JPS5938235A - エポキシ樹脂プリプレグの製造法 - Google Patents

エポキシ樹脂プリプレグの製造法

Info

Publication number
JPS5938235A
JPS5938235A JP15051082A JP15051082A JPS5938235A JP S5938235 A JPS5938235 A JP S5938235A JP 15051082 A JP15051082 A JP 15051082A JP 15051082 A JP15051082 A JP 15051082A JP S5938235 A JPS5938235 A JP S5938235A
Authority
JP
Japan
Prior art keywords
epoxy resin
prepreg
imidazole
dicyandiamide
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15051082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6338053B2 (enrdf_load_stackoverflow
Inventor
Toyotarou Shinkou
信耕 豊太郎
Shunya Yokozawa
横沢 舜哉
Tatsuya Oda
達也 小田
Yutaka Mizuno
裕 水野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP15051082A priority Critical patent/JPS5938235A/ja
Publication of JPS5938235A publication Critical patent/JPS5938235A/ja
Publication of JPS6338053B2 publication Critical patent/JPS6338053B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP15051082A 1982-08-30 1982-08-30 エポキシ樹脂プリプレグの製造法 Granted JPS5938235A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15051082A JPS5938235A (ja) 1982-08-30 1982-08-30 エポキシ樹脂プリプレグの製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15051082A JPS5938235A (ja) 1982-08-30 1982-08-30 エポキシ樹脂プリプレグの製造法

Publications (2)

Publication Number Publication Date
JPS5938235A true JPS5938235A (ja) 1984-03-02
JPS6338053B2 JPS6338053B2 (enrdf_load_stackoverflow) 1988-07-28

Family

ID=15498435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15051082A Granted JPS5938235A (ja) 1982-08-30 1982-08-30 エポキシ樹脂プリプレグの製造法

Country Status (1)

Country Link
JP (1) JPS5938235A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206088A (ja) * 1984-03-29 1985-10-17 日立化成工業株式会社 多層銅張積層板の製造法
JPS61287966A (ja) * 1985-06-15 1986-12-18 Matsushita Electric Works Ltd エポキシ樹脂ワニス
JPS62285958A (ja) * 1986-06-03 1987-12-11 Matsushita Electric Works Ltd エポキシ樹脂ワニス
WO2002048236A1 (en) * 2000-12-14 2002-06-20 Hitachi Chemical Co., Ltd. Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0665857U (ja) * 1993-02-26 1994-09-16 飯島電子工業株式会社 酸素センサ

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60206088A (ja) * 1984-03-29 1985-10-17 日立化成工業株式会社 多層銅張積層板の製造法
JPS61287966A (ja) * 1985-06-15 1986-12-18 Matsushita Electric Works Ltd エポキシ樹脂ワニス
JPS62285958A (ja) * 1986-06-03 1987-12-11 Matsushita Electric Works Ltd エポキシ樹脂ワニス
WO2002048236A1 (en) * 2000-12-14 2002-06-20 Hitachi Chemical Co., Ltd. Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
EP1359175A4 (en) * 2000-12-14 2005-10-19 Hitachi Chemical Co Ltd PAINT FOR LAMINATE OR PREPREG, LAMINATE OR PREPREG RECYCLED THROUGH THIS LACQUER, AND LAMINATE MANUFACTURED BY THIS LAMINATE OR PREPREG
US7041399B2 (en) 2000-12-14 2006-05-09 Hitachi Chemical Co., Ltd. Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
US7390571B2 (en) 2000-12-14 2008-06-24 Hitachi Chemical Co., Ltd. Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg
JP2008163329A (ja) * 2000-12-14 2008-07-17 Hitachi Chem Co Ltd 積層板またはプリプレグ用ワニス、このワニスから得られる積層板またはプリプレグ、およびこの積層板またはプリプレグを用いたプリント配線板

Also Published As

Publication number Publication date
JPS6338053B2 (enrdf_load_stackoverflow) 1988-07-28

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