JPS59227195A - 半導体および同様な電子デバイスの取り扱いのための方法および装置 - Google Patents

半導体および同様な電子デバイスの取り扱いのための方法および装置

Info

Publication number
JPS59227195A
JPS59227195A JP59103791A JP10379184A JPS59227195A JP S59227195 A JPS59227195 A JP S59227195A JP 59103791 A JP59103791 A JP 59103791A JP 10379184 A JP10379184 A JP 10379184A JP S59227195 A JPS59227195 A JP S59227195A
Authority
JP
Japan
Prior art keywords
sheet
carrier
chip
base member
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59103791A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241907B2 (https=
Inventor
ヴイクタ−・エドワ−ド・オルソ−ス
ブル−ス・ジエイ・ベンジヤミン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BIKEMU CORP
Original Assignee
BIKEMU CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BIKEMU CORP filed Critical BIKEMU CORP
Publication of JPS59227195A publication Critical patent/JPS59227195A/ja
Publication of JPH0241907B2 publication Critical patent/JPH0241907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP59103791A 1983-05-24 1984-05-24 半導体および同様な電子デバイスの取り扱いのための方法および装置 Granted JPS59227195A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US497430 1983-05-24
US06/497,430 US4778326A (en) 1983-05-24 1983-05-24 Method and means for handling semiconductor and similar electronic devices

Publications (2)

Publication Number Publication Date
JPS59227195A true JPS59227195A (ja) 1984-12-20
JPH0241907B2 JPH0241907B2 (https=) 1990-09-19

Family

ID=23976838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59103791A Granted JPS59227195A (ja) 1983-05-24 1984-05-24 半導体および同様な電子デバイスの取り扱いのための方法および装置

Country Status (2)

Country Link
US (1) US4778326A (https=)
JP (1) JPS59227195A (https=)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006087894A1 (ja) 2005-02-03 2006-08-24 Shin-Etsu Polymer Co., Ltd. 固定キャリア、固定キャリアの製造方法、固定キャリアの使用方法、及び基板収納容器
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法
JP2006319012A (ja) * 2005-05-11 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法
JP2007073802A (ja) * 2005-09-08 2007-03-22 Shin Etsu Polymer Co Ltd 部品保持具
JP2007123651A (ja) * 2005-10-31 2007-05-17 Shin Etsu Polymer Co Ltd 半導体検査用キャリア及び半導体の検査方法
JP2007129032A (ja) * 2005-11-02 2007-05-24 Shin Etsu Polymer Co Ltd 半導体ウェーハの処理用治具及び半導体ウェーハの処理方法
JP2007134391A (ja) * 2005-11-08 2007-05-31 Shin Etsu Polymer Co Ltd 保持治具
JP2007201173A (ja) * 2006-01-26 2007-08-09 Shin Etsu Polymer Co Ltd 吸着治具
JP2007220935A (ja) * 2006-02-17 2007-08-30 Shin Etsu Polymer Co Ltd 固定キャリア
JP2007250790A (ja) * 2006-03-15 2007-09-27 Shin Etsu Polymer Co Ltd 半導体チップの製造方法
JP2007250789A (ja) * 2006-03-15 2007-09-27 Shin Etsu Polymer Co Ltd 半導体ウエハの保護構造およびこれを用いた半導体ウエハの研削方法
JP2008103494A (ja) * 2006-10-18 2008-05-01 Lintec Corp 固定ジグおよびチップのピックアップ方法並びにピックアップ装置
JP2008103493A (ja) * 2006-10-18 2008-05-01 Lintec Corp チップのピックアップ方法及びピックアップ装置
JP2010010205A (ja) * 2008-06-24 2010-01-14 Shin Etsu Polymer Co Ltd トレー治具
JP2010013189A (ja) * 2009-08-25 2010-01-21 Mitsubishi Electric Corp 半導体素子用トレイ
JP2011159936A (ja) * 2010-02-04 2011-08-18 Shin Etsu Polymer Co Ltd 基板保持具及びその製造方法
JP2013105779A (ja) * 2011-11-10 2013-05-30 Shin Etsu Polymer Co Ltd マニュピレータ用粘着トレイ

