-02-09 Du Pont Camada foto-sensivel fina;elemento foto-resistor;substrato com uma camada foto-sensivel fina laminada;e processo para aparacao de camada foto-sensivel e de um material polimerico fino
JPS62178542A (ja) * 1986-01-30 1987-08-05 Nippon Kayaku Co Ltd （メタ）アクリル酸エステル及びコ−テイング又は印刷インキ用反応性化合物
US5281678A (en) * 1990-11-20 1994-01-25 W. R. Grace & Co. Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same
JP4418850B2 (ja) 2008-03-05 2010-02-24 株式会社日本触媒 重合体、硬化性樹脂組成物、硬化物、及び物品

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1549956A (fr) * 1967-03-02 1968-12-13
GB1343482A (en) * 1970-02-09 1974-01-10 Brady Co W H Photopolymerizable compositions and articles
FR2274652A1 (fr) * 1974-05-24 1976-01-09 Dynachem Corp Composition photopolymerisable pour revetement protecteur, notamment pour circuits imprimes
GB1448643A (en) * 1973-12-20 1976-09-08 Ibm Photosensitive materials
FR2339657A1 (fr) * 1976-01-27 1977-08-26 Ppg Industries Inc Composition de revetement durcissable par irradiation
GB1492919A (en) * 1975-07-30 1977-11-23 Bayer Ag Hardenable coating compositions
US4072592A (en) * 1974-05-20 1978-02-07 Mobil Oil Corporation Radiation curable coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3876432A (en) * 1972-09-11 1975-04-08 Sun Chemical Corp Fatty ester modified epoxy resin photopolymerizable compositions
DE2326314C2 (de) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Reliefstrukturen
JPS5017827A (fr) * 1973-06-18 1975-02-25
JPS52117985A (en) * 1976-03-30 1977-10-03 Hitachi Chem Co Ltd Photosensitive polymer composition
CA1116919A (fr) * 1976-10-27 1982-01-26 Joseph E. Gervay Element retardateur de flammes, sensible au rayonnement, constitue d'une matiere photopolymerisable contenant des halogenes et un liant polymerique contenant de l'acrylonitrile

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1549956A (fr) * 1967-03-02 1968-12-13
GB1343482A (en) * 1970-02-09 1974-01-10 Brady Co W H Photopolymerizable compositions and articles
GB1448643A (en) * 1973-12-20 1976-09-08 Ibm Photosensitive materials
US4072592A (en) * 1974-05-20 1978-02-07 Mobil Oil Corporation Radiation curable coating
FR2274652A1 (fr) * 1974-05-24 1976-01-09 Dynachem Corp Composition photopolymerisable pour revetement protecteur, notamment pour circuits imprimes
GB1492919A (en) * 1975-07-30 1977-11-23 Bayer Ag Hardenable coating compositions
FR2339657A1 (fr) * 1976-01-27 1977-08-26 Ppg Industries Inc Composition de revetement durcissable par irradiation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281808A2 (fr) * 1987-03-12 1988-09-14 Siemens Aktiengesellschaft Système de polymères réticulables par radiation pour application comme photorésist et diélectrique pour microcomposant
EP0281808A3 (en) * 1987-03-12 1990-05-16 Siemens Aktiengesellschaft Radiation cross-linkable polymer system for application as photoresist and dielectric for micro wiring

Also Published As

Publication number Publication date
NO159729B (no) 1988-10-24
IT7912796A0 (it) 1979-10-31
NO793475L (no) 1980-05-05
JPS6032360B2 (ja) 1985-07-27
CH645395A5 (en) 1984-09-28
DE2944097A1 (de) 1980-05-14
JPS5562976A (en) 1980-05-12
DK460579A (da) 1980-05-02
DE2944097C2 (fr) 1988-07-28
NO159729C (no) 1989-02-01
FR2440978B1 (fr) 1985-07-19
IT1124219B (it) 1986-05-07
BR7907098A (pt) 1980-10-07
SE7909024L (sv) 1980-05-02
HK75587A (en) 1987-10-23
SE445647B (sv) 1986-07-07

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