JPH0241907B2 - - Google Patents

Info

Publication number
JPH0241907B2
JPH0241907B2 JP59103791A JP10379184A JPH0241907B2 JP H0241907 B2 JPH0241907 B2 JP H0241907B2 JP 59103791 A JP59103791 A JP 59103791A JP 10379184 A JP10379184 A JP 10379184A JP H0241907 B2 JPH0241907 B2 JP H0241907B2
Authority
JP
Japan
Prior art keywords
sheet
carrier
flexible sheet
base member
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59103791A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59227195A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS59227195A publication Critical patent/JPS59227195A/ja
Publication of JPH0241907B2 publication Critical patent/JPH0241907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP59103791A 1983-05-24 1984-05-24 半導体および同様な電子デバイスの取り扱いのための方法および装置 Granted JPS59227195A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US497430 1983-05-24
US06/497,430 US4778326A (en) 1983-05-24 1983-05-24 Method and means for handling semiconductor and similar electronic devices

Publications (2)

Publication Number Publication Date
JPS59227195A JPS59227195A (ja) 1984-12-20
JPH0241907B2 true JPH0241907B2 (https=) 1990-09-19

Family

ID=23976838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59103791A Granted JPS59227195A (ja) 1983-05-24 1984-05-24 半導体および同様な電子デバイスの取り扱いのための方法および装置

Country Status (2)

Country Link
US (1) US4778326A (https=)
JP (1) JPS59227195A (https=)

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JP3357237B2 (ja) * 1996-02-17 2002-12-16 株式会社リコー テスティングマシン
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JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
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JP4405211B2 (ja) * 2003-09-08 2010-01-27 パナソニック株式会社 半導体チップの剥離装置、剥離方法、及び半導体チップの供給装置
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JP4484760B2 (ja) * 2005-05-10 2010-06-16 信越ポリマー株式会社 固定キャリア及びその製造方法
JP4693488B2 (ja) * 2005-05-11 2011-06-01 信越ポリマー株式会社 固定キャリア
JP4671817B2 (ja) * 2005-09-08 2011-04-20 信越ポリマー株式会社 部品保持具
JP4675212B2 (ja) * 2005-10-31 2011-04-20 信越ポリマー株式会社 半導体検査用キャリア及び半導体の検査方法
JP4942329B2 (ja) * 2005-11-02 2012-05-30 信越ポリマー株式会社 半導体ウェーハの処理用治具及び半導体ウェーハの処理方法
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JP5196838B2 (ja) * 2007-04-17 2013-05-15 リンテック株式会社 接着剤付きチップの製造方法
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Also Published As

Publication number Publication date
JPS59227195A (ja) 1984-12-20
US4778326A (en) 1988-10-18

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