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JP2006505457A (ja) * 2002-09-11 2006-02-16 エンテグリス・インコーポレーテッド 粘着性表面を有するキャリア
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JP2004311576A (ja) * 2003-04-03 2004-11-04 Toshiba Corp 半導体装置の製造方法
JP4405211B2 (ja) * 2003-09-08 2010-01-27 パナソニック株式会社 半導体チップの剥離装置、剥離方法、及び半導体チップの供給装置
US20050221722A1 (en) * 2004-03-31 2005-10-06 Cheong Yew W Wafer grinding using an adhesive gel material
CN100428402C (zh) * 2004-04-13 2008-10-22 优利讯国际贸易有限责任公司 从箔片分离半导体芯片的方法和用于安装半导体芯片的设备
EP1587138B1 (de) * 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Einrichtung für die Montage von Halbleiterchips und Verfahren zum Ablösen eines Halbleiterchips von einer Folie
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DE102006026331B4 (de) * 2006-06-02 2019-09-26 Erich Thallner Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit
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JP4947631B2 (ja) * 2006-07-19 2012-06-06 ミライアル株式会社 クッションシート付ウエハ収納容器
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JP5196838B2 (ja) * 2007-04-17 2013-05-15 リンテック株式会社 接着剤付きチップの製造方法
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CN110364539B (zh) * 2018-03-26 2021-09-10 北京齐碳科技有限公司 一种可分离式导电接触结构及其制备方法
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Cited By (17)

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WO2006087894A1 (ja) 2005-02-03 2006-08-24 Shin-Etsu Polymer Co., Ltd. 固定キャリア、固定キャリアの製造方法、固定キャリアの使用方法、及び基板収納容器
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法
JP2006319012A (ja) * 2005-05-11 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法
JP2007073802A (ja) * 2005-09-08 2007-03-22 Shin Etsu Polymer Co Ltd 部品保持具
JP2007123651A (ja) * 2005-10-31 2007-05-17 Shin Etsu Polymer Co Ltd 半導体検査用キャリア及び半導体の検査方法
JP2007129032A (ja) * 2005-11-02 2007-05-24 Shin Etsu Polymer Co Ltd 半導体ウェーハの処理用治具及び半導体ウェーハの処理方法
JP2007134391A (ja) * 2005-11-08 2007-05-31 Shin Etsu Polymer Co Ltd 保持治具
JP2007201173A (ja) * 2006-01-26 2007-08-09 Shin Etsu Polymer Co Ltd 吸着治具
JP2007220935A (ja) * 2006-02-17 2007-08-30 Shin Etsu Polymer Co Ltd 固定キャリア
JP2007250790A (ja) * 2006-03-15 2007-09-27 Shin Etsu Polymer Co Ltd 半導体チップの製造方法
JP2007250789A (ja) * 2006-03-15 2007-09-27 Shin Etsu Polymer Co Ltd 半導体ウエハの保護構造およびこれを用いた半導体ウエハの研削方法
JP2008103494A (ja) * 2006-10-18 2008-05-01 Lintec Corp 固定ジグおよびチップのピックアップ方法並びにピックアップ装置
JP2008103493A (ja) * 2006-10-18 2008-05-01 Lintec Corp チップのピックアップ方法及びピックアップ装置
JP2010010205A (ja) * 2008-06-24 2010-01-14 Shin Etsu Polymer Co Ltd トレー治具
JP2010013189A (ja) * 2009-08-25 2010-01-21 Mitsubishi Electric Corp 半導体素子用トレイ
JP2011159936A (ja) * 2010-02-04 2011-08-18 Shin Etsu Polymer Co Ltd 基板保持具及びその製造方法
JP2013105779A (ja) * 2011-11-10 2013-05-30 Shin Etsu Polymer Co Ltd マニュピレータ用粘着トレイ

Also Published As

Publication number Publication date
US4778326A (en) 1988-10-18
JPH0241907B2 (https=) 1990-09-19

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